Microchip Technology 93LC56AT-I/SN

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93LC56AT-I/SN

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Description:
IC EEPROM 2KBIT 2MHZ 8SOIC

RoHS Status:

RoHS

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Total Price: $0.35

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Specifications

Product Details

Product Comparison

Factory Lead Time
6 Weeks
Contact Plating
Tin
Mount
Surface Mount
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

8-SOIC (0.154, 3.90mm Width)
Number of Pins

Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

8
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-40°C~85°C TA
Packaging
Tape & Reel (TR)
Published
2005
JESD-609 Code
e3
Pbfree Code
yes
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Active
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Additional Feature
1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

CMOS
Voltage - Supply
2.5V~5.5V
Terminal Position
DUAL
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

5V
Terminal Pitch
1.27mm
Reflow Temperature-Max (s)
40
Base Part Number
93LC56A
Pin Count
8
Supply Voltage-Max (Vsup)
5.5V
Power Supplies
3/5V
Supply Voltage-Min (Vsup)
2.5V
Interface

In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

Serial
Memory Size
2Kb 256 x 8
Nominal Supply Current
2mA
Memory Type

Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

Non-Volatile
Clock Frequency

Clock Frequency, measured in Hertz (Hz), is the rate at which an electronic component, such as a microprocessor or oscillator, generates electrical pulses. It determines the speed at which the component can process data and execute instructions. A higher clock frequency generally indicates faster performance, but also higher power consumption and heat generation. Clock Frequency is a crucial parameter for timing-sensitive applications, such as digital signal processing and real-time systems.

2MHz
Access Time

Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.

250 ns
Memory Format

Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.

EEPROM
Memory Interface
SPI
Memory Width
8
Write Cycle Time - Word, Page
6ms
Density
2 kb
Standby Current-Max
0.000001A
Serial Bus Type
MICROWIRE
Endurance
1000000 Write/Erase Cycles
Write Cycle Time-Max (tWC)
6ms
Data Retention Time-Min
200
Write Protection
SOFTWARE
Height Seated (Max)
1.75mm
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

4.9mm
Width
3.9mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Description
The Microchip Technology Inc. 93XX56A/B/C devices are 2Kbit low-voltage serial Electrically Erasable PROMS (EEPROM). Word-selectable devices such as the 93AA56C, 93LC56C, or 93C56C are dependent upon external logic levels driving the ORG pin to set word size. For dedicated 8-bit communication, the 93XX56A devices are available, while the 93XX568 devices provide dedicated 16-bit communication.
Advanced CMOS technology makes these devices ideal for low-power, nonvolatile memory applications. The entire 93XX Series is available in standard packages including 8-lead PDIP and SOIC, and advanced packaging including 8-lead MSOP, 6-lead SOT-23, 8-lead 2x3 DFN/TDFN, and 8-lead TSSOP. All packages are Pb-free (Matte Tin) finish.

Features
Low-Power CMOS Technology
ORG Pin to Select Word Size for '56C' Version
256 x 8-bit Organization 'A' Version (no ORG)
128 x 16-bit Organization 'B' Version (no ORG)
Self-Timed Erase/Write Cycles (including Auto-Erase)
Automatic Erase All (ERAL) before Write All (WRAL)
Power-On/Off Data Protection Circuitry
Industry Standard 3-Wire Serial I/O
Device Status Signal (Ready/Busy)
Sequential Read Function
1,000,000 Erase/write Cycles
Data Retention > 200 Years
Pb-free and RoHS Compliant
Temperature Ranges Supported:
Industrial (1) -40°C to 85°C
Automotive (E) -40°C to 125°C

Applications
Nonvolatile memory applications
Low-power applications
Industrial applications
Automotive applications
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    Published
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Additional Feature
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Interface
    Memory Size
    Nominal Supply Current
    Memory Type
    Clock Frequency
    Access Time
    Memory Format
    Memory Interface
    Memory Width
    Write Cycle Time - Word, Page
    Density
    Standby Current-Max
    Serial Bus Type
    Endurance
    Write Cycle Time-Max (tWC)
    Data Retention Time-Min
    Write Protection
    Height Seated (Max)
    Length
    Width
    Radiation Hardening
    RoHS Status
    Lead Free
    Surface Mount
    Terminal Finish
    HTS Code
    Reach Compliance Code
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Qualification Status
    Operating Mode
    Organization
    Memory Density
    Parallel/Serial
    View Compare
  • 93LC56AT-I/SN
    93LC56AT-I/SN
    6 Weeks
    Tin
    Surface Mount
    Surface Mount
    8-SOIC (0.154, 3.90mm Width)
    8
    -40°C~85°C TA
    Tape & Reel (TR)
    2005
    e3
    yes
    Active
    1 (Unlimited)
    8
    EAR99
    1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS
    CMOS
    2.5V~5.5V
    DUAL
    260
    1
    5V
    1.27mm
    40
    93LC56A
    8
    5.5V
    3/5V
    2.5V
    Serial
    2Kb 256 x 8
    2mA
    Non-Volatile
    2MHz
    250 ns
    EEPROM
    SPI
    8
    6ms
    2 kb
    0.000001A
    MICROWIRE
    1000000 Write/Erase Cycles
    6ms
    200
    SOFTWARE
    1.75mm
    4.9mm
    3.9mm
    No
    ROHS3 Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • S-93L56AR0I-J8T1U
    20 Weeks
    -
    -
    Surface Mount
    8-SOIC (0.154, 3.90mm Width)
    -
    -40°C~85°C TA
    Tape & Reel (TR)
    -
    e3
    -
    Active
    1 (Unlimited)
    8
    EAR99
    100 YEAR DATA RETENTION
    CMOS
    1.6V~5.5V
    DUAL
    NOT SPECIFIED
    1
    5V
    1.27mm
    -
    -
    8
    5.5V
    -
    1.6V
    -
    2Kb 128 x 16
    -
    Non-Volatile
    2MHz
    -
    EEPROM
    SPI
    16
    8ms
    -
    -
    MICROWIRE
    -
    8ms
    -
    -
    1.75mm
    5.02mm
    3.9mm
    -
    RoHS Compliant
    -
    YES
    Tin (Sn)
    8542.32.00.51
    compliant
    NOT SPECIFIED
    R-PDSO-G8
    Not Qualified
    SYNCHRONOUS
    128X16
    2048 bit
    SERIAL
  • S-93L56AD0I-I8T1U
    20 Weeks
    -
    -
    Surface Mount
    8-SMD, Flat Lead
    -
    -40°C~85°C TA
    Tape & Reel (TR)
    -
    e3
    -
    Active
    1 (Unlimited)
    8
    EAR99
    100 YEAR DATA RETENTION
    CMOS
    1.6V~5.5V
    DUAL
    NOT SPECIFIED
    1
    5V
    0.5mm
    -
    -
    8
    5.5V
    -
    1.6V
    -
    2Kb 128 x 16
    -
    Non-Volatile
    2MHz
    -
    EEPROM
    SPI
    16
    8ms
    -
    -
    MICROWIRE
    -
    8ms
    -
    -
    0.5mm
    2.23mm
    1.97mm
    -
    RoHS Compliant
    -
    YES
    Tin (Sn)
    8542.32.00.51
    compliant
    NOT SPECIFIED
    R-PDSO-F8
    Not Qualified
    SYNCHRONOUS
    128X16
    2048 bit
    SERIAL

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