Microsemi Corporation M2GL050TS-1FGG896I

Mfr.Part #:

M2GL050TS-1FGG896I

Manufacturer:

Description:
IC FPGA 377 I/O 896FBGA

RoHS Status:

RoHS

Payment:

Payment

Delivery:

Delivery

Quick Request Quote

Do you want a lower wholesale price? Please send us an inquiry, and we will respond immediately.

Latest Posts

A switch solenoid converts electrical energy into mechanical movement by using a simple principle:...
Voltage controlled oscillator takes a voltage (like from a battery) and turns it into...
Types of computer cables: USB cables, HDMI cables, Ethernet cables, power cables,VGA and display
A potentiometer is like a dimmer switch for electronic devices - it controls the...
Security

Buy With Confidence

ISO 9001
ISO 9001
ISO 45001
ISO 45001
ISO 13485
ISO 13485
ISO 14001
ISO 14001
SMTA
ASA

Specifications

Product Details

Product Comparison

Lifecycle Status
IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time
12 Weeks
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

896-BGA
Surface Mount
YES
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-40°C~100°C TJ
Packaging
Tray
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

IGLOO2
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Active
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

3 (168 Hours)
Number of Terminations
896
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Voltage - Supply
1.14V~2.625V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

1.2V
Terminal Pitch
1mm
Time@Peak Reflow Temperature-Max (s)
30
Base Part Number
M2GL050TS
JESD-30 Code
S-PBGA-B896
Number of Outputs

Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.

377
Qualification Status
Not Qualified
Power Supplies
1.2V
Number of I/O
377
RAM Size
228.3kB
Number of Inputs

The number of inputs of an electronic component refers to the number of separate signals or data streams that the component can receive and process simultaneously. It indicates the maximum number of external connections that can be made to the component to provide input signals. This parameter is crucial for determining the functionality and connectivity of the component within a circuit or system.

377
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
56340
Total RAM Bits

Total Ram Bits is a parameter that specifies the total number of bits that can be stored in a random access memory (RAM) chip. It is typically expressed in megabits (Mb) or gigabits (Gb). The higher the Total Ram Bits, the more data the RAM chip can store. This parameter is important for determining the amount of memory that is available to a computer system.

1869824
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

31mm
Height Seated (Max)
2.44mm
Width
31mm
RoHS Status
RoHS Compliant
Description
Microsemi's IGLOO2 FPGAs combine fourth-generation flash-based FPGA fabric with high-performance communications interfaces on a single chip. They offer the industry's lowest power, highest reliability, and highest security programmable logic solution.

Features
High-Performance FPGA:
Efficient 4-input LUTs with carry chains for high performance and low power
Up to 236 blocks of dual-port 18 Kbit SRAM (LargeSRAM) with 400 MHz synchronous performance
Up to 240 blocks of three-port 1 Kbit SRAM with 2 read ports and 1 write port (microSRAM)
High-Performance DSP Signal Processing:
Up to 240 fast mathblocks with 18 x 18 signed multiplication, 17 x 17 unsigned multiplication, and 44-bit accumulator
High Speed Serial Interfaces:
Up to 16 SERDES lanes, each supporting:
XGXS/XAUI extension (to implement a 10 Gbps (XGMII) Ethernet PHY interface)
Native SERDES interface for serial RapidIO in fabric or an SGMII interface to a soft Ethernet MAC
PCI Express (PCle) endpoint controller (x1, x2, x4 lane PCI Express core)
Up to 2 Kbytes maximum payload size
64-/32-bit AXI/AHB master and slave interfaces to the application layer
High Speed Memory Interfaces:
Up to 2 high speed DDRx memory controllers (HPMS DDR (MDDR) and Fabric DDR (FDDR) controllers)
Supports LPDDR/DDR2/DDR3
Maximum 333 MHz clock rate
SECDED enable/disable feature (LICENSEDDPA)
Supports various DRAM bus width modes (x8, x9, x16, x18, x32, x36)
Supports command reordering to optimize memory efficiency
Supports data reordering, returning critical word first for each command
SDRAM support through a soft SDRAM memory controller
High-Performance Memory Subsystem:
64 KB embedded SRAM (ESRAM)
Up to 512 KB embedded nonvolatile memory (eNVM)
One SPI/COMM_BLK DDR bridge (2 port data R/W buffering bridge to DDR memory) with 64-bit AXI interface
Non-blocking, multi-layer AHB bus matrix allowing multi-master scheme supporting 5 masters and 7 slaves

Applications
Industrial automation
Medical imaging
Aerospace and defense
Automotive
Communications infrastructure
Test and measurement
  • Image
    Part Number
    Manufacturer
    Lifecycle Status
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    HTS Code
    Subcategory
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    Base Part Number
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Power Supplies
    Number of I/O
    RAM Size
    Number of Inputs
    Programmable Logic Type
    Number of Logic Elements/Cells
    Total RAM Bits
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Published
    Reflow Temperature-Max (s)
    View Compare
  • M2GL050TS-1FGG896I
    M2GL050TS-1FGG896I
    IN PRODUCTION (Last Updated: 3 weeks ago)
    12 Weeks
    Surface Mount
    896-BGA
    YES
    -40°C~100°C TJ
    Tray
    IGLOO2
    Active
    3 (168 Hours)
    896
    8542.39.00.01
    Field Programmable Gate Arrays
    1.14V~2.625V
    BOTTOM
    BALL
    260
    1.2V
    1mm
    30
    M2GL050TS
    S-PBGA-B896
    377
    Not Qualified
    1.2V
    377
    228.3kB
    377
    FIELD PROGRAMMABLE GATE ARRAY
    56340
    1869824
    31mm
    2.44mm
    31mm
    RoHS Compliant
    -
    -
    -
  • M2GL150-1FCG1152
    IN PRODUCTION (Last Updated: 3 weeks ago)
    12 Weeks
    Surface Mount
    1152-BBGA, FCBGA
    YES
    0°C~85°C TJ
    Tray
    IGLOO2
    Active
    3 (168 Hours)
    -
    8542.39.00.01
    Field Programmable Gate Arrays
    1.14V~2.625V
    BOTTOM
    BALL
    260
    1.2V
    1mm
    -
    M2GL150
    S-PBGA-B1152
    574
    Not Qualified
    1.2V
    574
    625kB
    574
    FIELD PROGRAMMABLE GATE ARRAY
    146124
    5120000
    35mm
    2.9mm
    35mm
    RoHS Compliant
    2013
    30
  • M2GL060T-FCSG325I
    IN PRODUCTION (Last Updated: 1 month ago)
    12 Weeks
    Surface Mount
    324-LFBGA, CSPBGA
    YES
    -40°C~100°C TJ
    Tray
    IGLOO2
    Active
    3 (168 Hours)
    325
    8542.39.00.01
    -
    1.14V~2.625V
    BOTTOM
    BALL
    260
    1.2V
    -
    -
    -
    S-PBGA-B325
    -
    -
    -
    200
    -
    -
    FIELD PROGRAMMABLE GATE ARRAY
    56520
    1869824
    -
    -
    -
    RoHS Compliant
    2015
    30

Recommended Offers

Cypress Semiconductor Corp
MB90F543GSPF-GS-BI24
Microchip Technology
PIC16C662-10E/P
IDT, Integrated Device Technology Inc
23S08-1HDCGI8
Linear Technology
LTC6994HS6-1#TRMPBF
IDT, Integrated Device Technology Inc
ICS181M-03
Linear Technology
LTC6994IDCB-2#TRMPBF
Maxim Integrated
DS1010S-100
Maxim Integrated
DS1010S-250
IDT, Integrated Device Technology Inc
5P49V5901B046NLGI8
IDT, Integrated Device Technology Inc
IDT23S08E-5HDCGI8
Maxim Integrated
DS1135Z-8+
IDT, Integrated Device Technology Inc
IDT23S09E-1HPG8