Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
SC-70, SOT-323
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Discontinued
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
1 (Unlimited)
Termination
Termination refers to the electrical characteristics of a component or circuit at its input or output terminals. It describes how the component or circuit interacts with external signals or devices. Termination can involve matching impedance, providing voltage or current regulation, or filtering unwanted signals. Proper termination ensures efficient signal transfer, minimizes reflections, and prevents damage to components. It is crucial for maintaining signal integrity and optimizing circuit performance.
SMD/SMT
Max Operating Temperature
125°C
Min Operating Temperature
-55°C
Applications
General Purpose
Capacitance
Capacitance is the ability of a component to store electrical charge. It is measured in farads (F). A capacitor is a passive electronic component that consists of two conductors separated by an insulator. When a voltage is applied across the capacitor, charge builds up on the conductors. The amount of charge that can be stored depends on the capacitance of the capacitor. Capacitors are used in a variety of electronic circuits, including filters, timing circuits, and energy storage devices.
6.5pF
Subcategory
Voltage Reference Diodes
Max Power Dissipation
100mW
Number of Channels
Number of Channels refers to the number of independent signal paths within an electronic component. It indicates how many separate signals can be processed or transmitted simultaneously. For example, an audio amplifier with two channels can amplify two separate audio signals, while a multi-channel data converter can convert multiple analog signals into digital data. The number of channels is a crucial parameter for determining the component's functionality and application.
1
Voltage - Breakdown (Min)
5.9V
Reverse Standoff Voltage
5V
Unidirectional Channels
2
Breakdown Voltage
Breakdown voltage is the maximum voltage that can be applied to an electronic component before it fails. It is typically measured in volts (V). When the breakdown voltage is exceeded, the component will experience a sudden increase in current, which can cause it to overheat and fail. Breakdown voltage is an important parameter to consider when designing electronic circuits, as it determines the maximum voltage that can be applied to the circuit without causing damage.
6.2V
Capacitance @ Frequency
6.5pF @ 1MHz
Dynamic Impedance-Max
50Ohm
RoHS Status
RoHS Compliant
DF3A6.2LFU(TE85L,F OverviewThis product is manufactured by Toshiba Semiconductor and Storage and belongs to the category of TVS - Diodes. The images we provide are for reference only, for detailed product information please see specification sheet DF3A6.2LFU(TE85L,F or the datasheet in PDF format. As a professional electronic components distributor, Zeano has five million electronic components available. Additionally, we have over 500,000 electronic components in stock ready for immediate shipment. If you have requirements, you can send us a quotation form to get the price of DF3A6.2LFU(TE85L,F. We attach great importance to our customers' purchasing experience and are willing to establish a long-term cooperative relationship with you. If you have any questions or requirements, please feel free to contact us.
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