Factory Lead Time
12 Weeks
Lifecycle Status
IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
676-BGA
Number of Pins
Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.
676
Supplier Device Package
676-FBGA (27x27)
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
0°C~85°C TJ
Series
Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.
ProASIC3E
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Active
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
3 (168 Hours)
Max Operating Temperature
70°C
Min Operating Temperature
0°C
Voltage - Supply
1.425V~1.575V
Base Part Number
M1A3PE1500
Operating Supply Voltage
1.5V
Max Supply Voltage
1.575V
Min Supply Voltage
1.425V
Total RAM Bits
Total Ram Bits is a parameter that specifies the total number of bits that can be stored in a random access memory (RAM) chip. It is typically expressed in megabits (Mb) or gigabits (Gb). The higher the Total Ram Bits, the more data the RAM chip can store. This parameter is important for determining the amount of memory that is available to a computer system.
276480
Number of Registers
38400
Height
Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.
1.73mm
Length
Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.
27mm
RoHS Status
RoHS Compliant
Description
The ProASIC3E Flash Family FPGAs from Microsemi are high-capacity, reprogrammable flash technology devices with optional soft ARM support. They offer a wide range of features, including:
System gates: 600k to 3 million
SRAM: 108 to 504 kbits of true dual-port SRAM
User I/Os: Up to 620
FlashROM: 1 kbit with synchronous interfacing
System performance: 350 MHz
PCI: 3.3 V, 66 MHz 64-Bit PCI
In-system programming (ISP) and security: ISP using on-chip 128-bit Advanced Encryption Standard (AES) decryption via JTAG (IEEE 1532-compliant)
FlashLock designed to secure FPGA contents
Low power: Core voltage for low power, support for 1.5-V-only systems, low-impedance flash switches
High-performance routing hierarchy: Segmented, hierarchical routing and clock structure, ultra-fast local and long-line network, enhanced high-speed, very-long-line network, high-performance, low-skew global network
Architecture supports ultra-high utilization
Pro (Professional) I/O: 700 Mbps DDR, LVDS-capable Os, mixed-voltage operation, bank-selectable I/O voltages, single-ended I/O standards, differential I/O standards, voltage-referenced I/O standards, I/O registers on input, output, and enable paths, hot-swappable and cold sparing I/Os, programmable output slew rate and drive strength, programmable input delay, Schmitt trigger option on single-ended inputs, weak pull-up/-down, IEEE 1149.1 (JTAG) boundary scan test, pin-compatible packages across the ProASIC 3E Family
Clock conditioning circuit (CCC) and PLL: Six CCC blocks, each with an integrated PLL, configurable phase-shift, multiply/divide, delay capabilities, and external feedback, wide input frequency range (1.5 MHz to 350 MHz)
SRAMs and FIFOs: Variable-aspect-ratio 4,608-bit RAM blocks (x1, x2, x4, 9, and x18 organizations available), true dual-port SRAM (except x18), 24 SRAM and FIFO configurations with synchronous operation up to 350 MHz
ARM® processor support in ProASIC3E FPGAs: M1 ProASIC3E Devices-Cortex-M1 Soft Processor Available with or without Debug
Features
High capacity
Reprogrammable flash technology
Instant On Level 0 support
Single-chip solution
Retains programmed design when powered off
On-chip user nonvolatile memory
High performance
Low power
High-performance routing hierarchy
Pro (Professional) I/O
Clock conditioning circuit (CCC) and PLL
SRAMs and FIFOs
ARM® processor support in ProASIC3E FPGAs
Applications
Industrial automation
Medical devices
Automotive electronics
Consumer electronics
Aerospace and defense
Communications