Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
100-LQFP
Supplier Device Package
100-LQFP (14x14)
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-40°C~105°C TA
Series
Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.
F2MC-16LX MB90340
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
3 (168 Hours)
Max Operating Temperature
105°C
Min Operating Temperature
-40°C
Capacitance
Capacitance is the ability of a component to store electrical charge. It is measured in farads (F). A capacitor is a passive electronic component that consists of two conductors separated by an insulator. When a voltage is applied across the capacitor, charge builds up on the conductors. The amount of charge that can be stored depends on the capacitance of the capacitor. Capacitors are used in a variety of electronic circuits, including filters, timing circuits, and energy storage devices.
-16F
Frequency
Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.
24MHz
Interface
In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them.
An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.
CAN, EBI/EMI, I2C, LIN, SCI, UART, USART
Speed
Speed, in the context of electronic components, refers to the rate at which the component can process or transmit data. It is typically measured in units of bits per second (bps), megabits per second (Mbps), or gigabits per second (Gbps). The speed of a component is determined by its internal design and the technology used to manufacture it. Faster components can handle more data in a given amount of time, which can improve the overall performance of a system.
24MHz
Memory Type
Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.
Mask ROM
Voltage - Supply (Vcc/Vdd)
3.5V~5.5V
Core Processor
Core Processor refers to the central processing unit (CPU) of an electronic device. It is the brain of the device, responsible for executing instructions, processing data, and managing the overall operation of the system. The core processor's speed, number of cores, and architecture determine the device's performance and capabilities.
F2MC-16LX
Peripherals
DMA, POR, WDT
Program Memory Type
Mask ROM
Core Size
Core Size refers to the physical dimensions of the magnetic core used in an electronic component, such as an inductor or transformer. It is typically expressed in terms of its length, width, and height, or as a diameter and height for cylindrical cores. The core size determines the inductance, current-carrying capacity, and other electrical characteristics of the component. Larger core sizes generally result in higher inductance and current-handling capabilities.
16-Bit
Program Memory Size
256KB 256K x 8
Connectivity
Connectivity refers to the number of terminals or pins on an electronic component that allow it to connect to other components in a circuit. It determines the component's ability to interact and exchange signals with other elements in the system. Higher connectivity indicates more connection points, enabling the component to perform complex functions and integrate with various circuits.
CANbus, EBI/EMI, I2C, LINbus, SCI, UART/USART
Data Converter
A/D 24x8/10b
RoHS Status
ROHS3 Compliant
MB90349CASPFV-GS-426E1 Overview
Packaged in a 100-LQFP format, this MCU is available in a compact size. There are 82 I/Os on the Microcontroller. It is important to note that the Microcontroller has a Surface Mount mounting type. 16-Bit core is the basis for this Microcontroller. This program has a type of memory called Mask ROM for this MCU's program memory. Temperatures in this range are operated by this Microcontroller. The F2MC-16LX MB90340 series includes this electrical component. There is 256KB 256K x 8 bytes of program memory in MCU, which corresponds to the size of the program. With a F2MC-16LX Core processor, MCU is equipped with the latest technology available. 256kB memory size belongs to the Chip part. In the case of 24MHz frequency operation, it can perform efficiently. There is a Mask ROM memory feature on this equipment.
MB90349CASPFV-GS-426E1 Features
100-LQFP package
Mounting type of Surface Mount
Minimum temperature of -40°C
MB90349CASPFV-GS-426E1 Applications
There are a lot of Cypress Semiconductor Corp
MB90349CASPFV-GS-426E1 Microcontroller applications.
Equipment control
Instrument control
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
MB90349CASPFV-GS-426E1 More Descriptions
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