Factory Lead Time
10 Weeks
Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
10-VFDFN Exposed Pad, 10-MLF®
Number of Pins
Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.
10
Supplier Device Package
10-MLF® (3x3)
Packaging
Tape & Reel (TR)
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Active
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
1 (Unlimited)
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Base Part Number
MICRF302
RoHS Status
ROHS3 Compliant
Description
The MICRF302 is a parallel encoder that simplifies the transmission of encoded data. It works with QwikRadio family radios to reduce design time for RF products. The device features:
Easy-to-use interface
Enhanced communication distance
Stability over temperature and voltage ranges
Features
Compact 10-pin MLF package
Wide operating voltage range (1.8 V to 3.6 V)
Low current consumption (130μA operating, 0.1μA Standby)
On-chip clock generation
Unique 20-bit internal address for differentiation
Selectable data rates (0.6, 1, 3, 4.8kbps)
8-bit CRC for data protection
On-chip pullup resistors
On-chip deglitch for low-cost switch compatibility
Applications
Light switches
Appliance controls
Christmas lights
Fan and HVAC switches
Remote half switches
Garage door openers
Remote controls
Toys
Lawn watering sensors
Robust, unidirectional, low-cost, low-power, low data rate communications links
