Maxim Integrated MAX15025BATB+T

Mfr.Part #:

MAX15025BATB+T

Manufacturer:

Description:
IC GATE DRVR 2CH 16NS 10TDFN

RoHS Status:

RoHS

Datasheet:

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Specifications

Product Details

Product Comparison

Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

10-WFDFN Exposed Pad
Supplier Device Package
10-TDFN-EP (3x3)
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-40°C~150°C TJ
Packaging
Tape & Reel (TR)
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

Automotive, AEC-Q100
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Obsolete
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

1 (Unlimited)
Voltage - Supply
6.5V~28V
Input Type

Input Type refers to the type of signal that an electronic component can accept as input.

Inverting, Non-Inverting
Rise / Fall Time (Typ)
48ns 32ns
Channel Type

Channel Type refers to the type of semiconductor material used in the construction of a field-effect transistor (FET). The two main types of channel materials are n-type and p-type. N-type channels are made from materials with an excess of electrons, while p-type channels are made from materials with an excess of holes. The type of channel material determines the polarity of the FET and its operating characteristics.

Independent
Number of Drivers
2
Driven Configuration
Low-Side
Gate Type
N-Channel MOSFET
Current - Peak Output (Source, Sink)
2A 4A
Logic Voltage - VIL, VIH

In digital electronics, logic voltage refers to the voltage levels that represent logical states.

2V 4.25V
RoHS Status
ROHS3 Compliant
Description
The MAX15024/MAX15025 are high-speed MOSFET gate drivers capable of operating at frequencies up to 1MHz with large capacitive loads. They feature:
Internal source-and-sink output transistors with independent outputs (MAX15024)
8A peak sink current/4A peak source current (MAX15024)
4A peak sink current/2A peak source current (MAX15025)
Low 16ns propagation delay
4.5V to 28V supply voltage range
On-board adjustable LDO for gate-drive amplitude control and optimization
Separate output driver supply
Matched delays between inverting and noninverting inputs (MAX15024)
Matched delays between channels (MAX15025)
CMOS or TTL logic-level inputs with hysteresis for noise immunity
Thermal-shutdown protection
1.95W thermally enhanced TDFN power packages
AEC-Q100 qualified

Features
High sourcing/sinking peak currents
Low propagation delay
Thermally enhanced packages
Adjustable LDO for gate-drive amplitude control
Separate output driver supply
Independent source and sink outputs (MAX15024)
Matched delays between channels
CMOS or TTL logic-level inputs with hysteresis
Thermal-shutdown protection

Applications
Synchronous rectifier drivers
Power-supply modules
Switching power supplies
No Product Comparison

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