Lifecycle Status
PRODUCTION (Last Updated: 1 week ago)
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
QFN
Number of Pins
Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.
16
Packaging
Tape & Reel (TR)
Max Operating Temperature
70°C
Min Operating Temperature
0°C
Interface
In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them.
An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.
SPI, Serial
Power Dissipation-Max
1.8mW
Number of Converters
Number of Converters refers to the quantity of analog-to-digital converters (ADCs) or digital-to-analog converters (DACs) present in an electronic component. ADCs convert analog signals into digital form, while DACs perform the reverse operation. The number of converters determines the component's ability to handle multiple analog or digital signals simultaneously. A higher number of converters allows for increased data acquisition or signal generation capabilities.
4
RoHS Status
RoHS Compliant
Description
The LTC2634 is a family of quad 12-, 10-, and 8-bit voltage output DACs with an integrated, high accuracy, low drift 10ppm/°C reference in 16-lead QFN and 10-lead MSOP packages. It has rail-to-rail output buffers and is guaranteed monotonic. The LTC2634-L has a full-scale output of 2.5V and operates from a single 2.7V to 5.5V supply. The LTC2634-H has a full-scale output of 4.096V and operates from a 4.5V to 5.5V supply. Each DAC can also operate with an external reference, which sets the full-scale output to the external reference voltage.
These DACs communicate via an SPI/MICROWIRE compatible 3-wire serial interface which operates at clock rates up to 50MHz. Serial data output (SDO), a hardware clear (CLR), and an asynchronous DAC update (LDAC) capability are available in the QFN package. The LTC2634 incorporates a power-on reset circuit. Options are available for reset to zero-scale or reset to mid-scale in internal reference mode, or reset to mid-scale in external reference mode after power-up.
Features
Integrated Precision Reference
2.5V Full-Scale 10ppm/°C (LTC2634-L)
4.096V Full-Scale 10ppm/°C (LTC2634-H)
Maximum INL Error: 2.5 LSB (LTC2634-12)
Low Noise: 0.75mVp-p 0.1Hz to 200KHz
Guaranteed Monotonic over -40°C to 125°C Temperature Range
Selectable Internal or External Reference
2.7V to 5.5V Supply Range (LTC2634-L)
Ultralow Crosstalk Between DACs (2.4nV•s)
Low Power: 0.6mA at 3V
Power-On Reset to Zero-Scale/Mid-Scale
Double Buffered Data Latches
Tiny 16-Lead 3mm x 3mm QFN and 10-Lead MSOP Packages
Applications
Mobile Communications
Process Control and Industrial Automation
Automatic Test Equipment
Portable Equipment
Automotive
