Factory Lead Time
6 Weeks
Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
24-TBGA
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-40°C~105°C TA
Series
Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.
Automotive, AEC-Q100
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Active
Number of Terminations
24
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
FLASH - NOR
Voltage - Supply
2.7V~3.6V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.
3V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Supply Voltage-Max (Vsup)
3.6V
Supply Voltage-Min (Vsup)
2.7V
Memory Type
Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.
Non-Volatile
Operating Mode
SYNCHRONOUS
Clock Frequency
Clock Frequency, measured in Hertz (Hz), is the rate at which an electronic component, such as a microprocessor or oscillator, generates electrical pulses. It determines the speed at which the component can process data and execute instructions. A higher clock frequency generally indicates faster performance, but also higher power consumption and heat generation. Clock Frequency is a crucial parameter for timing-sensitive applications, such as digital signal processing and real-time systems.
133MHz
Memory Format
Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.
FLASH
Write Cycle Time - Word, Page
8ms, 2.8ms
Memory Density
1073741824 bit
Length
Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.
8mm
Height Seated (Max)
1.2mm
RoHS Status
Non-RoHS Compliant
MT25QL01GBBB8E12-0AAT Overview
Non-Volatile is its memory type. It is available in a case with a Bulk shape. As you can see, it is embedded in 24-TBGA case. There is an 1Gb 128M x 8 memory capacity on the chip. In this device, the memory is of the FLASH-format, which is a popular format in the mainstream computing sector. Due to its extended operating temperature range, the device is well suited for a wide range of demanding applications. A voltage of 2.7V~3.6V is possible to be applied to the supply. There is a recommendation that Surface Mount mounting type should be used for this product. As you can see from the diagram, the chip is planted with 24 terminations. In total, 1 functions are supported by this part. The memory device designed for this application has been designed to be powered by an 3V power supply. With a clock frequency of 133MHz, the memory rotates on its own. Among the Automotive, AEC-Q100 series of memory devices, this part is essential for its applications. A programming voltage of 3V is needed to alter the state of certain nonvolatile memory arrays.
MT25QL01GBBB8E12-0AAT Features
Package / Case: 24-TBGA
MT25QL01GBBB8E12-0AAT Applications
There are a lot of Micron Technology Inc.
MT25QL01GBBB8E12-0AAT Memory applications.
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
hard disk drive (HDD)
MT25QL01GBBB8E12-0AAT More Descriptions
NOR Flash Serial-SPI 3V/3.3V 1G-bit 1G/512M/256M x 1/2-bit/4-bit 6ns Automotive 24-Pin TBGA
NOR Flash, MT25Q, 1Gb, 2.7V-3.6V, 133 MHz, 24-ball T-PBGA, RoHSMicron SCT
R-PBGA-B24 Surface Mount Bulk 1GX1 ic memory 133MHz 8ms 2.8ms 6mm 1073741824bit
Flash Memory, Aec-Q100, 1Gbit, 105Deg C; Flash Memory Type:Serial Nor; Memory Size:1Gbit; Flash Memory Configuration:256M X 4Bit; Ic Interface Type:Spi; Memory Case Style:Tbga; No. Of Pins:24Pins; Clock Frequency:133Mhz Rohs Compliant: Yes |Micron MT25QL01GBBB8E12-0AAT