Factory Lead Time
26 Weeks
Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
14-SOIC (0.154, 3.90mm Width)
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-40°C~150°C TJ
Packaging
Tape & Reel (TR)
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Active
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
3 (168 Hours)
Number of Terminations
14
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
CMOS
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.
15V
Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
IR21844SPBF
Input Type
Input Type refers to the type of signal that an electronic component can accept as input.
Non-Inverting
Rise / Fall Time (Typ)
40ns 20ns
Channel Type
Channel Type refers to the type of semiconductor material used in the construction of a field-effect transistor (FET). The two main types of channel materials are n-type and p-type. N-type channels are made from materials with an excess of electrons, while p-type channels are made from materials with an excess of holes. The type of channel material determines the polarity of the FET and its operating characteristics.
Independent
Output Peak Current Limit-Nom
2.3A
Driven Configuration
Half-Bridge
Gate Type
IGBT, N-Channel MOSFET
Current - Peak Output (Source, Sink)
1.9A 2.3A
Logic Voltage - VIL, VIH
In digital electronics, logic voltage refers to the voltage levels that represent logical states.
0.8V 2.7V
High Side Voltage - Max (Bootstrap)
600V
Height Seated (Max)
1.75mm
Length
Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.
8.65mm
RoHS Status
ROHS3 Compliant