Microchip Technology ATSAMA5D43A-CUR

Mfr.Part #:

ATSAMA5D43A-CUR

Manufacturer:

Description:
IC MCU 32BIT 128KB ROM 289LFBGA

RoHS Status:

RoHS

Payment:

Payment

Delivery:

Delivery

Quick Request Quote

Do you want a lower wholesale price? Please send us an inquiry, and we will respond immediately.

Latest Posts

A switch solenoid converts electrical energy into mechanical movement by using a simple principle:...
Voltage controlled oscillator takes a voltage (like from a battery) and turns it into...
Types of computer cables: USB cables, HDMI cables, Ethernet cables, power cables,VGA and display
A potentiometer is like a dimmer switch for electronic devices - it controls the...
Security

Buy With Confidence

ISO 9001
ISO 9001
ISO 45001
ISO 45001
ISO 13485
ISO 13485
ISO 14001
ISO 14001
SMTA
ASA

Specifications

Product Details

Product Comparison

Factory Lead Time
19 Weeks
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

289-LFBGA
Number of Pins

Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

289
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-40°C~85°C TA
Packaging
Tape & Reel (TR)
Published
2014
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

SAMA5D4
Pbfree Code
yes
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Obsolete
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

3 (168 Hours)
Frequency

Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

528MHz
Base Part Number
ATSAMA5D43
Operating Supply Voltage
1.8V
Interface

In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

2-Wire, EBI/EMI, Ethernet, I2C, MMC, SD, SPI, UART, USART, USB
Max Supply Voltage
1.98V
Min Supply Voltage
1.62V
Memory Size
128kB
Oscillator Type
Internal
Number of I/O
152
RAM Size
128kB
Memory Type

Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

L2 Cache, ROM, SRAM
Core Processor

Core Processor refers to the central processing unit (CPU) of an electronic device. It is the brain of the device, responsible for executing instructions, processing data, and managing the overall operation of the system. The core processor's speed, number of cores, and architecture determine the device's performance and capabilities.

ARM® Cortex®-A5
Peripherals
DMA, LCD, POR, PWM, WDT
Data Bus Width

Data Bus Width refers to the number of bits that can be transmitted simultaneously on a data bus. It determines the amount of data that can be transferred between components in a single operation. A wider data bus allows for faster data transfer rates and higher system performance. Common data bus widths include 8, 16, 32, and 64 bits, with wider buses typically found in high-performance systems.

32b
Number of Timers/Counters
3
Core Architecture
ARM
Voltage - I/O
1.2V 1.8V 3.3V
Ethernet

Ethernet is a standardized networking technology for local area networks (LANs). It defines the physical layer and data link layer of the OSI model. Ethernet is widely used in homes, businesses, and schools to connect computers, printers, and other devices. The term "Ethernet" is derived from the word "ether," which refers to the hypothetical medium through which electromagnetic waves were once thought to travel. Ethernet was originally developed by Xerox in the 1970s as a way to connect computers and printers. It was later adopted by the IEEE as a standard, and it has since become the most widely used LAN technology in the world.

10/100Mbps (1)
Number of Cores/Bus Width

Number of Cores/Bus Width refers to the number of processing units (cores) within a processor and the width of the data path (bus) that connects them. A higher number of cores allows for parallel processing, improving performance for multi-threaded applications. Bus width determines the amount of data that can be transferred simultaneously, affecting overall system speed. A wider bus width enables faster data transfer and reduces bottlenecks.

1 Core 32-Bit
Graphics Acceleration
Yes
RAM Controllers
LPDDR, LPDDR2, DDR2
USB
USB 2.0 (3)
Additional Interfaces
EBI, I2C, MMC/SD/SDIO, SPI, SSC, UART, USART
Co-Processors/DSP
Multimedia; NEON™ SIMD
Number of Cores

Number of Cores refers to the number of independent processing units within a single electronic component, such as a processor or graphics card. Each core operates as a separate unit, allowing for parallel processing and increased computational power. A higher number of cores generally indicates improved performance, especially for tasks that can be divided into multiple threads.

1
Security Features
AES, SHA, TDES, TRNG
Display & Interface Controllers
LCD, Touchscreen
RoHS Status
ROHS3 Compliant
Description
High-performance, power-efficient Arm Cortex-A5 processor-based MPU running at up to 600 MHz
Arm NEON SIMD engine for accelerated signal processing, multimedia, and graphics
128 KB L2-Cache for high system performance
Arm TrustZone for strong security perimeter
Advanced user interface and connectivity peripherals

Features
Three software-selectable low-power modes: Idle, Ultra-low-power, and Backup
Internal multi-layer bus architecture with 32 DMA channels
Supports DDR2/LPDDR/LPDDR2 and SLC/MLC NAND Flash memory with 24-bit ECC
Comprehensive peripheral set including:
720p hardware video decoder
LCD controller with overlays for hardware-accelerated image composition
Resistive touchscreen function
CMOS sensor interface
Dual 10/100 Ethernet MAC with IEEE1588
Three HS USB ports
UARTS, SPIs, and 12Cs
Security features:
"On-the-fly" encryption-decryption process from external DDR memory
Tamper detection pins
Secure storage of critical data
Integrity check monitor (ICM)
Secure boot
Dedicated coprocessor for public key cryptography (RSA, ECC)
AES, 3DES, SHA function, and TRNG

Applications
Control panel/HMI applications needing video playback
Applications requiring high levels of connectivity in the industrial and consumer market
Secure gateways
IoT devices
No Product Comparison

Recommended Offers

Texas Instruments
SN74ACT534NSR
Texas Instruments
SN74AUC16374GQLR
Nexperia USA Inc.
74LVC374APW,112
Nexperia USA Inc.
74LVCH16374ADL,112
IDT, Integrated Device Technology Inc
74FCT16374CTPAG
IDT, Integrated Device Technology Inc
74LVCH16374APAG8
Nexperia USA Inc.
74HCT112PW,118
Texas Instruments
SN74ALVCH16374DL
IDT, Integrated Device Technology Inc
74FCT16374CTPVG
ON Semiconductor
NB7V52MMNTXG
ON Semiconductor
MC100EP29MNG
Texas Instruments
SN74ABT273DBRG4