Lifecycle Status
IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time
12 Weeks
Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
484-BGA
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-40°C~100°C TJ
Series
Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.
IGLOO2
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Active
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
3 (168 Hours)
Number of Terminations
484
Subcategory
Field Programmable Gate Arrays
Voltage - Supply
1.14V~2.625V
Peak Reflow Temperature (Cel)
240
Supply Voltage
Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.
1.2V
Time@Peak Reflow Temperature-Max (s)
20
Base Part Number
M2GL050TS
Number of Outputs
Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.
267
Qualification Status
Not Qualified
Number of Inputs
The number of inputs of an electronic component refers to the number of separate signals or data streams that the component can receive and process simultaneously. It indicates the maximum number of external connections that can be made to the component to provide input signals. This parameter is crucial for determining the functionality and connectivity of the component within a circuit or system.
267
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
56340
Total RAM Bits
Total Ram Bits is a parameter that specifies the total number of bits that can be stored in a random access memory (RAM) chip. It is typically expressed in megabits (Mb) or gigabits (Gb). The higher the Total Ram Bits, the more data the RAM chip can store. This parameter is important for determining the amount of memory that is available to a computer system.
1869824
Length
Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.
23mm
Height Seated (Max)
2.44mm
RoHS Status
Non-RoHS Compliant
Description
Microsemi's IGLOO2 FPGAs combine fourth-generation flash-based FPGA fabric with high-performance communications interfaces on a single chip. They offer the industry's lowest power, highest reliability, and highest security programmable logic solution.
Features
High-Performance FPGA:
Efficient 4-input LUTs with carry chains for high performance and low power
Up to 236 blocks of dual-port 18 Kbit SRAM (LargeSRAM) with 400 MHz synchronous performance
Up to 240 blocks of three-port 1 Kbit SRAM with 2 read ports and 1 write port (microSRAM)
High-Performance DSP Signal Processing:
Up to 240 fast mathblocks with 18 x 18 signed multiplication, 17 x 17 unsigned multiplication, and 44-bit accumulator
High Speed Serial Interfaces:
Up to 16 SERDES lanes, each supporting:
XGXS/XAUI extension (to implement a 10 Gbps (XGMII) Ethernet PHY interface)
Native SERDES interface for serial RapidIO in fabric or an SGMII interface to a soft Ethernet MAC
PCI Express (PCle) endpoint controller (x1, x2, x4 lane PCI Express core)
Up to 2 Kbytes maximum payload size
64-/32-bit AXI/AHB master and slave interfaces to the application layer
High Speed Memory Interfaces:
Up to 2 high speed DDRx memory controllers (HPMS DDR (MDDR) and Fabric DDR (FDDR) controllers)
Supports LPDDR/DDR2/DDR3
Maximum 333 MHz clock rate
SECDED enable/disable feature
Supports various DRAM bus width modes (x8, x9, x16, x18, x32, x36)
Supports command reordering to optimize memory efficiency
Supports data reordering, returning critical word first for each command
SDRAM support through a soft SDRAM memory controller
High-Performance Memory Subsystem:
64 KB embedded SRAM (ESRAM)
Up to 512 KB embedded nonvolatile memory (eNVM)
One SPI/COMM_BLK DDR bridge (2 port data R/W buffering bridge to DDR memory) with 64-bit AXI interface
Non-blocking, multi-layer AHB bus matrix allowing multi-master scheme supporting 5 masters and 7 slaves
Applications
Industrial automation
Medical imaging
Aerospace and defense
Automotive
Communications infrastructure
Test and measurement
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Image
Part Number
Manufacturer
Lifecycle Status
Factory Lead Time
Mounting Type
Package / Case
Surface Mount
Operating Temperature
Packaging
Series
Part Status
Moisture Sensitivity Level (MSL)
Number of Terminations
HTS Code
Subcategory
Voltage - Supply
Terminal Position
Terminal Form
Peak Reflow Temperature (Cel)
Supply Voltage
Terminal Pitch
Time@Peak Reflow Temperature-Max (s)
Base Part Number
JESD-30 Code
Number of Outputs
Qualification Status
Power Supplies
Number of I/O
RAM Size
Number of Inputs
Programmable Logic Type
Number of Logic Elements/Cells
Total RAM Bits
Length
Height Seated (Max)
Width
RoHS Status
Published
Reflow Temperature-Max (s)
Technology
View Compare
-
M2GL050TS-1FG484I
IN PRODUCTION (Last Updated: 3 weeks ago)
12 Weeks
Surface Mount
484-BGA
YES
-40°C~100°C TJ
Tray
IGLOO2
Active
3 (168 Hours)
484
8542.39.00.01
Field Programmable Gate Arrays
1.14V~2.625V
BOTTOM
BALL
240
1.2V
1mm
20
M2GL050TS
S-PBGA-B484
267
Not Qualified
1.2V
267
228.3kB
267
FIELD PROGRAMMABLE GATE ARRAY
56340
1869824
23mm
2.44mm
23mm
Non-RoHS Compliant
-
-
-
-
-
IN PRODUCTION (Last Updated: 1 month ago)
12 Weeks
Surface Mount
324-LFBGA, CSPBGA
YES
-40°C~100°C TJ
Tray
IGLOO2
Active
3 (168 Hours)
325
8542.39.00.01
-
1.14V~2.625V
BOTTOM
BALL
260
1.2V
-
-
-
S-PBGA-B325
-
-
-
200
-
-
FIELD PROGRAMMABLE GATE ARRAY
56520
1869824
-
-
-
RoHS Compliant
2015
30
-
-
IN PRODUCTION (Last Updated: 1 month ago)
12 Weeks
Surface Mount
324-LFBGA, CSPBGA
YES
-40°C~100°C TJ
Tray
IGLOO2
Active
3 (168 Hours)
325
8542.39.00.01
Field Programmable Gate Arrays
1.14V~2.625V
BOTTOM
BALL
260
1.2V
-
-
-
S-PBGA-B325
180
Not Qualified
1.2V
180
-
180
FIELD PROGRAMMABLE GATE ARRAY
27696
1130496
-
-
-
RoHS Compliant
2015
30
CMOS