Linear Technology LTC2341CUH-18#TRPBF

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LTC2341CUH-18#TRPBF

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Description:
IC ADC DUAL 18-BIT 32QFN

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RoHS

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Total Price: $25.64

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Specifications

Product Details

Product Comparison

Lifecycle Status
PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time
26 Weeks
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

32-WFQFN Exposed Pad
Surface Mount
YES
Number of Pins

Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

32
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

0°C~70°C
Packaging
Tape & Reel (TR)
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

SoftSpan™
Feature
Simultaneous Sampling
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Active
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

1 (Unlimited)
Number of Terminations
32
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

CMOS
Terminal Position
QUAD
Terminal Form
NO LEAD
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Number of Functions
1
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

5V
Terminal Pitch
0.5mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
LTC2341
Pin Count
32
Configuration
S/H-MUX-ADC
Number of Bits
18
Input Type

Input Type refers to the type of signal that an electronic component can accept as input.

Differential
Architecture

Architecture refers to the internal design and organization of an electronic component. It encompasses the arrangement of functional blocks, their interconnections, and the overall data flow within the component. The architecture determines the component's performance characteristics, such as speed, power consumption, and functionality. It also influences the component's size, cost, and reliability.

SAR
Number of Inputs

The number of inputs of an electronic component refers to the number of separate signals or data streams that the component can receive and process simultaneously. It indicates the maximum number of external connections that can be made to the component to provide input signals. This parameter is crucial for determining the functionality and connectivity of the component within a circuit or system.

2
Converter Type

Converter Type refers to the type of conversion performed by an electronic component, such as an analog-to-digital converter (ADC) or a digital-to-analog converter (DAC). It specifies the input and output signal types that the converter can handle.

ADC, SUCCESSIVE APPROXIMATION
Reference Type

Reference type is a parameter that specifies the type of reference used in an electronic component. It can be either a voltage reference or a current reference. A voltage reference provides a stable voltage output, while a current reference provides a stable current output. The type of reference used depends on the application. For example, a voltage reference is used in a voltage regulator to provide a stable voltage output, while a current reference is used in a current source to provide a stable current output.

External, Internal
Data Interface

Data Interface refers to the physical and logical means by which an electronic component communicates with other components or systems. It defines the protocols, pinouts, and signal characteristics used for data exchange. The Data Interface parameter specifies the type of interface supported by the component, such as SPI, I2C, UART, or Ethernet. It ensures compatibility and proper communication between different devices within a system.

LVDS - Serial, SPI
Sampling Rate

Sampling rate refers to the number of times per second that an analog signal is measured and converted into a digital signal. It is expressed in Hertz (Hz) and determines the maximum frequency that can be accurately represented in the digital signal. A higher sampling rate results in a more accurate representation of the analog signal, but also increases the amount of data that needs to be processed. The sampling rate must be at least twice the highest frequency component of the analog signal to avoid aliasing, where high-frequency components are incorrectly represented as lower-frequency components.

0.666 MHz
Voltage - Supply, Analog
5V
Number of Analog In Channels
2
Sampling Rate (Per Second)
666k
Sample and Hold / Track and Hold
SAMPLE
Number of A/D Converters
1
Ratio - S/H:ADC

Ratio - S/H:ADC is an electronic component parameter that specifies the ratio of the output voltage of a sample-and-hold (S/H) circuit to the input voltage of the analog-to-digital converter (ADC). It is expressed as a percentage and indicates the accuracy of the ADC's conversion process. A higher ratio indicates better accuracy, as it means that the ADC is able to convert the analog input signal into a digital representation with less error.

1:1
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

5mm
Height Seated (Max)
0.8mm
Width
5mm
RoHS Status
ROHS3 Compliant
Description
The LTC2341-18 is a dual, 18-bit, 666ksps/ch differential SoftSpan ADC with wide input common mode range. It features guaranteed 18-bit, no missing codes, and differential, wide common mode range inputs. The per-channel SoftSpan input ranges include: ±4.096V, 0V to 4.096V, ±2.048V, 0V to 2.048V, 5V, 0V to 5V, ±2.5V, and 0V to 2.5V. It offers 95dB single-conversion SNR (typical), -114dB THD (typical) at fiN = 2kHz, and 105dB CMRR (typical) at fIN = 200Hz. The LTC2341-18 has rail-to-rail input overdrive tolerance, guaranteed operation to 125°C, and an integrated reference and buffer (4.096V). It supports SPI CMOS (1.8V to 5V) and LVDS serial I/O, has an internal conversion clock with no cycle latency, and dissipates 74mW of power (typical). The LTC2341-18 is available in a 32-lead (5mm x 5mm) QFN package.

Features
666ksps per channel throughput
Two simultaneous sampling channels
4LSB INL (maximum)
Differential, wide common mode range inputs
Per-channel SoftSpan input ranges: ±4.096V, 0V to 4.096V, ±2.048V, 0V to 2.048V, 5V, 0V to 5V, ±2.5V, 0V to 2.5V
95dB single-conversion SNR (typical)
-114dB THD (typical) at fiN = 2kHz
105dB CMRR (typical) at fIN = 200Hz
Rail-to-rail input overdrive tolerance
Guaranteed operation to 125°C
Integrated reference and buffer (4.096V)
SPI CMOS (1.8V to 5V) and LVDS serial I/O
Internal conversion clock, no cycle latency
74mW power dissipation (typical)
32-lead (5mm x 5mm) QFN package

Applications
Programmable logic controllers
Industrial process control
Medical imaging
High speed data acquisition
No Product Comparison

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