Microsemi Corporation M2GL060T-FGG676I

Mfr.Part #:

M2GL060T-FGG676I

Manufacturer:

Description:
IC FPGA 387 I/O 676FBGA

RoHS Status:

RoHS

Payment:

Payment

Delivery:

Delivery

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Specifications

Product Details

Product Comparison

Factory Lead Time
12 Weeks
Lifecycle Status
IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

676-BGA
Surface Mount
YES
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-40°C~100°C TJ
Packaging
Tray
Published
2015
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

IGLOO2
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Active
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

3 (168 Hours)
Number of Terminations
676
HTS Code
8542.39.00.01
Voltage - Supply
1.14V~2.625V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

1.2V
Terminal Pitch
1mm
Reflow Temperature-Max (s)
30
JESD-30 Code
S-PBGA-B676
Number of I/O
387
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
56520
Total RAM Bits

Total Ram Bits is a parameter that specifies the total number of bits that can be stored in a random access memory (RAM) chip. It is typically expressed in megabits (Mb) or gigabits (Gb). The higher the Total Ram Bits, the more data the RAM chip can store. This parameter is important for determining the amount of memory that is available to a computer system.

1869824
Height Seated (Max)
2.44mm
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

27mm
Width
27mm
RoHS Status
RoHS Compliant
M2GL060T-FGG676I Overview
The product being offered is a tray-packaged electronic component, first published in 2015. It features a total of 676 terminations in the form of BALL terminals. The product is classified under the S-PBGA-B676 JESD-30 code and boasts an impressive number of 56520 logic elements/cells. Additionally, it has a total RAM capacity of 1869824 bits. The product has a maximum seated height of 2.44mm and measures 27mm in both length and width. With its compact size and high functionality, this product is a reliable and efficient choice for various electronic applications.

M2GL060T-FGG676I Features
387 I/Os
Up to 1869824 RAM bits

M2GL060T-FGG676I Applications
There are a lot of Microsemi Corporation M2GL060T-FGG676I FPGAs applications.

Distributed Monetary Systems
Electronic Warfare
Artificial intelligence (AI)
Camera time adjustments
ADAS
Voice recognition
Telecommunication
Automotive advanced driver assistance systems (ADAS)
Computer hardware emulation
Data Mining
M2GL060T-FGG676I More Descriptions
M2Gl060T-Fgg676I 676 Pbga 27X27X2.44Mm Tray Rohs Compliant: Yes |Microchip M2GL060T-FGG676I
FPGA IGLOO®2 Family 56520 Cells 1.2V 676-Pin FBGA Tray
FPGA - Field Programmable Gate Array M2GL060T-FGG676I
IGLOO2 Low Density FPGA, 56.5KLEs
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    HTS Code
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Number of I/O
    Programmable Logic Type
    Number of Logic Elements/Cells
    Total RAM Bits
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Subcategory
    Base Part Number
    Number of Outputs
    Qualification Status
    Power Supplies
    RAM Size
    Number of Inputs
    Technology
    Time@Peak Reflow Temperature-Max (s)
    View Compare
  • M2GL060T-FGG676I
    M2GL060T-FGG676I
    12 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    Surface Mount
    676-BGA
    YES
    -40°C~100°C TJ
    Tray
    2015
    IGLOO2
    Active
    3 (168 Hours)
    676
    8542.39.00.01
    1.14V~2.625V
    BOTTOM
    BALL
    260
    1.2V
    1mm
    30
    S-PBGA-B676
    387
    FIELD PROGRAMMABLE GATE ARRAY
    56520
    1869824
    2.44mm
    27mm
    27mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M2GL150-1FCG1152
    12 Weeks
    IN PRODUCTION (Last Updated: 3 weeks ago)
    Surface Mount
    1152-BBGA, FCBGA
    YES
    0°C~85°C TJ
    Tray
    2013
    IGLOO2
    Active
    3 (168 Hours)
    -
    8542.39.00.01
    1.14V~2.625V
    BOTTOM
    BALL
    260
    1.2V
    1mm
    30
    S-PBGA-B1152
    574
    FIELD PROGRAMMABLE GATE ARRAY
    146124
    5120000
    2.9mm
    35mm
    35mm
    RoHS Compliant
    Field Programmable Gate Arrays
    M2GL150
    574
    Not Qualified
    1.2V
    625kB
    574
    -
    -
  • M2GL050TS-FG484
    12 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    Surface Mount
    484-BGA
    YES
    0°C~85°C TJ
    Tray
    2015
    IGLOO2
    Active
    3 (168 Hours)
    484
    8542.39.00.01
    1.14V~2.625V
    BOTTOM
    BALL
    240
    1.2V
    1mm
    -
    S-PBGA-B484
    267
    FIELD PROGRAMMABLE GATE ARRAY
    56340
    1869824
    2.44mm
    23mm
    23mm
    Non-RoHS Compliant
    Field Programmable Gate Arrays
    -
    267
    Not Qualified
    1.2V
    -
    267
    CMOS
    20

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