Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
64-VFQFN Exposed Pad, CSP
Number of Pins
Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.
64
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-40°C~85°C
Packaging
Tape & Reel (TR)
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
3 (168 Hours)
Number of Terminations
64
Max Power Dissipation
21mW
Supply Voltage
Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.
5V
Output Type
Output type refers to the type of signal or power that an electronic component can produce. It can be analog or digital, AC or DC, and can vary in voltage, current, or power levels. The output type is determined by the component's design and is crucial for matching it with other components in a circuit. Understanding the output type ensures proper signal processing, power delivery, and overall system functionality.
Voltage - Buffered
Operating Supply Voltage
3V
Polarity
Polarity refers to the direction of current flow through an electronic component. It is typically indicated by a plus (+) or minus (-) sign on the component's body. Components with polarity must be connected correctly in a circuit to function properly. For example, a diode will only allow current to flow in one direction, from the positive terminal to the negative terminal. If a diode is connected backwards, it will not conduct current.
Unipolar
Interface
In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them.
An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.
I2C, SPI, Serial
Supply Current-Max
0.475mA
Architecture
Architecture refers to the internal design and organization of an electronic component. It encompasses the arrangement of functional blocks, their interconnections, and the overall data flow within the component. The architecture determines the component's performance characteristics, such as speed, power consumption, and functionality. It also influences the component's size, cost, and reliability.
String DAC
Converter Type
Converter Type refers to the type of conversion performed by an electronic component, such as an analog-to-digital converter (ADC) or a digital-to-analog converter (DAC). It specifies the input and output signal types that the converter can handle.
D/A CONVERTER
Reference Type
Reference type is a parameter that specifies the type of reference used in an electronic component. It can be either a voltage reference or a current reference. A voltage reference provides a stable voltage output, while a current reference provides a stable current output. The type of reference used depends on the application. For example, a voltage reference is used in a voltage regulator to provide a stable voltage output, while a current reference is used in a current source to provide a stable current output.
External, Internal
Data Interface
Data Interface refers to the physical and logical means by which an electronic component communicates with other components or systems. It defines the protocols, pinouts, and signal characteristics used for data exchange. The Data Interface parameter specifies the type of interface supported by the component, such as SPI, I2C, UART, or Ethernet. It ensures compatibility and proper communication between different devices within a system.
I2C, SPI, DSP
Differential Output
Differential Output is a parameter that describes the output signal of an electronic component. It refers to the difference in voltage or current between two output terminals. Differential outputs are commonly used in high-speed circuits and applications where noise immunity is important. By transmitting the signal as a differential pair, the common-mode noise is canceled out, resulting in a more robust and reliable signal.
No
Sampling Rate
Sampling rate refers to the number of times per second that an analog signal is measured and converted into a digital signal. It is expressed in Hertz (Hz) and determines the maximum frequency that can be accurately represented in the digital signal. A higher sampling rate results in a more accurate representation of the analog signal, but also increases the amount of data that needs to be processed. The sampling rate must be at least twice the highest frequency component of the analog signal to avoid aliasing, where high-frequency components are incorrectly represented as lower-frequency components.
400 ksps
Voltage - Supply, Analog
2.7V~3.6V
Voltage - Supply, Digital
2.7V~5.5V
Linearity Error-Max (EL)
0.0244%
Integral Nonlinearity (INL)
4 LSB
Number of Converters
Number of Converters refers to the quantity of analog-to-digital converters (ADCs) or digital-to-analog converters (DACs) present in an electronic component. ADCs convert analog signals into digital form, while DACs perform the reverse operation. The number of converters determines the component's ability to handle multiple analog or digital signals simultaneously. A higher number of converters allows for increased data acquisition or signal generation capabilities.
16
INL/DNL (LSB)
±4 (Max), -1/ 2 (Max)
Analog Output Voltage-Max
5.5V
Length
Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.
9mm
RoHS Status
ROHS3 Compliant
Description
The AD5390/AD5391/AD5392 are 16-/8-channel, 14-/12-bit voltage output digital-to-analog converters (DACs) with a guaranteed monotonic performance over temperature. The devices feature an on-chip 1.25 V/2.5 V, 10 ppm/°C reference, a rail-to-rail output amplifier, and a power-down mode. The AD5390/AD5391/AD5392 are available in 64-lead LFCSP and 52-lead LQFP packages.
Features
16-/8-channel, 14-/12-bit voltage output DACs
Guaranteed monotonic
INL: ±1 LSB max (AD5391)
INL: ±3 LSB max (AD5390-5/AD5392-5)
INL: ±4 LSB max (AD5390-3/AD5392-3)
On-chip 1.25 V/2.5 V, 10 ppm/°C reference
Temperature range: -40°C to 85°C
Rail-to-rail output amplifier
Power-down mode
Package types:
64-lead LFCSP (9 mm x 9 mm)
52-lead LQFP (10 mm x 10 mm)
User interfaces:
8-/16-Channel, 3 V/5 V, Serial Input, Single-Supply, 12-/14-Bit Voltage Output
Serial SPI-, QSPI-, MICROWIRE-, and DSP-compatible (featuring data readback)
PC-compatible interface
Integrated functions:
Channel monitor
Simultaneous output update via LDAC
Clear function to user-programmable code
Amplifier boost mode to optimize slew rate
User-programmable offset and gain adjust
Toggle mode enables square wave generation
Thermal monitor
Robust 6.5 kV HBM and 2 kV FICDM ESD rating
Applications
Instrumentation and industrial control
Power amplifier control
Level setting (ATE)
Control systems
Microelectromechanical systems (MEMS)
Variable optical attenuators (VOAs)
Optical transceivers (MSA 300, XFP)