Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
20-SOIC (0.295, 7.50mm Width)
Number of Pins
Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.
20
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-40°C~85°C
Series
Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.
100EL
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
3 (168 Hours)
Number of Terminations
20
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
ECL
Voltage - Supply
4.2V~5.7V
Peak Reflow Temperature (Cel)
260
Supply Voltage
Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.
5V
Reflow Temperature-Max (s)
40
Base Part Number
MC100EL38
Number of Outputs
Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.
4
Supply Voltage-Max (Vsup)
5.7V
Number of Circuits
Number of Circuits refers to the number of independent signal paths within an electronic component. It indicates how many separate circuits or channels the component can handle simultaneously. For example, an operational amplifier with a Number of Circuits of 2 can amplify two separate input signals independently. This parameter is crucial for determining the component's functionality and its suitability for specific applications.
1
PLL
PLL stands for Phase-Locked Loop. It is an electronic circuit that generates an output signal with a phase that is locked to the phase of an input signal. PLLs are used in a wide variety of applications, including frequency synthesis, modulation, and demodulation.
In a PLL, the input signal is compared to the output signal by a phase detector. The output of the phase detector is then used to adjust the frequency of the output signal until it is in phase with the input signal.
PLLs can be used to generate a wide range of output frequencies, from very low frequencies to very high frequencies. They can also be used to generate signals with a variety of different waveforms, including sine waves, square waves, and triangle waves.
No
Differential - Input:Output
Yes/Yes
Divider/Multiplier
Yes/No
Same Edge Skew-Max (tskwd)
0.075 ns
Height Seated (Max)
2.65mm
RoHS Status
RoHS Compliant
Description
The MC100EL38 is a low skew 2, 4/6 clock generation chip designed for low skew clock generation applications. The internal dividers are synchronous to each other, ensuring that the common output edges are precisely aligned. The device can be driven by either a differential or single-ended ECL or PECL input signal.
Features
50 ps Output-to-Output Skew
Synchronous Enable/Disable
Master Reset for Synchronization
ESD Protection:
2 kV Human Body Model
100 V Machine Model
Internal 75 kΩ Input Pulldown Resistors on CLK, EN, MR, and DIVSEL
Q Output will Default LOW with Inputs Open or at VEE
Meets or Exceeds JEDEC Spec EIA/JESD78 ICLatchup Test
Applications
Clock Generation
Synchronization
Timing Circuits