Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
84-LCC (J-Lead)
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
0°C~70°C TA
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
3 (168 Hours)
Number of Terminations
84
Terminal Finish
Matte Tin (Sn)
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
SRAM - Dual Port, Asynchronous
Voltage - Supply
4.5V~5.5V
Peak Reflow Temperature (Cel)
260
Supply Voltage
Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.
5V
Reach Compliance Code
unknown
Frequency
Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.
25GHz
Time@Peak Reflow Temperature-Max (s)
20
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
5.5V
Supply Voltage-Min (Vsup)
4.5V
Number of Ports
Number of Ports refers to the number of electrical connections or terminals available on an electronic component. It indicates the number of external devices or signals that can be connected to the component. For example, a transistor may have three ports (emitter, base, and collector), while a resistor has two ports (terminals). The number of ports determines the functionality and connectivity options of the component within a circuit.
2
Memory Type
Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.
Volatile
Supply Current-Max
0.25mA
Memory Format
Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.
SRAM
Memory Interface
Parallel
Output Characteristics
3-STATE
Write Cycle Time - Word, Page
25ns
Standby Current-Max
0.015A
Height Seated (Max)
5.08mm
Length
Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.
29.3116mm
RoHS Status
ROHS3 Compliant
Description
The CY7C024/0241 and CY7C025/0251 are low-power CMOS 4K x 16/18 and 8K x 16/18 dual-port static RAMs. They feature true dual-ported memory cells, allowing simultaneous reads of the same memory location. Each port has independent control pins (Chip Enable, Read or Write Enable, and Output Enable) and two flags (BUSY and INT). The semaphores are used to pass a flag or token from one port to the other to indicate that a shared resource is in use. An automatic power-down feature is controlled independently on each port by a chip select (CE) pin.
Features
True Dual-Ported memory cells
4K x 16/18 and 8K x 16/18 organizations
0.65-micron CMOS for optimum speed/power
High-speed access: 15 ns
Low operating power: Icc 150 mA (typ.)
Fully asynchronous operation
Automatic power-down
Expandable data bus to 32/36 bits or more using Master/Slave chip select
On-chip arbitration logic
Semaphores included to permit software handshaking between ports
INT flag for port-to-port communication
Separate upper-byte and lower-byte control
Pin select for Master or Slave
Available in 84-pin Lead (Pb)-free PLCC, 84-pin PLCC, 100-pin Lead (Pb)-free TQFP, and 100-pin TQFP
Applications
Interprocessor/multi-processor designs
Communications status buffering
Dual-port video/graphics memory