Panasonic Electronic Components DZ2J120M0L

Mfr.Part #:

DZ2J120M0L
Description:
DIODE ZENER 12V 200MW SMINI2

RoHS Status:

RoHS

Datasheet:

Payment:

Payment

Delivery:

Delivery

Quick Request Quote

Do you want a lower wholesale price? Please send us an inquiry, and we will respond immediately.

Latest Posts

A switch solenoid converts electrical energy into mechanical movement by using a simple principle:...
Voltage controlled oscillator takes a voltage (like from a battery) and turns it into...
Types of computer cables: USB cables, HDMI cables, Ethernet cables, power cables,VGA and display
A potentiometer is like a dimmer switch for electronic devices - it controls the...
Security

Buy With Confidence

ISO 9001
ISO 9001
ISO 45001
ISO 45001
ISO 13485
ISO 13485
ISO 14001
ISO 14001
SMTA
ASA

Specifications

Product Details

Product Comparison

Factory Lead Time
10 Weeks
Contact Plating
Tin
Mount
Surface Mount
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

SC-90, SOD-323F
Number of Pins

Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

2
Diode Element Material
SILICON
Packaging
Tape & Reel (TR)
Published
2017
Tolerance

Tolerance in electronic components refers to the allowable deviation from the specified value. It indicates the range within which the actual value of the component can vary while still meeting the manufacturer's specifications. Tolerance is typically expressed as a percentage of the nominal value, such as ±5% or ±10%. A lower tolerance indicates a tighter range of acceptable values, resulting in more precise and consistent performance.

±2.5%
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Discontinued
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

1 (Unlimited)
Number of Terminations
2
ECCN Code
EAR99
Max Operating Temperature
150°C
Min Operating Temperature
-40°C
Additional Feature
HIGH RELIABILITY
HTS Code
8541.10.00.50
Max Power Dissipation
200mW
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

ZENER
Terminal Position
DUAL
Terminal Form
FLAT
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
DZ2J120
Qualification Status
Not Qualified
Number of Elements
1
Working Voltage

Working Voltage is the maximum voltage that can be applied to an electronic component without causing damage. It is typically specified in volts (V) and is a critical parameter to consider when designing and using electronic circuits. Exceeding the working voltage can lead to component failure, circuit malfunctions, and even safety hazards. Therefore, it is essential to ensure that the working voltage of a component is always within the specified limits.

12V
Polarity

Polarity refers to the direction of current flow through an electronic component. It is typically indicated by a plus (+) or minus (-) sign on the component's body. Components with polarity must be connected correctly in a circuit to function properly. For example, a diode will only allow current to flow in one direction, from the positive terminal to the negative terminal. If a diode is connected backwards, it will not conduct current.

UNIDIRECTIONAL
Impedance

Impedance is a measure of the opposition to the flow of alternating current (AC) in an electrical circuit. It is a complex quantity that has both magnitude and phase. The magnitude of impedance is measured in ohms, and the phase is measured in degrees. Impedance is determined by the resistance, inductance, and capacitance of the circuit. Resistance is the opposition to the flow of current due to the material of the conductor. Inductance is the opposition to the flow of current due to the magnetic field created by the current. Capacitance is the opposition to the flow of current due to the storage of charge on the plates of a capacitor.

30Ohm
Element Configuration
Single
Diode Type

Diode Type refers to the specific type of diode used in an electronic circuit. Diodes are semiconductor devices that allow current to flow in only one direction. Different types of diodes have different characteristics and applications.

ZENER DIODE
Current - Reverse Leakage @ Vr
50nA @ 9V
Power Dissipation

Power Dissipation is the maximum amount of power that an electronic component can safely dissipate without being damaged. It is typically measured in watts (W) and is determined by the component's physical size, material properties, and design. Exceeding the power dissipation rating can lead to overheating, reduced performance, and even component failure.

200mW
Voltage - Forward (Vf) (Max) @ If
1V @ 10mA
Max Reverse Leakage Current
50nA
Impedance-Max
30Ohm
Test Current
5mA
Reference Voltage
12V
Forward Voltage
1V
Zener Voltage
12V
Peak Reverse Current
50nA
Voltage Tolerance
2.5%
Height

Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.

700μm
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

1.7mm
Width
1.25mm
REACH SVHC
Unknown
RoHS Status
RoHS Compliant
Lead Free
Lead Free
DZ2J120M0L Overview
This electrical device requires reverse leakage current of 50nA @ 9V.Reverse leakage current reaches 50nA at its maximum.Zener single diode reaches 1V @ 10mA when Zener single diode is supplied wZener single diodeh the maximum voltage - Forward (Vf).For this device to operate properly, a peak reverse voltage of 50nA is recommended.

DZ2J120M0L Features
reverse leakage current of 50nA @ 9V
50nA @ 9V is the maximum voltage (Tol)
Reverse leakage current reaches 50nA


DZ2J120M0L Applications
There are a lot of Panasonic Electronic Components
DZ2J120M0L applications of zener single diodes.



DZ2J120M0L More Descriptions
DZ2J120M0L Series 200 mW 12 V 200 mA Surface Mount Zener Diode - SC-90A
Diode Zener Single 12.33V 200mW 2-Pin SC-90A Embossed T/R
SC,ZENER DIODE / SINGLE, VOLTAGE REGULATION, VZ:12V, PT:200MW
DZ2J120M0L Zener Diode, 12V 2.5% 0.2 W SMT 2-Pin SMini2 F5 B | Panasonic Electronic Components DZ2J120M0L
DIODE, ZENER, 12.0V, SMINI2-F5-B; Zener Voltage Vz Typ:12V; Power Dissipation Pd:200mW; Diode Case Style:SOD-323F; No. of Pins:2; MSL:MSL 1 - Unlimited
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Diode Element Material
    Packaging
    Published
    Tolerance
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Max Operating Temperature
    Min Operating Temperature
    Additional Feature
    HTS Code
    Max Power Dissipation
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    Base Part Number
    Qualification Status
    Number of Elements
    Working Voltage
    Polarity
    Impedance
    Element Configuration
    Diode Type
    Current - Reverse Leakage @ Vr
    Power Dissipation
    Voltage - Forward (Vf) (Max) @ If
    Max Reverse Leakage Current
    Impedance-Max
    Test Current
    Reference Voltage
    Forward Voltage
    Zener Voltage
    Peak Reverse Current
    Voltage Tolerance
    Height
    Length
    Width
    REACH SVHC
    RoHS Status
    Lead Free
    Weight
    Operating Temperature
    Series
    JESD-609 Code
    Pbfree Code
    Terminal Finish
    Pin Count
    Configuration
    Voltage Tol-Max
    Working Test Current
    View Compare
  • DZ2J120M0L
    DZ2J120M0L
    10 Weeks
    Tin
    Surface Mount
    Surface Mount
    SC-90, SOD-323F
    2
    SILICON
    Tape & Reel (TR)
    2017
    ±2.5%
    Discontinued
    1 (Unlimited)
    2
    EAR99
    150°C
    -40°C
    HIGH RELIABILITY
    8541.10.00.50
    200mW
    ZENER
    DUAL
    FLAT
    NOT SPECIFIED
    NOT SPECIFIED
    DZ2J120
    Not Qualified
    1
    12V
    UNIDIRECTIONAL
    30Ohm
    Single
    ZENER DIODE
    50nA @ 9V
    200mW
    1V @ 10mA
    50nA
    30Ohm
    5mA
    12V
    1V
    12V
    50nA
    2.5%
    700μm
    1.7mm
    1.25mm
    Unknown
    RoHS Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • DZ23C22-E3-18
    15 Weeks
    -
    Surface Mount
    Surface Mount
    TO-236-3, SC-59, SOT-23-3
    3
    SILICON
    Tape & Reel (TR)
    -
    ±5%
    Active
    1 (Unlimited)
    3
    EAR99
    -
    -
    -
    8541.10.00.50
    300mW
    ZENER
    DUAL
    GULL WING
    260
    10
    -
    -
    2
    -
    UNIDIRECTIONAL
    55Ohm
    Common Cathode
    ZENER DIODE
    100nA @ 17V
    300mW
    -
    -
    55Ohm
    -
    22V
    -
    22V
    -
    5%
    -
    -
    -
    -
    ROHS3 Compliant
    -
    8.788352mg
    -55°C~150°C
    Automotive, AEC-Q101
    e3
    yes
    Matte Tin (Sn)
    3
    1 Pair Common Cathode
    5%
    5mA
  • DZ23C7V5-E3-18
    15 Weeks
    -
    Surface Mount
    Surface Mount
    TO-236-3, SC-59, SOT-23-3
    3
    SILICON
    Tape & Reel (TR)
    2016
    ±5%
    Active
    1 (Unlimited)
    3
    EAR99
    -
    -
    -
    8541.10.00.50
    300mW
    ZENER
    DUAL
    GULL WING
    260
    10
    -
    -
    2
    -
    UNIDIRECTIONAL
    7Ohm
    Common Cathode
    ZENER DIODE
    100nA @ 5V
    300mW
    -
    -
    7Ohm
    -
    7.5V
    -
    7.5V
    -
    5%
    -
    -
    -
    -
    ROHS3 Compliant
    -
    8.788352mg
    -55°C~150°C
    Automotive, AEC-Q101
    e3
    yes
    Matte Tin (Sn)
    3
    1 Pair Common Cathode
    5%
    5mA

Recommended Offers

Melexis Technologies NV
MLX81108KDC-CAE-000-SP
Maxim Integrated
MAX3079EEPD+
Microchip Technology
ATSAMD21G17A-AF
Microchip Technology
PIC16LF707T-I/PT
Microchip Technology
PIC18F67K40T-I/MR
Microchip Technology
PIC16F707-I/MV
Microchip Technology
PIC16LC712-04/SO
Microchip Technology
ATSAMD21G17A-UUT
Microchip Technology
PIC18LF67K40T-I/MR
Microchip Technology
PIC16LF1778-I/SP
Silicon Labs
C8051T615-GM