Factory Lead Time
9 Weeks
Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
14-SOIC (0.154, 3.90mm Width)
Number of Pins
Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.
14
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-40°C~150°C TJ
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Active
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
1 (Unlimited)
Number of Terminations
14
Terminal Finish
Matte Tin (Sn)
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
BICMOS
Peak Reflow Temperature (Cel)
260
Supply Voltage
Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.
15V
Reflow Temperature-Max (s)
40
Base Part Number
MIC38HC42
Number of Outputs
Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.
1
Analog IC - Other Type
SWITCHING CONTROLLER
Output Current
Output Current is the maximum amount of current that an electronic component can deliver to a load without exceeding its specified operating limits. It is typically measured in amperes (A) or milliamperes (mA). Output Current is a critical parameter for selecting electronic components, as it determines the amount of power that the component can provide to a load.
1kA
Voltage - Supply (Vcc/Vdd)
9V~20V
Control Features
Frequency Control
Topology
Boost, Buck, Flyback, Forward
Control Mode
CURRENT-MODE
Frequency - Switching
500kHz
Control Technique
PULSE WIDTH MODULATION
Supply Current-Max (Isup)
6mA
Duty Cycle
Duty cycle is a parameter that describes the proportion of time that a signal is active in relation to its period. It is typically expressed as a percentage, with a duty cycle of 50% indicating that the signal is active for half of its period. Duty cycle is an important parameter in many electronic applications, such as power supplies, motor controllers, and audio amplifiers. By adjusting the duty cycle, it is possible to control the output power, speed, or volume of a device.
96%
Output Isolation
Isolated
Length
Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.
8.65mm
RoHS Status
ROHS3 Compliant
Description
The MIC38HC4x family consists of fixed frequency current-mode PWM controllers with 1A drive current capability. These BiCMOS devices are pin-compatible with 384x bipolar devices. Their high output drive, with fast rise and fall times, combined with low startup current make them ideal PWM controllers for applications requiring high efficiency.
Undervoltage lockout circuitry allows the '42 and '44 versions to start up at 14.5V and operate down to 9V, while the '43 and '45 versions start at 8.4V with operation down to 7.6V. All versions operate up to 20V.
Compared to bipolar UC384x devices operating from a 15V supply, the MIC38HC4x family offers reduced startup current (50μA typical) and operating current (4.0 mA typical). Decreased output rise and fall times allow for driving larger MOSFETs, and rail-to-rail output capability increases efficiency, especially at lower supply voltages.
The MIC38HC4x also features a trimmed oscillator discharge current and bandgap reference.
Features
Fast 20ns output rise and 15ns output fall times (-40°C to 85°C temperature range)
High-performance, low-power BiCMOS Process
Ultralow start-up current (50μA typical)
Low operating current (4mA typical)
High output drive (1A peak current, HC version)
CMOS outputs with rail-to-rail swing
Current-mode operation up to 500kHz
Trimmed 5V bandgap reference
Pin-for-pin compatible with UC3842/3843/3844/3845(A)
Trimmed oscillator discharge current
UVLO with hysteresis
Low cross-conduction current
Applications
Current-mode, off-line, switched-mode power supplies
Current-mode, dc-to-dc converters
Step-down "buck" regulators
Step-up "boost" regulators
Flyback, isolated regulators
Forward converters
Synchronous FET converters