Analog Devices Inc. AD7701ARZ-REEL

Mfr.Part #:

AD7701ARZ-REEL

Manufacturer:

Description:
IC ADC 16BIT LC2MOS 20SOIC

RoHS Status:

RoHS

Datasheet:

Payment:

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Delivery:

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Specifications

Product Details

Product Comparison

Factory Lead Time
8 Weeks
Lifecycle Status
PRODUCTION (Last Updated: 2 weeks ago)
Contact Plating
Tin
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

20-SOIC (0.295, 7.50mm Width)
Surface Mount
YES
Number of Pins

Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

20
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-40°C~85°C
Packaging
Tape & Reel (TR)
JESD-609 Code
e3
Pbfree Code
no
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Active
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

3 (168 Hours)
Number of Terminations
20
ECCN Code
EAR99
Max Power Dissipation
37mW
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

CMOS
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

5V
Reflow Temperature-Max (s)
30
Base Part Number
AD7701
Pin Count
20
Qualification Status
Not Qualified
Polarity

Polarity refers to the direction of current flow through an electronic component. It is typically indicated by a plus (+) or minus (-) sign on the component's body. Components with polarity must be connected correctly in a circuit to function properly. For example, a diode will only allow current to flow in one direction, from the positive terminal to the negative terminal. If a diode is connected backwards, it will not conduct current.

Bipolar, Unipolar
Configuration
S/H-ADC
Number of Channels

Number of Channels refers to the number of independent signal paths within an electronic component. It indicates how many separate signals can be processed or transmitted simultaneously. For example, an audio amplifier with two channels can amplify two separate audio signals, while a multi-channel data converter can convert multiple analog signals into digital data. The number of channels is a crucial parameter for determining the component's functionality and application.

1
Interface

In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

SPI, Serial
Power Dissipation

Power Dissipation is the maximum amount of power that an electronic component can safely dissipate without being damaged. It is typically measured in watts (W) and is determined by the component's physical size, material properties, and design. Exceeding the power dissipation rating can lead to overheating, reduced performance, and even component failure.

37mW
Number of Bits
16
Input Type

Input Type refers to the type of signal that an electronic component can accept as input.

Single Ended
Min Input Voltage
2.5V
Architecture

Architecture refers to the internal design and organization of an electronic component. It encompasses the arrangement of functional blocks, their interconnections, and the overall data flow within the component. The architecture determines the component's performance characteristics, such as speed, power consumption, and functionality. It also influences the component's size, cost, and reliability.

Sigma-Delta
Max Input Voltage
2.5V
Converter Type

Converter Type refers to the type of conversion performed by an electronic component, such as an analog-to-digital converter (ADC) or a digital-to-analog converter (DAC). It specifies the input and output signal types that the converter can handle.

ADC, DELTA-SIGMA
Supply Type
Analog, Digital, Dual
Reference Type

Reference type is a parameter that specifies the type of reference used in an electronic component. It can be either a voltage reference or a current reference. A voltage reference provides a stable voltage output, while a current reference provides a stable current output. The type of reference used depends on the application. For example, a voltage reference is used in a voltage regulator to provide a stable voltage output, while a current reference is used in a current source to provide a stable current output.

External
Data Interface

Data Interface refers to the physical and logical means by which an electronic component communicates with other components or systems. It defines the protocols, pinouts, and signal characteristics used for data exchange. The Data Interface parameter specifies the type of interface supported by the component, such as SPI, I2C, UART, or Ethernet. It ensures compatibility and proper communication between different devices within a system.

SPI
Resolution
2 B
Sampling Rate

Sampling rate refers to the number of times per second that an analog signal is measured and converted into a digital signal. It is expressed in Hertz (Hz) and determines the maximum frequency that can be accurately represented in the digital signal. A higher sampling rate results in a more accurate representation of the analog signal, but also increases the amount of data that needs to be processed. The sampling rate must be at least twice the highest frequency component of the analog signal to avoid aliasing, where high-frequency components are incorrectly represented as lower-frequency components.

16 ksps
Number of Analog In Channels
1
Sampling Rate (Per Second)
4k
Max Dual Supply Voltage
5.5V
Output Bit Code
BINARY, OFFSET BINARY
Power Consumption
25mW
Linearity Error-Max (EL)
0.003%
Min Dual Supply Voltage
4.5V
Sample and Hold / Track and Hold
SAMPLE
Dual Supply Voltage
5V
Input Capacitance

Input Capacitance is a parameter that measures the capacitance between the input terminal of an electronic component and the ground or reference terminal. It represents the ability of the component to store electrical charge when a voltage is applied to its input. A higher input capacitance indicates a greater ability to store charge, which can affect the component's response time and frequency characteristics. Input capacitance is a crucial parameter in designing electronic circuits, as it can impact signal integrity, noise immunity, and overall circuit performance.

10pF
Ratio - S/H:ADC

Ratio - S/H:ADC is an electronic component parameter that specifies the ratio of the output voltage of a sample-and-hold (S/H) circuit to the input voltage of the analog-to-digital converter (ADC). It is expressed as a percentage and indicates the accuracy of the ADC's conversion process. A higher ratio indicates better accuracy, as it means that the ADC is able to convert the analog input signal into a digital representation with less error.

1:1
Negative Supply Voltage-Nom
-5V
Differential Nonlinearity
0.5 LSB
Height Seated (Max)
2.65mm
Width
7.5mm
RoHS Status
ROHS3 Compliant
Lead Free
Contains Lead
Description
The AD7701 is a 16-bit analog-to-digital converter (ADC) that utilizes a sigma-delta conversion technique. It continuously samples the analog input using an analog modulator, with the mean output duty cycle proportional to the input signal. The modulator output is processed by a six-pole Gaussian low-pass digital filter, updating the output data register with 16-bit binary words at rates up to 4 kHz.
The AD7701 features on-chip self-calibration circuitry, ensuring endpoint accuracy by calibrating zero and full scale. This calibration can be initiated at any time and can be extended to null system offset and gain errors in the input channel.

Features
Monolithic 16-bit ADC
0.0015% linearity error
On-chip self-calibration circuitry
Programmable low-pass filter (0.1 Hz to 10 Hz corner frequency)
0 V to 2.5 V or ±2.5 V analog input range
4 KSPS output data rate
Flexible serial interface
Ultralow power consumption

Applications
Industrial process control
Weigh scales
Portable instrumentation
Remote data acquisition
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Contact Plating
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Max Power Dissipation
    Technology
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    Qualification Status
    Polarity
    Configuration
    Number of Channels
    Interface
    Power Dissipation
    Number of Bits
    Input Type
    Min Input Voltage
    Architecture
    Max Input Voltage
    Converter Type
    Supply Type
    Reference Type
    Data Interface
    Resolution
    Sampling Rate
    Number of Analog In Channels
    Sampling Rate (Per Second)
    Max Dual Supply Voltage
    Output Bit Code
    Power Consumption
    Linearity Error-Max (EL)
    Min Dual Supply Voltage
    Sample and Hold / Track and Hold
    Dual Supply Voltage
    Input Capacitance
    Ratio - S/H:ADC
    Negative Supply Voltage-Nom
    Differential Nonlinearity
    Height Seated (Max)
    Width
    RoHS Status
    Lead Free
    Mount
    Terminal Position
    Terminal Pitch
    Max Supply Voltage
    Number of Inputs
    Voltage - Supply, Analog
    Voltage - Supply, Digital
    Number of A/D Converters
    Analog Input Voltage-Max
    Output Format
    Analog Input Voltage-Min
    Length
    Terminal Finish
    Min Supply Voltage
    Operating Supply Current
    Integral Nonlinearity (INL)
    Signal to Noise Ratio (SNR)
    Conversion Time-Max
    Number of Analog Inputs
    View Compare
  • AD7701ARZ-REEL
    AD7701ARZ-REEL
    8 Weeks
    PRODUCTION (Last Updated: 2 weeks ago)
    Tin
    Surface Mount
    20-SOIC (0.295, 7.50mm Width)
    YES
    20
    -40°C~85°C
    Tape & Reel (TR)
    e3
    no
    Active
    3 (168 Hours)
    20
    EAR99
    37mW
    CMOS
    GULL WING
    260
    1
    5V
    30
    AD7701
    20
    Not Qualified
    Bipolar, Unipolar
    S/H-ADC
    1
    SPI, Serial
    37mW
    16
    Single Ended
    2.5V
    Sigma-Delta
    2.5V
    ADC, DELTA-SIGMA
    Analog, Digital, Dual
    External
    SPI
    2 B
    16 ksps
    1
    4k
    5.5V
    BINARY, OFFSET BINARY
    25mW
    0.003%
    4.5V
    SAMPLE
    5V
    10pF
    1:1
    -5V
    0.5 LSB
    2.65mm
    7.5mm
    ROHS3 Compliant
    Contains Lead
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • AD7172-2BRUZ-RL7
    12 Weeks
    PRODUCTION (Last Updated: 3 months ago)
    -
    Surface Mount
    24-TSSOP (0.173, 4.40mm Width)
    -
    -
    -40°C~105°C
    Tape & Reel (TR)
    -
    no
    Active
    3 (168 Hours)
    24
    -
    25.4mW
    -
    GULL WING
    260
    1
    3.3V
    30
    AD7172
    24
    -
    Bipolar, Unipolar
    MUX-ADC
    -
    SPI
    19.1mW
    24
    Differential, Single Ended
    -
    Sigma-Delta
    -
    ADC, DELTA-SIGMA
    Single
    External, Internal
    SPI, DSP
    3 B
    31.25 ksps
    4
    31.25k
    -
    BINARY, OFFSET BINARY
    -
    0.0005%
    -
    -
    -
    -
    -
    -
    -
    -
    4.4mm
    ROHS3 Compliant
    Contains Lead
    Surface Mount
    DUAL
    0.65mm
    5.5V
    2, 4
    2V~5.5V
    2V~5.5V
    1
    2.5V
    SERIAL
    -2.5V
    7.8mm
    -
    -
    -
    -
    -
    -
    -
  • AD7091R-4BCPZ-RL7
    8 Weeks
    PRODUCTION (Last Updated: 4 weeks ago)
    -
    Surface Mount
    20-WFQFN Exposed Pad, CSP
    -
    20
    -40°C~125°C
    Tape & Reel (TR)
    e3
    no
    Active
    3 (168 Hours)
    20
    -
    -
    -
    NO LEAD
    260
    1
    3V
    30
    AD7091
    20
    -
    Unipolar
    S/H-ADC
    -
    SPI
    3.4mW
    12
    Single Ended
    1V
    SAR
    5.25V
    ADC, SUCCESSIVE APPROXIMATION
    -
    Supply
    SPI, DSP
    1.5 B
    1 Msps
    4
    1M
    -
    BINARY
    -
    -
    -
    TRACK
    -
    -
    1:1
    -
    0.3 LSB
    0.8mm
    -
    ROHS3 Compliant
    Contains Lead
    Surface Mount
    QUAD
    0.5mm
    5.25V
    1
    2.09V~5.25V
    2.09V~5.25V
    -
    -
    SERIAL
    -
    -
    Tin (Sn)
    2.7V
    500μA
    1.25 LSB
    70 dB
    0.6μs
    4

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