Rohm Semiconductor BR93L46RF-WE2

Mfr.Part #:

BR93L46RF-WE2

Manufacturer:

Description:
IC EEPROM 1KBIT 2MHZ 8SOP

RoHS Status:

RoHS

Datasheet:

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Total Price: $0.25

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Specifications

Product Details

Product Comparison

Factory Lead Time
10 Weeks
Contact Plating
Copper, Tin
Mount
Surface Mount
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

8-SOIC (0.173, 4.40mm Width)
Number of Pins

Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

8
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-40°C~85°C TA
Packaging
Tape & Reel (TR)
Published
2009
Pbfree Code
yes
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Active
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

1 (Unlimited)
Number of Terminations
8
Termination

Termination refers to the electrical characteristics of a component or circuit at its input or output terminals. It describes how the component or circuit interacts with external signals or devices. Termination can involve matching impedance, providing voltage or current regulation, or filtering unwanted signals. Proper termination ensures efficient signal transfer, minimizes reflections, and prevents damage to components. It is crucial for maintaining signal integrity and optimizing circuit performance.

SMD/SMT
ECCN Code
EAR99
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

CMOS
Voltage - Supply
1.8V~5.5V
Terminal Position
DUAL
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

2.5V
Terminal Pitch
1.27mm
Reflow Temperature-Max (s)
10
Base Part Number
BR93L46
Pin Count
8
Operating Supply Voltage
5V
Interface

In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

Serial
Memory Size
1Kb 64 x 16
Nominal Supply Current
4.5mA
Memory Type

Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

Non-Volatile
Clock Frequency

Clock Frequency, measured in Hertz (Hz), is the rate at which an electronic component, such as a microprocessor or oscillator, generates electrical pulses. It determines the speed at which the component can process data and execute instructions. A higher clock frequency generally indicates faster performance, but also higher power consumption and heat generation. Clock Frequency is a crucial parameter for timing-sensitive applications, such as digital signal processing and real-time systems.

2MHz
Access Time

Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.

200 ns
Memory Format

Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.

EEPROM
Memory Interface
SPI
Organization
64X16
Memory Width
16
Write Cycle Time - Word, Page
5ms
Density
1 kb
Standby Current-Max
0.000002A
Serial Bus Type
MICROWIRE
Endurance
1000000 Write/Erase Cycles
Write Cycle Time-Max (tWC)
5ms
Data Retention Time-Min
40
Write Protection
SOFTWARE
Height Seated (Max)
1.6mm
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

5mm
Width
4.4mm
Radiation Hardening
No
REACH SVHC
Unknown
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Description
BR93Lxx-W is a serial EEPROM with a 3-line serial interface method. It features 3-line communications of chip select, serial clock, and serial data input/output (where input and output are shared). Actions are available at a high speed 2MHz clock (2.5V to 5.5V). It also has a speed write function (write time 5ms max.) and the same package and pin layout from 1Kbit to 16Kbit. The BR93Lxx-W operates on a 1.8V to 5.5V single power source and has an address auto increment function at read action.

Features
3-line communications of chip select, serial clock, serial data input/output
Actions available at high speed 2MHz clock (2.5V to 5.5V)
Speed write available (write time 5ms max.)
Same package and pin layout from 1Kbit to 16Kbit
1.8V to 5.5V single power source action
Address auto increment function at read action
Write mistake prevention function
Write prohibition at power on
Write prohibition by command code
Write mistake prevention function at low voltage
Program cycle auto delete and auto end function
Program condition display by READY/BUSY
Low current consumption
TTL compatible (input/outputs)
Data retention for 40 years
Endurance up to 1,000,000 times
Data at shipment all addresses FFFFh

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  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Termination
    ECCN Code
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    Operating Supply Voltage
    Interface
    Memory Size
    Nominal Supply Current
    Memory Type
    Clock Frequency
    Access Time
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Write Cycle Time - Word, Page
    Density
    Standby Current-Max
    Serial Bus Type
    Endurance
    Write Cycle Time-Max (tWC)
    Data Retention Time-Min
    Write Protection
    Height Seated (Max)
    Length
    Width
    Radiation Hardening
    REACH SVHC
    RoHS Status
    Lead Free
    Surface Mount
    Additional Feature
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Operating Mode
    Memory Density
    Parallel/Serial
    View Compare
  • BR93L46RF-WE2
    BR93L46RF-WE2
    10 Weeks
    Copper, Tin
    Surface Mount
    Surface Mount
    8-SOIC (0.173, 4.40mm Width)
    8
    -40°C~85°C TA
    Tape & Reel (TR)
    2009
    yes
    Active
    1 (Unlimited)
    8
    SMD/SMT
    EAR99
    CMOS
    1.8V~5.5V
    DUAL
    260
    1
    2.5V
    1.27mm
    10
    BR93L46
    8
    5V
    Serial
    1Kb 64 x 16
    4.5mA
    Non-Volatile
    2MHz
    200 ns
    EEPROM
    SPI
    64X16
    16
    5ms
    1 kb
    0.000002A
    MICROWIRE
    1000000 Write/Erase Cycles
    5ms
    40
    SOFTWARE
    1.6mm
    5mm
    4.4mm
    No
    Unknown
    ROHS3 Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • BR93G86F-3BGTE2
    10 Weeks
    -
    -
    Surface Mount
    8-SOIC (0.173, 4.40mm Width)
    -
    -40°C~85°C TA
    Cut Tape (CT)
    2008
    -
    Active
    1 (Unlimited)
    8
    -
    -
    CMOS
    1.7V~5.5V
    DUAL
    NOT SPECIFIED
    1
    5V
    1.27mm
    -
    -
    -
    -
    -
    16Kb 1K x 16
    -
    Non-Volatile
    3MHz
    -
    EEPROM
    SPI
    1KX16
    16
    5ms
    -
    -
    3-WIRE
    -
    5ms
    -
    -
    1.71mm
    5mm
    4.4mm
    -
    -
    ROHS3 Compliant
    -
    YES
    SEATED HT-CALCULATED AND ALSO OPERATES AT 1.7V WITH 1MHZ AMD 2.5V AT 2MHZ
    NOT SPECIFIED
    R-PDSO-G8
    5.5V
    4.5V
    SYNCHRONOUS
    16384 bit
    SERIAL
  • BR93G76NUX-3TTR
    10 Weeks
    Tin
    Surface Mount
    Surface Mount
    8-UFDFN Exposed Pad
    -
    -40°C~85°C TA
    Tape & Reel (TR)
    2013
    yes
    Active
    1 (Unlimited)
    -
    -
    -
    -
    1.7V~5.5V
    -
    -
    -
    -
    -
    -
    BR93G76
    -
    -
    Serial
    8Kb 1K x 8 512 x 16
    -
    Non-Volatile
    3MHz
    200 ns
    EEPROM
    SPI
    -
    -
    5ms
    8 kb
    -
    3-WIRE
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -

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