Factory Lead Time
22 Weeks
Lifecycle Status
IN PRODUCTION (Last Updated: 4 weeks ago)
Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
484-BGA
Number of Pins
Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.
484
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
0°C~70°C TA
Series
Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.
Axcelerator
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Active
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
3 (168 Hours)
Number of Terminations
484
Terminal Finish
Tin/Lead (Sn/Pb)
Subcategory
Field Programmable Gate Arrays
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
CMOS
Voltage - Supply
1.425V~1.575V
Peak Reflow Temperature (Cel)
225
Supply Voltage
Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.
1.5V
Frequency
Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.
649MHz
Reflow Temperature-Max (s)
30
Number of Outputs
Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.
248
Operating Supply Voltage
1.5V
Power Supplies
1.51.5/3.32.5/3.3V
Turn On Delay Time
990 ps
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits
Total Ram Bits is a parameter that specifies the total number of bits that can be stored in a random access memory (RAM) chip. It is typically expressed in megabits (Mb) or gigabits (Gb). The higher the Total Ram Bits, the more data the RAM chip can store. This parameter is important for determining the amount of memory that is available to a computer system.
55296
Number of LABs/CLBs
Number of Labs/Clbs (Number of Laboratories/Clubs) is a parameter that specifies the number of laboratories or clubs that are associated with a particular electronic component. This parameter is typically used to indicate the level of support that is available for the component, as well as the number of people who are familiar with its use. A higher number of labs/clubs indicates that the component is more widely used and supported, which can be beneficial for users who need assistance with its implementation or troubleshooting.
4224
Combinatorial Delay of a CLB-Max
0.99 ns
Height
Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.
1.73mm
Length
Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.
23mm
RoHS Status
Non-RoHS Compliant
Description
Microsemi Axcelerator Family FPGAs are single-chip, nonvolatile solutions that offer leading-edge performance and high-performance embedded FIFOs. Manufactured on an advanced 0.15 um CMOS antifuse process technology, these FPGAs feature up to 2 million equivalent system gates, 684 I/Os, 10,752 dedicated flip-flops, and 295 kbits of embedded SRAM/FIFO.
Features
Up to 100% resource utilization with 100% pin locking
1.5 V core voltage for low power
Footprint compatible packaging
Flexible, multi-standard I/Os:
1.5 V, 1.8 V, 2.5 V, 3.3 V mixed voltage operation
Bank-selectable I/Os (8 banks per chip)
Single-ended I/O standards: LVTTL, LVCMOS, 3.3V PCI, and 3.3V PCI-X
Differential I/O standards: LVPECL and LVDS
Voltage-referenced I/O standards: GTL, HSTL Class 1, SSTL2 Class 1 and 2, SSTL3 Class 1 and 2
Registered I/Os
Hot-swap compliant I/Os (except PCI)
Programmable slew rate and drive strength on outputs
Programmable delay and weak pull-up/pull-down circuits on inputs
Embedded memory:
Variable-aspect 4,608-bit RAM blocks (x1, x2, x4, x9, x18, x36 organizations available)
Independent, width-configurable read and write ports
Programmable embedded FIFO control logic
Segmentable clock resources
Embedded phase-locked loop:
14-200 MHz input range
Frequency synthesis capabilities up to 1 GHz
Deterministic, user-controllable timing
Unique in-system diagnostic and debug capability with Microsemi Silicon Explorer II
Boundary-scan testing compliant with IEEE Standard 1149.1 (JTAG)
FuseLock™ programming technology protects against reverse engineering and design theft
Applications
Microsemi Axcelerator Family FPGAs are ideal for a wide range of applications, including:
Communications
Industrial automation
Medical imaging
Military and aerospace
Test and measurement