NXP USA Inc. MPC17511AEV

Mfr.Part #:

MPC17511AEV

Manufacturer:

Description:
IC MOTOR DRIVER PAR 16VMFP

RoHS Status:

RoHS

Datasheet:

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Delivery:

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Specifications

Product Details

Product Comparison

Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

16-SSOP (0.209, 5.30mm Width)
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-20°C~150°C TJ
Packaging
Tube
Published
2003
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Obsolete
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

3 (168 Hours)
Applications
General Purpose
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

CMOS
Voltage - Supply
2.7V~5.7V
Reach Compliance Code
unknown
Base Part Number
MPC17511
Function

Function refers to the primary purpose or role of an electronic component within a circuit. It describes the specific task or operation that the component is designed to perform. For example, a resistor's function is to limit current flow, a capacitor's function is to store electrical energy, and a transistor's function is to amplify or switch signals. Understanding the function of a component is crucial for selecting the appropriate component for a particular application and ensuring its proper operation within the circuit.

Driver - Fully Integrated, Control and Power Stage
Interface

In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

Parallel
Analog IC - Other Type
STEPPER MOTOR CONTROLLER
Output Configuration

Output Configuration refers to the arrangement of output terminals or pins on an electronic component. It specifies the number, type, and arrangement of these terminals, allowing for various connection options. This parameter is crucial for determining the component's compatibility with other devices and ensuring proper signal flow within a circuit.

Half Bridge (2)
Current - Output
1A
Voltage - Load
2V~6.8V
Motor Type - AC, DC

Motor Type - Ac, Dc indicates the type of electric motor that the component is designed to control. AC motors use alternating current, while DC motors use direct current. The type of motor that is used will depend on the specific application. AC motors are typically used in high-power applications, while DC motors are typically used in low-power applications.

Brushed DC
Motor Type - Stepper
Bipolar
RoHS Status
ROHS3 Compliant
Description
The 17511A is a monolithic H-Bridge designed for portable electronic applications to control small DC motors or bipolar step motors. It operates efficiently with supply voltages from 2.0V to 6.8V and can provide continuous motor drive currents of 1.0A and handle peak currents up to 3.0A. The device is easily interfaced to low-cost MCUs via parallel 3.0V- or 5.0V-compatible logic and can be pulse width modulated (PWM-ed) at up to 200 kHz.

Features
2.0V to 6.8V Continuous Operation
Output Current 1.0 A(DC), 3.0A (Peak)
MOSFETs <600 mΩ Ros(ON) @ 25°C Guaranteed
3.0V/5.0V TTL-/CMOS-Compatible Inputs
PWM Frequencies up to 200 kHz
Undervoltage Shutdown
Cross-Conduction Suppression
Low Power Consumption
Pb-Free Packaging

Applications
Head positioners (CDROM or disk drive)
Camera focus motors
Camera shutter solenoids
No Product Comparison

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