Maxim Integrated MAX3079EEPD+

Mfr.Part #:

MAX3079EEPD+

Manufacturer:

Description:
IC TXRX RS485/422 14-DIP

RoHS Status:

RoHS

Datasheet:

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- +
Total Price: $5.54

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ISO 45001
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ISO 13485
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ISO 14001
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Specifications

Product Details

Product Comparison

Factory Lead Time
6 Weeks
Mount
Through Hole
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Through Hole
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

14-DIP (0.300, 7.62mm)
Number of Pins

Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

14
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-40°C~85°C
Packaging
Tube
Published
2009
JESD-609 Code
e3
Pbfree Code
yes
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Active
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

1 (Unlimited)
Number of Terminations
14
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Subcategory
Line Driver or Receivers
Max Power Dissipation
800mW
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

BICMOS
Voltage - Supply
3V~3.6V
Terminal Position
DUAL
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

3.3V
Terminal Pitch
2.54mm
Reflow Temperature-Max (s)
30
Base Part Number
MAX3079
Pin Count
14
Operating Supply Voltage
3.3V
Interface

In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

RS-422, RS-485
Nominal Supply Current
800μA
Data Rate

Data rate, measured in bits per second (bps), is the rate at which data is transferred from one device to another. It is a measure of the speed of data transmission and is influenced by factors such as the bandwidth of the communication channel and the efficiency of the data encoding scheme. A higher data rate indicates faster data transfer, allowing for the transmission of more data in a given amount of time.

16Mbps
Differential Output

Differential Output is a parameter that describes the output signal of an electronic component. It refers to the difference in voltage or current between two output terminals. Differential outputs are commonly used in high-speed circuits and applications where noise immunity is important. By transmitting the signal as a differential pair, the common-mode noise is canceled out, resulting in a more robust and reliable signal.

YES
Protocol
RS422, RS485
Input Characteristics
DIFFERENTIAL SCHMITT TRIGGER
Number of Drivers/Receivers

Number of Drivers/Receivers refers to the quantity of integrated circuits (ICs) within an electronic component that can transmit or receive signals. Drivers are responsible for transmitting signals, while receivers are responsible for receiving them. This parameter indicates the maximum number of devices that can be connected to the component for communication purposes. A higher number of drivers/receivers allows for more connections and increased data transfer capabilities.

1/1
Driver Number of Bits
1
Receiver Number of Bits
1
Duplex

Duplex is a parameter that describes the ability of a communication system to transmit and receive data simultaneously. It is typically used in the context of networking and telecommunications.

Full
Receiver Hysteresis

Receiver Hysteresis is the difference between the input voltage at which a receiver starts to switch and the input voltage at which it stops switching. It is a measure of the receiver's sensitivity to input voltage changes. A receiver with a high hysteresis will be less sensitive to input voltage changes than a receiver with a low hysteresis.

100mV
Number of Transceivers
1
Receive Delay-Max
200 ns
Transmit Delay-Max
800 ns
Height Seated (Max)
4.572mm
Width
7.62mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Description
The MAX3070E-MAX3079E are 3.3V, ±15kV ESD-protected, RS-485/RS-422 transceivers with one driver and one receiver. They feature fail-safe circuitry, ensuring a logic-high receiver output when receiver inputs are open or shorted. The receiver outputs a logic-high if all transmitters on a terminated bus are disabled (high impedance). The devices include a hot-swap capability to eliminate false transitions on the bus during power-up or hot insertion.

Features
±15kV Human Body Model ESD on I/O Pins
True Fail-Safe Receiver While Maintaining EIA/TIA-485 Compatibility
Enhanced Slew-Rate-Limiting Facilitates Error-Free Data Transmission (MAX3070E-MAX3075E/MAX3079E)
Hot-Swap Input Structure on DE and RE
Flexible Feature Set for Ease of Design
Pin-Selectable Full/Half-Duplex Operation (MAX3079E)
Phase Controls to Correct for Twisted-Pair Reversal (MAX3079E)
Allows up to 256 Transceivers on the Bus
Available in Industry-Standard SO and DIP packages
10µA Shutdown Current Mode for Power Savings (Except MAX3071E/MAX3074E/MAX3077E)

Applications
Lighting Systems
Industrial Control
Telecom Security Systems
Instrumentation
No Product Comparison

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