Altera EPM7128EQC160-12

Mfr.Part #:

EPM7128EQC160-12

Manufacturer:

Description:
IC CPLD 128MC 12NS 160QFP

RoHS Status:

RoHS

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Specifications

Product Details

Product Comparison

Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

160-BQFP
Surface Mount
YES
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

0°C~70°C TA
Packaging
Tray
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

MAX® 7000
JESD-609 Code
e0
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Obsolete
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

3 (168 Hours)
Number of Terminations
160
ECCN Code
EAR99
Terminal Finish
TIN LEAD
Additional Feature
CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
Subcategory
Programmable Logic Devices
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

CMOS
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
220
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

5V
Terminal Pitch
0.65mm
Reach Compliance Code
compliant
Reflow Temperature-Max (s)
20
Base Part Number
EPM7128
JESD-30 Code
S-PQFP-G160
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
5.25V
Power Supplies
3.3/55V
Supply Voltage-Min (Vsup)
4.75V
Programmable Type
EE PLD
Number of I/O
100
Clock Frequency

Clock Frequency, measured in Hertz (Hz), is the rate at which an electronic component, such as a microprocessor or oscillator, generates electrical pulses. It determines the speed at which the component can process data and execute instructions. A higher clock frequency generally indicates faster performance, but also higher power consumption and heat generation. Clock Frequency is a crucial parameter for timing-sensitive applications, such as digital signal processing and real-time systems.

125MHz
Propagation Delay
12 ns
Number of Gates
2500
Output Function
MACROCELL
Number of Macro Cells
128
JTAG BST
NO
Voltage Supply - Internal
4.75V~5.25V
Delay Time tpd(1) Max
12ns
Number of Logic Elements/Blocks
8
Height Seated (Max)
4.07mm
RoHS Status
Non-RoHS Compliant
Description
The MAX 7000 family of programmable logic devices (PLDs) is based on Altera's second-generation MAX architecture. These high-performance, EEPROM-based PLDs offer a range of logic densities from 600 to 5,000 usable gates. MAX 7000 devices feature 5.0-V in-system programmability (ISP) through the built-in IEEE Std. 1149.1 Joint Test Action Group (JTAG) interface. MAX 7000S devices include ISP circuitry compatible with IEEE Std. 1532 and built-in JTAG boundary-scan test (BST) circuitry.

Features
High-performance, EEPROM-based PLDs
5.0-V in-system programmability (ISP) through JTAG interface
Built-in JTAG boundary-scan test (BST) circuitry in MAX 7000S devices
Logic densities ranging from 600 to 5,000 usable gates
5-ns pin-to-pin logic delays with up to 175.4-MHz counter frequencies
PCI-compliant devices available

Applications
MAX 7000 PLDs are ideal for a wide range of applications, including:
Industrial control
Telecommunications
Networking
Consumer electronics
Automotive
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