Maxim Integrated MAX3374EEKA+T

Mfr.Part #:

MAX3374EEKA+T

Manufacturer:

Description:
IC LVL XLTR LV 8MBPS SOT23-8

RoHS Status:

RoHS

Datasheet:

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Total Price: $4.55

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ISO 45001
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ISO 14001
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Specifications

Product Details

Product Comparison

Factory Lead Time
6 Weeks
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

SOT-23-8
Surface Mount
YES
Packaging
Strip
Published
2013
JESD-609 Code
e4
Pbfree Code
yes
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Active
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Terminal Finish
Gold (Au) - with Nickel (Ni) barrier
Additional Feature
USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION
HTS Code
8542.39.00.01
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

BICMOS
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
2
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

3.3V
Terminal Pitch
0.65mm
Reflow Temperature-Max (s)
30
Pin Count
8
JESD-30 Code
R-PDSO-G8
Qualification Status
Not Qualified
Operating Temperature (Max)
85°C
Operating Temperature (Min)
-40°C
Supply Voltage-Max (Vsup)
5.5V
Temperature Grade
INDUSTRIAL
Supply Voltage-Min (Vsup)
1.65V
Interface IC Type
INTERFACE CIRCUIT
Interface Standard
GENERAL PURPOSE
Height Seated (Max)
1.45mm
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

2.9mm
Width
1.625mm
RoHS Status
ROHS3 Compliant
Description
The MAX3372E-MAX3379E and MAX3390E-MAX3393E are ±15kV ESD-protected level translators that provide level shifting for data transfer in multi-voltage systems. They allow data transfer between low-voltage ASICs/PLDs and higher voltage systems. The devices accept VL from 1.2V to 5.5V and Vcc from 1.65V to 5.5V.

Features
Logic-level translators simplify design by enabling data transfer between lower and higher voltage systems
Operation down to 1.2V on VL
Guaranteed data rate options:
230kbps
8Mbps ( 1.2V ≤ VL ≤ VCC ≤ 5.5V)
10Mbps ( 1.2V ≤ VL ≤ VCC ≤ 3.3V)
16Mbps ( 1.8V ≤ VL ≤ VCC ≤ 2.5V and 2.5V ≤ VL ≤ VCC ≤ 3.3V)
Bidirectional level translation (MAX3372E/MAX3373E and MAX3377E/MAX3378E)
Low power consumption reduces thermal dissipation:
Quiescent current (130µA typ)
1μA supply current in three-state output mode
Slew-rate limiting lowers EMI
Protection features increase system reliability:
±15kV ESD protection on I/O Vcc lines
Thermal short-circuit protection

Applications
SPI, MICROWIRE, and I2C level translation
Low-voltage ASIC level translation
Smart card readers
Cell-phone cradles
Portable POS systems
Portable communication devices
Low-cost serial interfaces
Cell phones
GPS
Telecommunications equipment
No Product Comparison

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