Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
132-BQFP Bumpered
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
0°C~70°C
Series
Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.
72V
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
3 (168 Hours)
Function
Function refers to the primary purpose or role of an electronic component within a circuit. It describes the specific task or operation that the component is designed to perform. For example, a resistor's function is to limit current flow, a capacitor's function is to store electrical energy, and a transistor's function is to amplify or switch signals. Understanding the function of a component is crucial for selecting the appropriate component for a particular application and ensuring its proper operation within the circuit.
Synchronous
Memory Size
576K 8K x 36 x 2
Access Time
Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.
10ns
Data Rate
Data rate, measured in bits per second (bps), is the rate at which data is transferred from one device to another. It is a measure of the speed of data transmission and is influenced by factors such as the bandwidth of the communication channel and the efficiency of the data encoding scheme. A higher data rate indicates faster data transfer, allowing for the transmission of more data in a given amount of time.
66.7MHz
Bus Directional
Bi-Directional
Programmable Flags Support
Yes
RoHS Status
Non-RoHS Compliant
Description
The IDT72V3672 is a pin and functionally compatible version of the IDT723672, designed to run off a 3.3V supply for exceptionally low-power consumption. These devices are monolithic, high-speed, low-power, CMOS Bidirectional SyncFIFO (clocked) memories which support clock frequencies up to 100MHz.
Features
Memory storage capacity: 8,192 x 36 x 2
Supports clock frequencies up to 100MHz
Fast access times of 6.5ns
Free-running CLKA and CLKB may be asynchronous or coincident (simultaneous reading and writing of data on a single clock edge is permitted)
Two independent clocked FIFOs buffering data in opposite directions
Mailbox bypass register for each FIFO
Programmable Almost-Full and Almost-Empty flags
Microprocessor Interface Control Logic
Select IDT Standard timing (using EFA, EFB, FFA and FFB flags functions) or First Word Fall Through timing (using ORA, ORB, IRA and IRB flag functions)
Available in space-saving 120-pin Thin Quad Flatpack (TQFP)
Pin and functionally compatible versions of the 5V operating IDT23672
Pin compatible to the lower density parts, IDT72V3642
Industrial temperature range (-40°C to 85°C) is available
Green parts available
Applications
High-speed data buffering
Data synchronization
Flow control
FIFO buffering
Mailbox applications
Microprocessor interfacing
Telecommunications
Networking
Industrial control