Factory Lead Time
12 Weeks
Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
0201 (0603 Metric)
Packaging
Tape & Reel (TR)
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Active
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
1 (Unlimited)
Applications
General Purpose
Voltage - Breakdown (Min)
7.7V
Voltage - Reverse Standoff (Typ)
6.5V Max
Reverse Standoff Voltage
6.5V
Unidirectional Channels
1
Capacitance @ Frequency
20pF @ 1MHz
RoHS Status
RoHS Compliant
The DF2S8.2ASL,L3F is TVS DIODE 6.55VWM SL2-2 , it is part of - series. they are designed to work as TVS - Diodes.DF2S8.2ASL,L3F with pin details manufactured by Toshiba Semiconductor and Storage. The DF2S8.2ASL,L3F is available in SL2 Package,it is part of the electronic component Chips.that includes - Series. they are designed to operate as TVS - Diodes.it is with Operating Temperature -.DF2S8.2ASL,L3F with original stock manufactured by Toshiba Semiconductor and Storage. The DF2S8.2ASL,L3F is available in SL2 Package.Generally IC chips offer Mounting Style features such as SMD/SMT, Package Case of DF2S8.2ASL,L3Fis designed to work in 2-SMD, No Lead, it's Operating Temperature is -.The DF2S8.2ASL,L3F is available in 2-SMD, No Lead Package, is part of the TVS - Diodes and belong to Circuit Protection.DF2S8.2ASL,L3F with EDA / CAD Models manufactured by Toshiba Semiconductor and Storage. The DF2S8.2ASL,L3F is available in SL2Package, is part of the Circuit Protection.The DF2S8.2ASL,L3F is TVS - Diodes with package 2-SMD, No Lead manufactured by Toshiba Semiconductor and Storage. The DF2S8.2ASL,L3F is available in SL2 Package, is part of the TVS DIODE 6.55VWM SL2-2.
DF2S8.2ASL,L3F More Descriptions
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