NXP USA Inc. BZX284-C3V0,115

Mfr.Part #:

BZX284-C3V0,115

Manufacturer:

Description:
ZENER DIODE 95Ohm ±5% 10μA @ 1V -65°C~150°C 2 Terminations ZENER SOD-110

RoHS Status:

RoHS

Payment:

Payment

Delivery:

Delivery

Quick Request Quote

Do you want a lower wholesale price? Please send us an inquiry, and we will respond immediately.

Latest Posts

A phototransistor is a light-sensitive electronic component that acts like a switch or amplifier
The battery SR621SW is a small, round battery known as a “button cell” because...
The LM324 contains four operational amplifiers (op-amps) in one package. When it is as...
The SN74HC595N is an 8-bit shift register. It comes in a DIP (Dual In-line...
Security

Buy With Confidence

ISO 9001
ISO 9001
ISO 45001
ISO 45001
ISO 13485
ISO 13485
ISO 14001
ISO 14001
SMTA
ASA

Specifications

Product Details

Product Comparison

Surface Mount
YES
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

SOD-110
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Diode Element Material
SILICON
Published
2009
Packaging
Tape & Reel (TR)
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-65°C~150°C
Tolerance

Tolerance in electronic components refers to the allowable deviation from the specified value. It indicates the range within which the actual value of the component can vary while still meeting the manufacturer's specifications. Tolerance is typically expressed as a percentage of the nominal value, such as ±5% or ±10%. A lower tolerance indicates a tighter range of acceptable values, resulting in more precise and consistent performance.

±5%
JESD-609 Code
e2
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Obsolete
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

1 (Unlimited)
Number of Terminations
2
ECCN Code
EAR99
Terminal Finish
TIN COPPER
HTS Code
8541.10.00.50
Subcategory
Voltage Reference Diodes
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

ZENER
Terminal Position
DUAL
Terminal Form
WRAP AROUND
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Pin Count
2
JESD-30 Code
R-CDSO-R2
Qualification Status
Not Qualified
Number of Elements
1
Polarity

Polarity refers to the direction of current flow through an electronic component. It is typically indicated by a plus (+) or minus (-) sign on the component's body. Components with polarity must be connected correctly in a circuit to function properly. For example, a diode will only allow current to flow in one direction, from the positive terminal to the negative terminal. If a diode is connected backwards, it will not conduct current.

UNIDIRECTIONAL
Configuration
SINGLE
Power Dissipation-Max
0.4W
Diode Type

Diode Type refers to the specific type of diode used in an electronic circuit. Diodes are semiconductor devices that allow current to flow in only one direction. Different types of diodes have different characteristics and applications.

ZENER DIODE
Current - Reverse Leakage @ Vr
10μA @ 1V
Voltage - Forward (Vf) (Max) @ If
1.1V @ 100mA
Power - Max
400mW
Impedance-Max
95Ohm
Reference Voltage
3V
Voltage - Zener (Nom) (Vz)
3V
Voltage Tol-Max
5%
Working Test Current
5mA
Dynamic Impedance-Max
400Ohm
RoHS Status
ROHS3 Compliant
BZX284-C3V0,115 Overview
The reverse leakage current for this electrical device should be 10μA @ 1V.5% indicates the maximum possible voltage (Tol) of 5%.While operating, the maximum voltage - Zener (Nom) is reduced to 3VV.This device should be operated at 5mA on the working test voltage.For its operation, maximum voltage - Forward (Vf) 1.1V @ 100mA is provided.

BZX284-C3V0,115 Features
reverse leakage current of 10μA @ 1V
10μA @ 1V is the maximum voltage (Tol)
the working test voltage to 5mA
minimal dynamic impedance is 5mA


BZX284-C3V0,115 Applications
There are a lot of NXP USA Inc.
BZX284-C3V0,115 applications of zener single diodes.



BZX284-C3V0,115 More Descriptions
DIODE ZENER 3V 400MW SOD2
3 V 0.4 W SILICON UNIDIRECTIONAL VOLTAGE REGULATOR DIODE
BZX284 series - Voltage regulator diodes
  • Image
    Part Number
    Manufacturer
    Surface Mount
    Package / Case
    Mounting Type
    Diode Element Material
    Published
    Packaging
    Operating Temperature
    Tolerance
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    Pin Count
    JESD-30 Code
    Qualification Status
    Number of Elements
    Polarity
    Configuration
    Power Dissipation-Max
    Diode Type
    Current - Reverse Leakage @ Vr
    Voltage - Forward (Vf) (Max) @ If
    Power - Max
    Impedance-Max
    Reference Voltage
    Voltage - Zener (Nom) (Vz)
    Voltage Tol-Max
    Working Test Current
    Dynamic Impedance-Max
    RoHS Status
    Factory Lead Time
    Series
    Reference Standard
    Number of Pins
    Base Part Number
    View Compare
  • BZX284-C3V0,115
    BZX284-C3V0,115
    YES
    SOD-110
    Surface Mount
    SILICON
    2009
    Tape & Reel (TR)
    -65°C~150°C
    ±5%
    e2
    Obsolete
    1 (Unlimited)
    2
    EAR99
    TIN COPPER
    8541.10.00.50
    Voltage Reference Diodes
    ZENER
    DUAL
    WRAP AROUND
    NOT SPECIFIED
    NOT SPECIFIED
    2
    R-CDSO-R2
    Not Qualified
    1
    UNIDIRECTIONAL
    SINGLE
    0.4W
    ZENER DIODE
    10μA @ 1V
    1.1V @ 100mA
    400mW
    95Ohm
    3V
    3V
    5%
    5mA
    400Ohm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
  • BZX384-C7V5F
    YES
    SC-76, SOD-323
    Surface Mount
    SILICON
    -
    Tape & Reel (TR)
    -65°C~150°C
    ±5%
    -
    Active
    -
    2
    -
    -
    -
    -
    ZENER
    DUAL
    GULL WING
    -
    -
    2
    R-PDSO-G2
    -
    1
    UNIDIRECTIONAL
    SINGLE
    0.3W
    ZENER DIODE
    1μA @ 5V
    1.1V @ 100mA
    -
    15Ohm
    7.5V
    7.45V
    5%
    5mA
    -
    ROHS3 Compliant
    4 Weeks
    Automotive, AEC-Q101
    AEC-Q101; IEC-60134
    -
    -
  • BZX384-C22,115
    YES
    SC-76, SOD-323
    Surface Mount
    SILICON
    2003
    Tape & Reel (TR)
    -65°C~150°C
    ±5%
    e3
    Active
    1 (Unlimited)
    2
    EAR99
    Tin (Sn)
    8541.10.00.50
    -
    ZENER
    DUAL
    GULL WING
    260
    40
    2
    -
    Not Qualified
    1
    NPN
    SINGLE
    0.3W
    ZENER DIODE
    50nA @ 15.4V
    1.1V @ 100mA
    300mW
    55Ohm
    22V
    22V
    5%
    5mA
    -
    ROHS3 Compliant
    4 Weeks
    -
    -
    2
    BZX384C22

Recommended Offers

Power Integrations
LNK6415D
Power Integrations
LNK6406D
ON Semiconductor
UC3844BVDR2G
ON Semiconductor
NCP1234BD100R2G
ON Semiconductor
NCP1060AD060R2G
STMicroelectronics
VIPER28LD
ON Semiconductor
NCP1217D100R2
ON Semiconductor
NCP1244AD100R2G
ON Semiconductor
NCP1060BD060R2G
Power Integrations
LNK520PN
Power Integrations
LNK6763K-TL
ON Semiconductor
NCP1063AD060R2G