Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
SMD/SMT
Number of Pins
Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.
9
Max Operating Temperature
150°C
Min Operating Temperature
-55°C
Additional Feature
HIGH RELIABILITY, UL RECOGNIZED
Subcategory
Insulated Gate BIP Transistors
Power Dissipation-Max
150W
Element Configuration
Single
Power Dissipation
Power Dissipation is the maximum amount of power that an electronic component can safely dissipate without being damaged. It is typically measured in watts (W) and is determined by the component's physical size, material properties, and design. Exceeding the power dissipation rating can lead to overheating, reduced performance, and even component failure.
150W
Transistor Application
POWER CONTROL
Polarity/Channel Type
N-CHANNEL
Collector Emitter Voltage (VCEO)
Collector-Emitter Voltage (VCEO) is a parameter that specifies the maximum voltage that can be applied between the collector and emitter terminals of a transistor when it is in the off state. It is important to ensure that the VCEO rating of a transistor is not exceeded, as this can lead to damage to the device. The VCEO rating is typically specified in the datasheet for a transistor.
1.2kV
Max Collector Current
43A
Collector Emitter Breakdown Voltage
1.2kV
Collector Emitter Saturation Voltage
1.9V
Turn Off Time-Nom (toff)
350 ns
Gate-Emitter Voltage-Max
20V
Height
Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.
5.5mm
Length
Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.
25mm
RoHS Status
RoHS Compliant
IXA30PG1200DHGLB OverviewThis product is manufactured by IXYS and belongs to the category of Transistors - IGBTs - Arrays. The images we provide are for reference only, for detailed product information please see specification sheet IXA30PG1200DHGLB or the datasheet in PDF format. As a professional electronic components distributor, Zeano has five million electronic components available. Additionally, we have over 500,000 electronic components in stock ready for immediate shipment. If you have requirements, you can send us a quotation form to get the price of IXA30PG1200DHGLB. We attach great importance to our customers' purchasing experience and are willing to establish a long-term cooperative relationship with you. If you have any questions or requirements, please feel free to contact us.
IXA30PG1200DHGLB More Descriptions
IGBT PHASELEG 1200V 30A SMPD