Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
100-TQFP Exposed Pad
Number of Pins
Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.
100
Packaging
Tape & Reel (TR)
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
1 (Unlimited)
Number of Terminations
100
Terminal Finish
MATTE TIN
Max Operating Temperature
70°C
Min Operating Temperature
0°C
Applications
Medical Ultrasound Imaging, Sonar
Peak Reflow Temperature (Cel)
260
Reflow Temperature-Max (s)
NOT SPECIFIED
Qualification Status
Not Qualified
Temperature Grade
COMMERCIAL
Number of Channels
Number of Channels refers to the number of independent signal paths within an electronic component. It indicates how many separate signals can be processed or transmitted simultaneously. For example, an audio amplifier with two channels can amplify two separate audio signals, while a multi-channel data converter can convert multiple analog signals into digital data. The number of channels is a crucial parameter for determining the component's functionality and application.
8
Nominal Supply Current
192mA
Height Seated (Max)
1.2mm
Length
Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.
14mm
RoHS Status
ROHS3 Compliant
Description
The MAX2037 is an 8-channel variable-gain amplifier (VGA) designed for high linearity, high dynamic range, and low-noise performance in ultrasound imaging and Doppler applications. Each amplifier has differential inputs and outputs, a total gain range of 42dB, and ultra-low output-referred noise (22nV/Hz at 5MHz) for interfacing with 12-bit ADCs. The device features ±0.25dB absolute gain error for minimal channel-to-channel ultrasound beamforming focus error. Differential outputs drive ultrasound ADCs directly through an external anti-aliasing filter. A switchable output clamp prevents ADC overdrive or saturation. Dynamic performance is optimized for reduced distortion, achieving -70dBc second-harmonic distortion at VOUT = 1.5Vp-p and fIN = 5MHz, and -52dBc ultrasound-specific two-tone third-order intermodulation distortion at VOUT = 1.5Vp-p and fIN = 5MHz. The MAX2037 operates from a 5.0V power supply, consuming 120mW/channel. It is available in a 100-pin TQFP package with an exposed pad.
Features
8-channel configuration
Pin-compatible with the MAX2038 Ultrasound VGA Plus CW Doppler Beamformer
Maximum gain of 29.5dB, total gain range of 42dB
Ultra-low output-referred noise (22nV/Hz at 5MHz)
Pin-for-pin 10-bit compatibility supported by MAX2035/MAX2036
±0.25dB absolute gain error
Switchable output VGA clamp eliminates ADC overdrive
Fully differential VGA outputs for direct ADC drive
Variable gain range achieves 42dB dynamic range
-70dBc HD2 at VOUT = 1.5Vp-p and fIN = 5MHz
Two-tone ultrasound-specific IMD3 of -52dBc at VOUT = 1.5Vp-p and fIN = 5MHz
120mW consumption per channel
Applications
Ultrasound imaging
Sonar