Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
44-TSOP (0.400, 10.16mm Width)
Number of Pins
Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.
44
Supplier Device Package
44-TSOP II
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-40°C~85°C TA
Packaging
Tape & Reel (TR)
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Not For New Designs
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
2 (1 Year)
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
SRAM - Asynchronous
Voltage - Supply
3.135V~3.6V
Operating Supply Voltage
3.3V
Interface
In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them.
An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.
Parallel
Min Supply Voltage
3.135V
Number of Ports
Number of Ports refers to the number of electrical connections or terminals available on an electronic component. It indicates the number of external devices or signals that can be connected to the component. For example, a transistor may have three ports (emitter, base, and collector), while a resistor has two ports (terminals). The number of ports determines the functionality and connectivity options of the component within a circuit.
1
Nominal Supply Current
95mA
Memory Type
Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.
Volatile
Access Time
Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.
10ns
Memory Format
Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.
SRAM
Memory Interface
Parallel
Write Cycle Time - Word, Page
10ns
RoHS Status
Non-RoHS Compliant
Description
The IS61LV5128AL is a high-speed, low-power 524,288-word by 8-bit CMOS static RAM. It is fabricated using ISSI's high-performance CMOS technology, resulting in higher performance and low power consumption. The device operates from a single 3.3V power supply and all inputs are TTL-compatible. It is available in 36-pin 400-mil SOJ, 36-pin mini BGA, and 44-pin TSOP (Type II) packages.
Features
High-speed access times: 10, 12 ns
Low-power CMOS process
Multiple center power and ground pins for greater noise immunity
Easy memory expansion with CE and OE options
CE power-down
Fully static operation: no clock or refresh required
TTL compatible inputs and outputs
Single 3.3V power supply
Lead-free available
Applications
High-speed buffering
Cache memory
Main memory
Graphics memory
Networking
Telecommunications
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Image
Part Number
Manufacturer
Mount
Mounting Type
Package / Case
Number of Pins
Supplier Device Package
Operating Temperature
Packaging
Part Status
Moisture Sensitivity Level (MSL)
Max Operating Temperature
Min Operating Temperature
Technology
Voltage - Supply
Operating Supply Voltage
Interface
Max Supply Voltage
Min Supply Voltage
Memory Size
Number of Ports
Nominal Supply Current
Memory Type
Access Time
Memory Format
Memory Interface
Write Cycle Time - Word, Page
Address Bus Width
Density
Sync/Async
Word Size
RoHS Status
Factory Lead Time
Radiation Hardening
Surface Mount
Number of Terminations
ECCN Code
Additional Feature
HTS Code
Terminal Position
Number of Functions
Supply Voltage
Terminal Pitch
Reach Compliance Code
Pin Count
JESD-30 Code
Supply Voltage-Max (Vsup)
Supply Voltage-Min (Vsup)
Clock Frequency
Organization
Memory Width
Memory Density
Height Seated (Max)
Length
Width
View Compare
-
IS61LV5128AL-10TI-TR
Surface Mount
Surface Mount
44-TSOP (0.400, 10.16mm Width)
44
44-TSOP II
-40°C~85°C TA
Tape & Reel (TR)
Not For New Designs
2 (1 Year)
85°C
-40°C
SRAM - Asynchronous
3.135V~3.6V
3.3V
Parallel
3.63V
3.135V
4Mb 512K x 8
1
95mA
Volatile
10ns
SRAM
Parallel
10ns
19b
4 Mb
Asynchronous
8b
Non-RoHS Compliant
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Surface Mount
44-BSOJ (0.400, 10.16mm Width)
44
44-SOJ
-40°C~85°C TA
Tape & Reel (TR)
Active
2 (1 Year)
85°C
-40°C
SRAM - Asynchronous
4.5V~5.5V
5V
Parallel
5.5V
4.5V
4Mb 256K x 16
1
50mA
Volatile
10ns
SRAM
Parallel
10ns
18b
4 Mb
Asynchronous
16b
ROHS3 Compliant
8 Weeks
No
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Surface Mount
165-LBGA
-
-
-40°C~85°C TA
Tray
Last Time Buy
3 (168 Hours)
-
-
SRAM - Synchronous, DDR II
1.71V~1.89V
-
-
-
-
72Mb 4M x 18
-
-
Volatile
1.48ns
SRAM
Parallel
-
-
-
-
-
-
-
-
YES
165
3A991.B.2.A
PIPELINED ARCHITECTURE
8542.32.00.41
BOTTOM
1
1.8V
1mm
compliant
165
R-PBGA-B165
1.89V
1.71V
300MHz
4MX18
18
75497472 bit
1.4mm
17mm
15mm