Lifecycle Status
PRODUCTION (Last Updated: 1 month ago)
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
MSOP
Number of Pins
Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.
12
Max Operating Temperature
70°C
Min Operating Temperature
0°C
Polarity
Polarity refers to the direction of current flow through an electronic component. It is typically indicated by a plus (+) or minus (-) sign on the component's body. Components with polarity must be connected correctly in a circuit to function properly. For example, a diode will only allow current to flow in one direction, from the positive terminal to the negative terminal. If a diode is connected backwards, it will not conduct current.
Bipolar
Interface
In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them.
An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.
SPI, Serial
Sampling Rate
Sampling rate refers to the number of times per second that an analog signal is measured and converted into a digital signal. It is expressed in Hertz (Hz) and determines the maximum frequency that can be accurately represented in the digital signal. A higher sampling rate results in a more accurate representation of the analog signal, but also increases the amount of data that needs to be processed. The sampling rate must be at least twice the highest frequency component of the analog signal to avoid aliasing, where high-frequency components are incorrectly represented as lower-frequency components.
1 ksps
Integral Nonlinearity (INL)
12 LSB
Number of Converters
Number of Converters refers to the quantity of analog-to-digital converters (ADCs) or digital-to-analog converters (DACs) present in an electronic component. ADCs convert analog signals into digital form, while DACs perform the reverse operation. The number of converters determines the component's ability to handle multiple analog or digital signals simultaneously. A higher number of converters allows for increased data acquisition or signal generation capabilities.
2
RoHS Status
RoHS Compliant
Description
16-bit resolution, selectable 208sps/833sps output rate
Internal, high accuracy reference with 10ppm/°C max drift
Single-ended (LTC2470) or differential (LTC2472) input
1mV offset error, 0.01% gain error
Single conversion settling time for multiplexed applications
Single-cycle operation with auto shutdown
3.5mA (typ) supply current, 2μA (max) sleep current
Internal oscillator, no external components required
SPI interface
Small 12-lead, 3mm x 3mm DFN and MSOP packages
Features
16-bit resolution
Selectable 208sps/833sps output rate
Internal, high accuracy reference with 10ppm/°C max drift
Single-ended (LTC2470) or differential (LTC2472) input
1mV offset error, 0.01% gain error
Single conversion settling time for multiplexed applications
Single-cycle operation with auto shutdown
3.5mA (typ) supply current, 2μA (max) sleep current
Internal oscillator, no external components required
SPI interface
Small 12-lead, 3mm x 3mm DFN and MSOP packages
Applications
System monitoring
Environmental monitoring
Direct temperature measurements
Instrumentation
Industrial process control
Data acquisition
Embedded ADC upgrades