Microsemi Corporation A54SX08-1VQG100

Mfr.Part #:

A54SX08-1VQG100

Manufacturer:

Description:
IC FPGA 81 I/O 100VQFP

RoHS Status:

RoHS

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Specifications

Product Details

Product Comparison

Mount
Surface Mount
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

100-TQFP
Number of Pins

Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

100
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

0°C~70°C TA
Packaging
Tray
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

SX
Published
2006
JESD-609 Code
e3
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Obsolete
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

3 (168 Hours)
Number of Terminations
100
Terminal Finish
MATTE TIN
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

CMOS
Voltage - Supply
3V~3.6V 4.75V~5.25V
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

3.3V
Terminal Pitch
0.5mm
Frequency

Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

280MHz
Time@Peak Reflow Temperature-Max (s)
40
Base Part Number
A54SX08
Operating Supply Voltage
5V
Number of I/O
81
Propagation Delay
800 ps
Turn On Delay Time
800 ps
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
768
Number of Gates
12000
Speed Grade
1
Number of Registers
256
Combinatorial Delay of a CLB-Max
0.8 ns
Number of CLBs
768
Number of Equivalent Gates
8000
Height

Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.

1mm
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

14mm
Width
14mm
Radiation Hardening
No
RoHS Status
RoHS Compliant
Description
Actel® SX Family FPGAs offer leading-edge performance with 320 MHz internal performance, 3.7 ns clock-to-out (pin-to-pin), 0.1 ns input setup, and 0.25 ns clock skew.
Capacities range from 12,000 to 48,000 system gates, with up to 249 user-programmable I/O pins and 1,080 flip-flops.
Features 0.35 μ CMOS technology for low power consumption.

Features
Integrates 66 MHz PCI CPLD and FPGA for a single-chip solution.
Achieves 100% resource utilization with 100% pin locking.
Supports both 3.3 V and 5.0 V operation with 5.0 V input tolerance.
Provides deterministic, user-controllable timing.
Offers unique in-system diagnostic and debug capability with Silicon Explorer II.
Complies with IEEE Standard 1149.1 (JTAG) for boundary scan testing.
Employs secure programming technology to prevent reverse engineering and design theft.

Applications
High-performance computing
Networking and communications
Industrial automation
Medical imaging
Consumer electronics
No Product Comparison

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