Lifecycle Status
IN PRODUCTION (Last Updated: 4 weeks ago)
Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
SQ-MELF, C
Number of Pins
Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.
2
Diode Element Material
SILICON
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-55°C~175°C TJ
Series
Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.
Military, MIL-PRF-19500/516
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Active
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
1 (Unlimited)
Terminal Finish
Tin/Lead (Sn/Pb)
Applications
General Purpose
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
AVALANCHE
Terminal Form
WRAP AROUND
Peak Reflow Temperature (Cel)
225
Time@Peak Reflow Temperature-Max (s)
20
Qualification Status
Qualified
Polarity
Polarity refers to the direction of current flow through an electronic component. It is typically indicated by a plus (+) or minus (-) sign on the component's body. Components with polarity must be connected correctly in a circuit to function properly. For example, a diode will only allow current to flow in one direction, from the positive terminal to the negative terminal. If a diode is connected backwards, it will not conduct current.
UNIDIRECTIONAL
Element Configuration
Single
Voltage - Breakdown (Min)
67.74V
Power - Peak Pulse
1500W 1.5kW
Current - Peak Pulse (10/1000μs)
13.78A
Max Reverse Leakage Current
5μA
Voltage - Clamping (Max) @ Ipp
108.26V
Reverse Standoff Voltage
56V
RoHS Status
Non-RoHS Compliant
JAN1N6163US OverviewThis product is manufactured by Microsemi Corporation and belongs to the category of TVS - Diodes. The images we provide are for reference only, for detailed product information please see specification sheet JAN1N6163US or the datasheet in PDF format. As a professional electronic components distributor, Zeano has five million electronic components available. Additionally, we have over 500,000 electronic components in stock ready for immediate shipment. If you have requirements, you can send us a quotation form to get the price of JAN1N6163US. We attach great importance to our customers' purchasing experience and are willing to establish a long-term cooperative relationship with you. If you have any questions or requirements, please feel free to contact us.
JAN1N6163US More Descriptions
Bi-Directional Tvs C-Body Sq. Melf Rohs Compliant: Yes |Microchip JAN1N6163US
Diode TVS Single Bi-Dir 56V 1.5KW 2-Pin G-MELF
TVS DIODE 56VWM 108.26VC SQ-MELF