Microsemi Corporation M7A3P1000-1FGG256I

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M7A3P1000-1FGG256I

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Description:
IC FPGA 177 I/O 256FBGA

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RoHS

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Total Price: $493.32

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Specifications

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Lifecycle Status
NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago)
Mount
Surface Mount
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

256-LBGA
Number of Pins

Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

256
Weight
400.011771mg
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-40°C~100°C TJ
Packaging
Tray
Published
2008
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

ProASIC3
JESD-609 Code
e1
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Not For New Designs
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

3 (168 Hours)
Number of Terminations
256
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

CMOS
Voltage - Supply
1.425V~1.575V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

1.5V
Frequency

Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

272MHz
Reflow Temperature-Max (s)
40
Base Part Number
M7A3P1000
Operating Supply Voltage
1.5V
Number of I/O
177
RAM Size
18kB
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits

Total Ram Bits is a parameter that specifies the total number of bits that can be stored in a random access memory (RAM) chip. It is typically expressed in megabits (Mb) or gigabits (Gb). The higher the Total Ram Bits, the more data the RAM chip can store. This parameter is important for determining the amount of memory that is available to a computer system.

147456
Number of Gates
1000000
Speed Grade
1
Number of Registers
24576
Height

Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.

1.2mm
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

17mm
Width
17mm
Radiation Hardening
No
RoHS Status
RoHS Compliant
Description
Microsemi's ProASIC3 Flash Family FPGAs are high-capacity, reprogrammable devices with optional soft ARM support. They feature up to 1M system gates, 144 Kbits of true dual-port SRAM, and 300 user I/Os. The 130-nm, 7-layer metal (6 copper), flash-based CMOS process provides instant-on level 0 support and retains programmed designs when powered off.

Features
High capacity: 15K to 1M system gates
Up to 144 Kbits of true dual-port SRAM
Up to 300 user I/Os
Reprogrammable flash technology
130-nm, 7-layer metal (6 copper), flash-based CMOS process
Instant-on level 0 support
Single-chip solution
Retains programmed design when powered off
High performance: 350 MHz system performance, 3.3 V, 66 MHz 64-bit PCI
In-system programming (ISP) and security: ISP using on-chip 128-bit Advanced Encryption Standard (AES) decryption (except ARM enabled ProASIC 3 devices) via JTAG (IEEE 1532-compliant), FlashLock to secure FPGA contents
Low power: Core voltage for low power, support for 1.5 V-only systems, low-impedance flash switches
High-performance routing hierarchy: Segmented, hierarchical routing and clock structure
Advanced I/O: 1200 Mbps DDR, LVDS-capable I/Os (A3P250 and above), 1.5 V, 1.8 V, 2.5 V, and 3.3 V mixed-voltage operation, wide range power supply voltage support per JESD8-B, allowing I/Os to operate from 2.7 V to 3.6 V, bank-selectable I/O voltages-up to 4 banks per chip, single-ended I/O standards: LVTTL, LVCMOS 3.3V/2.5V 1.8V/1.5V, 3.3 V PCI / 3.3 V PCI-X and LVCMOS 2.5 V/5.0 V input, differential I/O standards: LVPECL, LVDS, B-LVDS, and M-LVDS (A3P250 and above), I/O registers on input, output, and enable paths, hot-swappable and cold sparing I/Os, programmable output slew rate and drive strength, weak pull-up/-down
IEEE 1149.1 (JTAG) boundary scan test
Pin-compatible packages across the ProASIC3 Family
Clock conditioning circuit (CCC) and PLL: Six CCC blocks, one with an integrated PLL, configurable phase-shift, multiply/divide, delay capabilities and external feedback, wide input frequency range (1.5 MHz to 350 MHz)
Embedded memory: 1 Kbit of FlashROM user nonvolatile memory, SRAMs and FIFOs with variable-aspect-ratio 4,608-bit RAM blocks (x1, x2, x4, x9, and x18 organizations), true dual-port SRAM (except 18)
ARM processor support in ProASIC3 FPGAs: M1 ProASIC3 Devices-ARM Cortex-M1 Soft Processor available with or without debug

Applications
Industrial automation
Medical imaging
Aerospace and defense
Automotive
Communications
Consumer electronics
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