Microsemi Corporation JAN1N6163US

Mfr.Part #:

JAN1N6163US

Manufacturer:

Description:
TVS DIODE 56VWM 108.26VC CPKG

RoHS Status:

RoHS

Datasheet:

Payment:

Payment

Delivery:

Delivery

Quick Request Quote

Do you want a lower wholesale price? Please send us an inquiry, and we will respond immediately.

Latest Posts

A switch solenoid converts electrical energy into mechanical movement by using a simple principle:...
Voltage controlled oscillator takes a voltage (like from a battery) and turns it into...
Types of computer cables: USB cables, HDMI cables, Ethernet cables, power cables,VGA and display
A potentiometer is like a dimmer switch for electronic devices - it controls the...
Security

Buy With Confidence

ISO 9001
ISO 9001
ISO 45001
ISO 45001
ISO 13485
ISO 13485
ISO 14001
ISO 14001
SMTA
ASA

Specifications

Product Details

Product Comparison

Lifecycle Status
IN PRODUCTION (Last Updated: 4 weeks ago)
Mount
Surface Mount
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

SQ-MELF, C
Number of Pins

Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

2
Diode Element Material
SILICON
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-55°C~175°C TJ
Packaging
Bulk
Published
1997
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

Military, MIL-PRF-19500/516
JESD-609 Code
e0
Pbfree Code
no
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Active
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

1 (Unlimited)
Number of Terminations
2
ECCN Code
EAR99
Terminal Finish
Tin/Lead (Sn/Pb)
Applications
General Purpose
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

AVALANCHE
Terminal Position
END
Terminal Form
WRAP AROUND
Peak Reflow Temperature (Cel)
225
Time@Peak Reflow Temperature-Max (s)
20
Pin Count
2
Reference Standard
MIL
Qualification Status
Qualified
Number of Elements
1
Polarity

Polarity refers to the direction of current flow through an electronic component. It is typically indicated by a plus (+) or minus (-) sign on the component's body. Components with polarity must be connected correctly in a circuit to function properly. For example, a diode will only allow current to flow in one direction, from the positive terminal to the negative terminal. If a diode is connected backwards, it will not conduct current.

UNIDIRECTIONAL
Element Configuration
Single
Case Connection
ISOLATED
Power Line Protection
No
Voltage - Breakdown (Min)
67.74V
Power - Peak Pulse
1500W 1.5kW
Current - Peak Pulse (10/1000μs)
13.78A
Max Reverse Leakage Current
5μA
Voltage - Clamping (Max) @ Ipp
108.26V
Clamping Voltage
103.1V
Peak Pulse Current
14.5A
Reverse Standoff Voltage
56V
Peak Pulse Power
1.5kW
Direction
Bidirectional
Test Current
20mA
Bidirectional Channels
1
RoHS Status
Non-RoHS Compliant
JAN1N6163US Overview
This product is manufactured by Microsemi Corporation and belongs to the category of TVS - Diodes. The images we provide are for reference only, for detailed product information please see specification sheet JAN1N6163US or the datasheet in PDF format. As a professional electronic components distributor, Zeano has five million electronic components available. Additionally, we have over 500,000 electronic components in stock ready for immediate shipment. If you have requirements, you can send us a quotation form to get the price of JAN1N6163US. We attach great importance to our customers' purchasing experience and are willing to establish a long-term cooperative relationship with you. If you have any questions or requirements, please feel free to contact us.
JAN1N6163US More Descriptions
Bi-Directional Tvs C-Body Sq. Melf Rohs Compliant: Yes |Microchip JAN1N6163US
Diode TVS Single Bi-Dir 56V 1.5KW 2-Pin G-MELF
TVS DIODE 56VWM 108.26VC SQ-MELF
No Product Comparison

Recommended Offers

Cypress Semiconductor Corp
MB90F543GSPF-GS-BI24
Microchip Technology
PIC16C662-10E/P
Microchip Technology
PIC18F23K20-I/SP
Microchip Technology
PIC18F23K22-I/ML
Renesas Electronics America
R5F56217BDFP#V0
NXP USA Inc.
MK40DN512VMD10
Microchip Technology
PIC16F727-I/PT
Microchip Technology
PIC18F23K22-I/MV
Microchip Technology
PIC16F1784-I/PT
Microchip Technology
PIC18F8723-E/PT
Microchip Technology
DSPIC33EP32GP502-I/SS
Microchip Technology
ATTINY861-20MU