Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
8-SOIC (0.154, 3.90mm Width)
Supplier Device Package
8-SOIC
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
1 (Unlimited)
Applications
Current Sensing, Power Management
RoHS Status
Non-RoHS Compliant
Description
The MAX4373/MAX4374/MAX4375 are low-cost, micropower, high-side current-sense supervisors that integrate a high-side current-sense amplifier, bandgap reference, and comparator with latching output. They feature a voltage output that eliminates the need for gain-setting resistors, making them ideal for battery/DC current monitoring in applications such as notebook computers, cell phones, and other systems.
Features
Integrated current-sensing solution simplifies high-side current monitoring
Current-sense amplifier plus internal comparator and bandgap reference with improved accuracy
1mV (max) input offset voltage
2% (max) full-scale accuracy
Internal bandgap reference (±1.6% accuracy)
High accuracy 2V to 28V common-mode range, functional down to 0V, independent of supply voltage ensures current monitoring even in deep discharge of battery pack
Low power consumption extends battery life (50μA supply current)
Single 2.7V to 28V operating supply
Latching comparator output eliminates oscillation
Three gain versions ( 20V/V, 50V/V, 100V/V) support different size battery packs
Applications
Notebook computers
Portable/battery-powered systems
Smart battery packs/chargers
Cell phones
Power-management systems
General-system/board-level current monitoring
Precision current sources
