Lifecycle Status
PRODUCTION (Last Updated: 3 months ago)
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
DFN
Number of Pins
Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.
8
Max Operating Temperature
70°C
Min Operating Temperature
0°C
Output Type
Output type refers to the type of signal or power that an electronic component can produce. It can be analog or digital, AC or DC, and can vary in voltage, current, or power levels. The output type is determined by the component's design and is crucial for matching it with other components in a circuit. Understanding the output type ensures proper signal processing, power delivery, and overall system functionality.
TTL
Number of Channels
Number of Channels refers to the number of independent signal paths within an electronic component. It indicates how many separate signals can be processed or transmitted simultaneously. For example, an audio amplifier with two channels can amplify two separate audio signals, while a multi-channel data converter can convert multiple analog signals into digital data. The number of channels is a crucial parameter for determining the component's functionality and application.
2
Quiescent Current
Quiescent current is the amount of current drawn by an electronic component when it is not actively performing its intended function. It is typically measured in milliamps (mA) or microamps (µA). Quiescent current is important because it can affect the overall power consumption of a circuit, especially in battery-powered devices. Components with high quiescent current can drain batteries more quickly than those with low quiescent current.
7mA
Response Time
Response time is the time it takes for an electronic component to react to a change in input. It is typically measured in nanoseconds (ns) or microseconds (µs). A shorter response time indicates that the component can react more quickly to changes in input, which can be important for applications that require fast processing speeds.
7 ns
Common Mode Rejection Ratio
80 dB
Input Offset Voltage (Vos)
Input Offset Voltage (Vos) is a parameter that specifies the voltage difference between the non-inverting and inverting inputs of an operational amplifier (op-amp) when the output voltage is zero. It represents the amount of voltage that must be applied to the inputs to bring the output to zero. Vos is caused by mismatches in the internal transistors of the op-amp and can vary with temperature and other factors. A low Vos is desirable for precision applications where accurate signal processing is required.
3mV
Power Supply Rejection Ratio (PSRR)
80dB
RoHS Status
RoHS Compliant
Description
The LT1720/LT1721 are UltraFast™ dual/quad comparators optimized for single supply operation, with a supply voltage range of 2.7V to 6V. The input voltage range extends from 100mV below ground to 1.2V below the supply voltage. Internal hysteresis makes the LT1720/LT1721 easy to use even with slow moving input signals. The rail-to-rail outputs directly interface to TTL and CMOS. Alternatively, the symmetric output drive can be harnessed for analog applications or for easy translation to other single supply logic levels.
The LT1720 is available in three 8-pin packages; three pins per comparator plus power and ground. In addition to SO and MSOP packages, a 3mm x 3mm low profile (0.8mm) dual fine pitch leadless package (DFN) is available for space-limited applications. The LT1721 is available in the 16-pin SSOP and S packages.
The pinouts of the LT1720/LT1721 minimize parasitic effects by placing the most sensitive inputs (inverting) away from the outputs, shielded by the power rails. The LT1720/LT1721 are ideal for systems where small size and low power are paramount.
Features
UltraFast: 4.5ns at 20mV Overdrive, 7ns at 5mV Overdrive
Low Power: 4mA per Comparator
Optimized for 3V and 5V Operation
Pinout Optimized for High Speed Ease of Use
Input Voltage Range Extends 100mV Below Negative Rail
TTL/CMOS Compatible Rail-to-Rail Outputs
Internal Hysteresis with Specified Limits
Low Dynamic Current Drain; 15μA/(V-MHz), Dominated by Load In Most Circuits
Tiny 3mm x 3mm x 0.75mm DFN Package (LT1720)
Applications
High Speed Differential Line Receiver
Crystal Oscillator Circuits
Window Comparators
Threshold Detectors/Discriminators
Pulse Stretchers
Zero-Crossing Detectors
High Speed Sampling Circuits
