Cypress Semiconductor Corp CY62128ELL-45SXAT

Mfr.Part #:

CY62128ELL-45SXAT
Description:
IC SRAM 1MBIT 45NS 32SOIC

RoHS Status:

RoHS

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Total Price: $0.45

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Specifications

Product Details

Product Comparison

Factory Lead Time
8 Weeks
Mount
Surface Mount
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

32-SOIC (0.445, 11.30mm Width)
Number of Pins

Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

32
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-40°C~85°C TA
Packaging
Tape & Reel (TR)
Published
2001
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

MoBL®
JESD-609 Code
e4
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Active
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

3 (168 Hours)
Number of Terminations
32
ECCN Code
EAR99
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

SRAM - Asynchronous
Voltage - Supply
4.5V~5.5V
Terminal Position
DUAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Number of Functions
1
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

5V
Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
CY62128
Qualification Status
Not Qualified
Operating Supply Voltage
5V
Power Supplies
5V
Memory Size
1Mb 128K x 8
Number of Ports

Number of Ports refers to the number of electrical connections or terminals available on an electronic component. It indicates the number of external devices or signals that can be connected to the component. For example, a transistor may have three ports (emitter, base, and collector), while a resistor has two ports (terminals). The number of ports determines the functionality and connectivity options of the component within a circuit.

1
Nominal Supply Current
16mA
Memory Type

Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

Volatile
Memory Format

Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.

SRAM
Memory Interface
Parallel
Output Characteristics
3-STATE
Memory Width
8
Write Cycle Time - Word, Page
45ns
Address Bus Width
17b
Density
1 Mb
Standby Current-Max
0.000004A
Access Time (Max)
45 ns
I/O Type
COMMON
Sync/Async
Asynchronous
Word Size
8b
Standby Voltage-Min
2V
Height Seated (Max)
2.997mm
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

20.4465mm
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Description
The CY62128E is a high-performance CMOS static RAM organized as 128K words by 8 bits. It features advanced circuit design for ultra-low active current, making it ideal for portable applications requiring extended battery life. The device also has an automatic power-down feature that significantly reduces power consumption when addresses are not toggling.

Features
Very high speed: 45 ns
Temperature ranges:
Industrial: -40 °C to 85 °C
Automotive-A: -40 °C to 85 °C
Automotive-E: -40 °C to 125 °C
Voltage range: 4.5 V to 5.5 V
Pin compatible with CY621288
Ultra-low standby power:
Typical standby current: 1 μA
Maximum standby current: 4 μA (Industrial)
Ultra-low active power:
Typical active current: 1.3 mA at f = 1 MHz
Easy memory expansion with CE₁, CE₂, and OE features
Automatic power down when deselected
Complementary metal oxide semiconductor (CMOS) for optimum speed and power
Offered in standard Pb-free 32-pin STSOP, 32-pin SOIC, and 32-pin thin small outline package (TSOP) Type 1 packages

Applications
Portable devices requiring extended battery life
Automotive applications
Industrial applications
Memory expansion for microprocessors and microcontrollers
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Reflow Temperature-Max (s)
    Base Part Number
    Qualification Status
    Operating Supply Voltage
    Power Supplies
    Memory Size
    Number of Ports
    Nominal Supply Current
    Memory Type
    Memory Format
    Memory Interface
    Output Characteristics
    Memory Width
    Write Cycle Time - Word, Page
    Address Bus Width
    Density
    Standby Current-Max
    Access Time (Max)
    I/O Type
    Sync/Async
    Word Size
    Standby Voltage-Min
    Height Seated (Max)
    Length
    RoHS Status
    Lead Free
    Supplier Device Package
    Access Time
    Surface Mount
    Pbfree Code
    Terminal Pitch
    Reach Compliance Code
    Time@Peak Reflow Temperature-Max (s)
    Pin Count
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Organization
    Memory Density
    Width
    View Compare
  • CY62128ELL-45SXAT
    CY62128ELL-45SXAT
    8 Weeks
    Surface Mount
    Surface Mount
    32-SOIC (0.445, 11.30mm Width)
    32
    -40°C~85°C TA
    Tape & Reel (TR)
    2001
    MoBL®
    e4
    Active
    3 (168 Hours)
    32
    EAR99
    Nickel/Palladium/Gold (Ni/Pd/Au)
    SRAM - Asynchronous
    4.5V~5.5V
    DUAL
    NOT SPECIFIED
    1
    5V
    NOT SPECIFIED
    CY62128
    Not Qualified
    5V
    5V
    1Mb 128K x 8
    1
    16mA
    Volatile
    SRAM
    Parallel
    3-STATE
    8
    45ns
    17b
    1 Mb
    0.000004A
    45 ns
    COMMON
    Asynchronous
    8b
    2V
    2.997mm
    20.4465mm
    ROHS3 Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • CY62137CV30LL-70BVXE
    -
    -
    Surface Mount
    48-VFBGA
    -
    -40°C~125°C TA
    Tray
    -
    MoBL®
    -
    Obsolete
    3 (168 Hours)
    -
    -
    -
    SRAM - Asynchronous
    2.7V~3.3V
    -
    -
    -
    -
    -
    -
    -
    -
    -
    2Mb 128K x 16
    -
    -
    Volatile
    SRAM
    Parallel
    -
    -
    70ns
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    -
    48-VFBGA (6x8)
    70ns
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • CY62128DV30LL-55SXI
    -
    -
    Surface Mount
    32-SOIC (0.445, 11.30mm Width)
    -
    -40°C~85°C TA
    Tube
    -
    MoBL®
    e4
    Obsolete
    3 (168 Hours)
    32
    -
    NICKEL PALLADIUM GOLD
    SRAM - Asynchronous
    2.2V~3.6V
    DUAL
    260
    1
    3V
    -
    -
    COMMERCIAL
    -
    -
    1Mb 128K x 8
    -
    -
    Volatile
    SRAM
    Parallel
    -
    8
    55ns
    -
    -
    -
    55 ns
    -
    -
    -
    -
    2.997mm
    20.4465mm
    ROHS3 Compliant
    -
    -
    -
    YES
    yes
    1.27mm
    unknown
    20
    32
    R-PDSO-G32
    3.6V
    2.2V
    128KX8
    1048576 bit
    11.303mm

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