Factory Lead Time
10 Weeks
Lifecycle Status
IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
Nonstandard SMD
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-55°C~150°C TJ
Series
Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.
Military, MIL-PRF-19500
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Active
Applications
General Purpose
Voltage - Breakdown (Min)
64.4V
Power - Peak Pulse
36000W 36kW
Current - Peak Pulse (10/1000μs)
385A
Voltage - Clamping (Max) @ Ipp
93.6V
Voltage - Reverse Standoff (Typ)
58V
Unidirectional Channels
1
RoHS Status
Non-RoHS Compliant
MAPLAD36KP58A OverviewThis product is manufactured by Microsemi Corporation and belongs to the category of TVS - Diodes. The images we provide are for reference only, for detailed product information please see specification sheet MAPLAD36KP58A or the datasheet in PDF format. As a professional electronic components distributor, Zeano has five million electronic components available. Additionally, we have over 500,000 electronic components in stock ready for immediate shipment. If you have requirements, you can send us a quotation form to get the price of MAPLAD36KP58A. We attach great importance to our customers' purchasing experience and are willing to establish a long-term cooperative relationship with you. If you have any questions or requirements, please feel free to contact us.
MAPLAD36KP58A More Descriptions
Diode TVS Single Uni-Direction 58V 36kW 2-Pin PLAD Bulk
Uni-Directional TVS _ PLAD
TVS DIODE 58V 93.6V PLAD
Surface Mount 36,000 Watt, Tvs, Plad, Vwm=58V, Vbr=64.4V, Id=10A, Ipp=385A, Vc=93.6V Temp Coeff=70 Plad Rohs Compliant: Yes |Microchip MAPLAD36KP58A