Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
56-BSSOP (0.295, 7.50mm Width)
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-40°C~85°C
Series
Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.
74GTLP
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
1 (Unlimited)
Number of Terminations
56
Terminal Finish
MATTE TIN
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
BICMOS
Voltage - Supply
3.15V~3.45V
Peak Reflow Temperature (Cel)
260
Supply Voltage
Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.
3.3V
Reflow Temperature-Max (s)
NOT SPECIFIED
Qualification Status
COMMERCIAL
Supply Voltage-Max (Vsup)
3.45V
Supply Voltage-Min (Vsup)
3.15V
Number of Circuits
Number of Circuits refers to the number of independent signal paths within an electronic component. It indicates how many separate circuits or channels the component can handle simultaneously. For example, an operational amplifier with a Number of Circuits of 2 can amplify two separate input signals independently. This parameter is crucial for determining the component's functionality and its suitability for specific applications.
18-Bit
Number of Ports
Number of Ports refers to the number of electrical connections or terminals available on an electronic component. It indicates the number of external devices or signals that can be connected to the component. For example, a transistor may have three ports (emitter, base, and collector), while a resistor has two ports (terminals). The number of ports determines the functionality and connectivity options of the component within a circuit.
2
Output Characteristics
OPEN-DRAIN/3-STATE
Current - Output High, Low
24mA 24mA
Logic Type
Logic Type refers to the type of logic implemented by an electronic component, such as a logic gate or flip-flop.
Universal Bus Transceiver
Propagation Delay (tpd)
6.5 ns
Height Seated (Max)
2.74mm
Length
Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.
18.415mm
RoHS Status
ROHS3 Compliant
Description
The GTLP18T612 is an 18-bit universal bus transceiver that provides LVTTL to GTLP signal level translation. It allows for transparent, latched, and docked modes of data transfer. The device provides a high-speed interface for cards operating at LVTTL logic levels and a backplane operating at GTLP logic levels. High-speed backplane operation is a direct result of GTLP's reduced output swing (<1V), reduced input threshold levels, and output edge rate control. The edge rate control minimizes bus setting time.
Features
Bidirectional interface between GTLP and LVTTL logic levels
Designed with edge rate control circuitry to reduce output noise on the GTLP port
Ver pin provides external supply reference voltage for receiver threshold adjustability
Special PVT compensation circuitry to provide consistent performance over variations of process, supply voltage, and temperature
TTL compatible driver and control inputs
Designed using Fairchild advanced BiCMOS technology
Bushold data inputs on A port to eliminate the need for external pull-up resistors for unused inputs
Power up/down and power off high impedance for live insertion
Open drain on GTLP to support wired or connection
Flow-through pinout optimizes PCB layout
D-type flip-flop, latch, and transparent data paths
A Port source/sink -24mA/ 24mA
B Port sink 50mA
Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA)
Applications
High-speed backplane applications
Interface between LVTTL and GTLP devices
Data transfer between cards and backplanes
Live insertion applications