Factory Lead Time
6 Weeks
Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
8-SOIC (0.154, 3.90mm Width)
Number of Pins
Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.
8
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-40°C~85°C TA
Packaging
Tape & Reel (TR)
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Active
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
1 (Unlimited)
Terminal Finish
Matte Tin (Sn) - annealed
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
CMOS
Voltage - Supply
1.7V~5.5V
Peak Reflow Temperature (Cel)
260
Supply Voltage
Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.
5V
Reflow Temperature-Max (s)
40
Qualification Status
Not Qualified
Operating Supply Voltage
5V
Supply Voltage-Min (Vsup)
1.7V
Interface
In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them.
An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.
I2C, Serial
Nominal Supply Current
3mA
Memory Type
Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.
Non-Volatile
Operating Mode
SYNCHRONOUS
Clock Frequency
Clock Frequency, measured in Hertz (Hz), is the rate at which an electronic component, such as a microprocessor or oscillator, generates electrical pulses. It determines the speed at which the component can process data and execute instructions. A higher clock frequency generally indicates faster performance, but also higher power consumption and heat generation. Clock Frequency is a crucial parameter for timing-sensitive applications, such as digital signal processing and real-time systems.
400kHz
Access Time
Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.
900ns
Memory Format
Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.
EEPROM
Write Cycle Time - Word, Page
5ms
Standby Current-Max
0.000001A
Endurance
1000000 Write/Erase Cycles
Write Cycle Time-Max (tWC)
5ms
Data Retention Time-Min
200
Write Protection
HARDWARE
I2C Control Byte
1010DDDR
Height Seated (Max)
1.75mm
Length
Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.
4.9mm
RoHS Status
ROHS3 Compliant
Description
The Microchip Technology Inc. 24AA64F/24LC64F/24FC64F (24XX64F) is a 64 Kbit Electrically Erasable PROM. The device is organized as a single block of 8K x 8-bit memory with a 2-wire serial interface. Low-voltage design permits operation down to 1.7V, with standby and read currents of only 1μA and 400μA, respectively. It has been developed for advanced, low-power applications such as personal communications or data acquisition. The 24XX64F also has a page write capability for up to 32 bytes of data. Functional address lines allow up to eight devices on the same bus, for up to 512 Kbits address space. The 24XX64F is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP, TDFN and MSOP packages. The 24XX64F is also available in the 5-lead SOT-23 package.
Features
Single-Supply with Operation down to 1.7V for 24AA64F/24FC64F Devices, 2.5V for 24LC64F Devices
Low-Power CMOS Technology:
Read current 400 μA, max.
Standby current 1 μA, max. (I-temp)
2-Wire Serial Interface, I²CTM Compatible
Packages with Three Address Pins are Cascadable up to Eight Devices
Schmitt Trigger Inputs for Noise Suppression
Output Slope Control to Eliminate Ground Bounce
100 kHz and 400 kHz Clock Compatibility. 1 MHz Clock for FC Versions
Page Write Time 5 ms, typical
Self-timed Erase/Write Cycle
32-Byte Page Write Buffer
Hardware Write-Protect for 1/4 Array (1800h-1FFFh)
ESD Protection > 4,000V
More than One Million Erase/Write Cycles
Data Retention > 200 Years
Factory Programming Available
Packages include 8-Lead PDIP, SOIC, TSSOP. MSOP, TDFN, 5-Lead SOT-23
Pb-Free and RoHS Compliant
Temperature Ranges:
Industrial (1): -40°C to 85°C
Automotive (E): -40°C to 125°C
Applications
Personal communications
Data acquisition
Advanced, low-power applications
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Image
Part Number
Manufacturer
Factory Lead Time
Contact Plating
Mount
Mounting Type
Package / Case
Number of Pins
Operating Temperature
Packaging
Published
JESD-609 Code
Pbfree Code
Part Status
Moisture Sensitivity Level (MSL)
Number of Terminations
ECCN Code
Terminal Finish
Technology
Voltage - Supply
Terminal Position
Peak Reflow Temperature (Cel)
Number of Functions
Supply Voltage
Terminal Pitch
Reflow Temperature-Max (s)
Base Part Number
Pin Count
Qualification Status
Operating Supply Voltage
Supply Voltage-Min (Vsup)
Interface
Memory Size
Nominal Supply Current
Memory Type
Operating Mode
Clock Frequency
Access Time
Memory Format
Memory Interface
Memory Width
Write Cycle Time - Word, Page
Density
Standby Current-Max
Serial Bus Type
Endurance
Write Cycle Time-Max (tWC)
Data Retention Time-Min
Write Protection
I2C Control Byte
Height Seated (Max)
Length
Width
RoHS Status
Supplier Device Package
View Compare
-
24AA64FT-I/SN
6 Weeks
Gold
Surface Mount
Surface Mount
8-SOIC (0.154, 3.90mm Width)
8
-40°C~85°C TA
Tape & Reel (TR)
2009
e3
yes
Active
1 (Unlimited)
8
EAR99
Matte Tin (Sn) - annealed
CMOS
1.7V~5.5V
DUAL
260
1
5V
1.27mm
40
24AA64F
8
Not Qualified
5V
1.7V
I2C, Serial
64Kb 8K x 8
3mA
Non-Volatile
SYNCHRONOUS
400kHz
900ns
EEPROM
I2C
8
5ms
64 kb
0.000001A
I2C
1000000 Write/Erase Cycles
5ms
200
HARDWARE
1010DDDR
1.75mm
4.9mm
3.9mm
ROHS3 Compliant
-
-
-
-
-
-
Surface Mount
Die
-
0°C~70°C TA
Tray
2009
-
-
Active
1 (Unlimited)
-
-
-
EEPROM
1.7V~5.5V
-
-
-
-
-
-
24AA01
-
-
-
-
-
1Kb 128 x 8
-
Non-Volatile
-
400kHz
3500ns
EEPROM
I2C
-
5ms
-
-
-
-
-
-
-
-
-
-
-
ROHS3 Compliant
Die
-
-
-
-
Surface Mount
Die
-
-40°C~85°C TA
Tray
-
-
-
Active
1 (Unlimited)
-
-
-
EEPROM
1.7V~5.5V
-
-
-
-
-
-
24AA01H
-
-
-
-
-
1Kb 128 x 8
-
Non-Volatile
-
400kHz
900ns
EEPROM
I2C
-
5ms
-
-
-
-
-
-
-
-
-
-
-
ROHS3 Compliant
Die