ISSI, Integrated Silicon Solution Inc IS61LV2568L-10T-TR

Mfr.Part #:

IS61LV2568L-10T-TR
Description:
IC SRAM 2MBIT 10NS 44TSOP

RoHS Status:

RoHS

Payment:

Payment

Delivery:

Delivery

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Specifications

Product Details

Product Comparison

Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

44-TSOP (0.400, 10.16mm Width)
Number of Pins

Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

44
Supplier Device Package
44-TSOP II
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

0°C~70°C TA
Packaging
Tape & Reel (TR)
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Not For New Designs
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

2 (1 Year)
Max Operating Temperature
70°C
Min Operating Temperature
0°C
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

SRAM - Asynchronous
Voltage - Supply
3.135V~3.6V
Operating Supply Voltage
3.3V
Interface

In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

Parallel
Max Supply Voltage
3.63V
Min Supply Voltage
2.97V
Memory Size
2Mb 256K x 8
Number of Ports

Number of Ports refers to the number of electrical connections or terminals available on an electronic component. It indicates the number of external devices or signals that can be connected to the component. For example, a transistor may have three ports (emitter, base, and collector), while a resistor has two ports (terminals). The number of ports determines the functionality and connectivity options of the component within a circuit.

1
Nominal Supply Current
60mA
Memory Type

Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

Volatile
Access Time

Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.

10ns
Memory Format

Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.

SRAM
Memory Interface
Parallel
Write Cycle Time - Word, Page
10ns
Address Bus Width
18b
Density
2 Mb
Sync/Async
Asynchronous
Word Size
8b
RoHS Status
Non-RoHS Compliant
Description
The IS61LV2568L is a high-speed, low-power, 262,144-word by 8-bit CMOS static RAM. It is fabricated using ISSI's high-performance CMOS technology, resulting in higher performance and low power consumption.

Features
High-speed access time: 8, 10 ns
Operating Current: 50mA (typ.)
Standby Current: 700µA (typ.)
Multiple center power and ground pins for greater noise immunity
Easy memory expansion with CE and OE options
CE power-down
TTL compatible inputs and outputs
Single 3.3V power supply
Packages available:
36-pin 400-mil SOJ
44-pin TSOP (Type II)
Lead-free available

Applications
High-speed buffering
Cache memory
Main memory
Graphics memory
Networking
Telecommunications
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Number of Pins
    Supplier Device Package
    Operating Temperature
    Packaging
    Part Status
    Moisture Sensitivity Level (MSL)
    Max Operating Temperature
    Min Operating Temperature
    Technology
    Voltage - Supply
    Operating Supply Voltage
    Interface
    Max Supply Voltage
    Min Supply Voltage
    Memory Size
    Number of Ports
    Nominal Supply Current
    Memory Type
    Access Time
    Memory Format
    Memory Interface
    Write Cycle Time - Word, Page
    Address Bus Width
    Density
    Sync/Async
    Word Size
    RoHS Status
    Factory Lead Time
    Surface Mount
    Number of Terminations
    ECCN Code
    Additional Feature
    HTS Code
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    Pin Count
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Clock Frequency
    Organization
    Memory Width
    Memory Density
    Access Time (Max)
    Length
    Height Seated (Max)
    Width
    View Compare
  • IS61LV2568L-10T-TR
    IS61LV2568L-10T-TR
    Surface Mount
    44-TSOP (0.400, 10.16mm Width)
    44
    44-TSOP II
    0°C~70°C TA
    Tape & Reel (TR)
    Not For New Designs
    2 (1 Year)
    70°C
    0°C
    SRAM - Asynchronous
    3.135V~3.6V
    3.3V
    Parallel
    3.63V
    2.97V
    2Mb 256K x 8
    1
    60mA
    Volatile
    10ns
    SRAM
    Parallel
    10ns
    18b
    2 Mb
    Asynchronous
    8b
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IS61DDB24M18A-250M3L
    Surface Mount
    165-LBGA
    165
    -
    0°C~70°C TA
    Tray
    Active
    3 (168 Hours)
    -
    -
    SRAM - Synchronous, DDR II
    1.71V~1.89V
    -
    -
    -
    -
    72Mb 4M x 18
    -
    -
    Volatile
    -
    SRAM
    Parallel
    -
    -
    -
    -
    -
    ROHS3 Compliant
    12 Weeks
    YES
    165
    3A991.B.2.A
    PIPELINED ARCHITECTURE
    8542.32.00.41
    BOTTOM
    NOT SPECIFIED
    1
    1.8V
    1mm
    NOT SPECIFIED
    165
    1.89V
    1.71V
    250MHz
    4MX18
    18
    75497472 bit
    0.45 ns
    17mm
    1.4mm
    15mm
  • IS61DDB24M18A-300M3L
    Surface Mount
    165-LBGA
    165
    -
    0°C~70°C TA
    Tray
    Active
    3 (168 Hours)
    -
    -
    SRAM - Synchronous, DDR II
    1.71V~1.89V
    -
    -
    -
    -
    72Mb 4M x 18
    -
    -
    Volatile
    -
    SRAM
    Parallel
    -
    -
    -
    -
    -
    ROHS3 Compliant
    12 Weeks
    YES
    165
    3A991.B.2.A
    PIPELINED ARCHITECTURE
    8542.32.00.41
    BOTTOM
    NOT SPECIFIED
    1
    1.8V
    1mm
    NOT SPECIFIED
    165
    1.89V
    1.71V
    300MHz
    4MX18
    18
    75497472 bit
    0.45 ns
    17mm
    1.4mm
    15mm

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