Factory Lead Time
8 Weeks
Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
32-SOIC (0.445, 11.30mm Width)
Number of Pins
Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.
32
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-40°C~85°C TA
Packaging
Tape & Reel (TR)
Series
Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.
MoBL®
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Active
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
3 (168 Hours)
Number of Terminations
32
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
SRAM - Asynchronous
Voltage - Supply
4.5V~5.5V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.
5V
Reflow Temperature-Max (s)
NOT SPECIFIED
Qualification Status
Not Qualified
Operating Supply Voltage
5V
Number of Ports
Number of Ports refers to the number of electrical connections or terminals available on an electronic component. It indicates the number of external devices or signals that can be connected to the component. For example, a transistor may have three ports (emitter, base, and collector), while a resistor has two ports (terminals). The number of ports determines the functionality and connectivity options of the component within a circuit.
1
Nominal Supply Current
16mA
Memory Type
Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.
Volatile
Memory Format
Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.
SRAM
Memory Interface
Parallel
Output Characteristics
3-STATE
Write Cycle Time - Word, Page
45ns
Standby Current-Max
0.000004A
Height Seated (Max)
2.997mm
Length
Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.
20.4465mm
RoHS Status
ROHS3 Compliant
Description
The CY62128E is a high-performance CMOS static RAM organized as 128K words by 8 bits. It features advanced circuit design for ultra-low active current, making it ideal for portable applications requiring extended battery life. The device also has an automatic power-down feature that significantly reduces power consumption when addresses are not toggling.
Features
Very high speed: 45 ns
Temperature ranges:
Industrial: -40 °C to 85 °C
Automotive-A: -40 °C to 85 °C
Automotive-E: -40 °C to 125 °C
Voltage range: 4.5 V to 5.5 V
Pin compatible with CY621288
Ultra-low standby power:
Typical standby current: 1 μA
Maximum standby current: 4 μA (Industrial)
Ultra-low active power:
Typical active current: 1.3 mA at f = 1 MHz
Easy memory expansion with CE₁, CE₂, and OE features
Automatic power down when deselected
Complementary metal oxide semiconductor (CMOS) for optimum speed and power
Offered in standard Pb-free 32-pin STSOP, 32-pin SOIC, and 32-pin thin small outline package (TSOP) Type 1 packages
Applications
Portable devices requiring extended battery life
Automotive applications
Industrial applications
Memory expansion for microprocessors and microcontrollers
-
Image
Part Number
Manufacturer
Factory Lead Time
Mount
Mounting Type
Package / Case
Number of Pins
Operating Temperature
Packaging
Published
Series
JESD-609 Code
Part Status
Moisture Sensitivity Level (MSL)
Number of Terminations
ECCN Code
Terminal Finish
Technology
Voltage - Supply
Terminal Position
Peak Reflow Temperature (Cel)
Number of Functions
Supply Voltage
Reflow Temperature-Max (s)
Base Part Number
Qualification Status
Operating Supply Voltage
Power Supplies
Memory Size
Number of Ports
Nominal Supply Current
Memory Type
Memory Format
Memory Interface
Output Characteristics
Memory Width
Write Cycle Time - Word, Page
Address Bus Width
Density
Standby Current-Max
Access Time (Max)
I/O Type
Sync/Async
Word Size
Standby Voltage-Min
Height Seated (Max)
Length
RoHS Status
Lead Free
Supplier Device Package
Access Time
Surface Mount
Pbfree Code
Terminal Pitch
Reach Compliance Code
Time@Peak Reflow Temperature-Max (s)
Pin Count
JESD-30 Code
Supply Voltage-Max (Vsup)
Supply Voltage-Min (Vsup)
Organization
Memory Density
Width
View Compare
-
CY62128ELL-45SXAT
8 Weeks
Surface Mount
Surface Mount
32-SOIC (0.445, 11.30mm Width)
32
-40°C~85°C TA
Tape & Reel (TR)
2001
MoBL®
e4
Active
3 (168 Hours)
32
EAR99
Nickel/Palladium/Gold (Ni/Pd/Au)
SRAM - Asynchronous
4.5V~5.5V
DUAL
NOT SPECIFIED
1
5V
NOT SPECIFIED
CY62128
Not Qualified
5V
5V
1Mb 128K x 8
1
16mA
Volatile
SRAM
Parallel
3-STATE
8
45ns
17b
1 Mb
0.000004A
45 ns
COMMON
Asynchronous
8b
2V
2.997mm
20.4465mm
ROHS3 Compliant
Lead Free
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Surface Mount
48-VFBGA
-
-40°C~125°C TA
Tray
-
MoBL®
-
Obsolete
3 (168 Hours)
-
-
-
SRAM - Asynchronous
2.7V~3.3V
-
-
-
-
-
-
-
-
-
2Mb 128K x 16
-
-
Volatile
SRAM
Parallel
-
-
70ns
-
-
-
-
-
-
-
-
-
-
ROHS3 Compliant
-
48-VFBGA (6x8)
70ns
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Surface Mount
32-SOIC (0.445, 11.30mm Width)
-
-40°C~85°C TA
Tube
-
MoBL®
e4
Obsolete
3 (168 Hours)
32
-
NICKEL PALLADIUM GOLD
SRAM - Asynchronous
2.2V~3.6V
DUAL
260
1
3V
-
-
COMMERCIAL
-
-
1Mb 128K x 8
-
-
Volatile
SRAM
Parallel
-
8
55ns
-
-
-
55 ns
-
-
-
-
2.997mm
20.4465mm
ROHS3 Compliant
-
-
-
YES
yes
1.27mm
unknown
20
32
R-PDSO-G32
3.6V
2.2V
128KX8
1048576 bit
11.303mm