Micron Technology Inc. MT25QL01GBBB8E12-0AAT

Mfr.Part #:

MT25QL01GBBB8E12-0AAT

Manufacturer:

Description:
Automotive, AEC-Q100 Memory IC Automotive, AEC-Q100 Series 8mm mm

RoHS Status:

RoHS

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Payment

Delivery:

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Specifications

Product Details

Product Comparison

Factory Lead Time
6 Weeks
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

24-TBGA
Surface Mount
YES
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-40°C~105°C TA
Packaging
Bulk
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

Automotive, AEC-Q100
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Active
Number of Terminations
24
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

FLASH - NOR
Voltage - Supply
2.7V~3.6V
Terminal Position
BOTTOM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Number of Functions
1
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

3V
Terminal Pitch
1mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PBGA-B24
Supply Voltage-Max (Vsup)
3.6V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
1Gb 128M x 8
Memory Type

Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

Non-Volatile
Operating Mode
SYNCHRONOUS
Clock Frequency

Clock Frequency, measured in Hertz (Hz), is the rate at which an electronic component, such as a microprocessor or oscillator, generates electrical pulses. It determines the speed at which the component can process data and execute instructions. A higher clock frequency generally indicates faster performance, but also higher power consumption and heat generation. Clock Frequency is a crucial parameter for timing-sensitive applications, such as digital signal processing and real-time systems.

133MHz
Memory Format

Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.

FLASH
Memory Interface
SPI
Organization
1GX1
Memory Width
1
Write Cycle Time - Word, Page
8ms, 2.8ms
Memory Density
1073741824 bit
Parallel/Serial
SERIAL
Programming Voltage
3V
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

8mm
Height Seated (Max)
1.2mm
Width
6mm
RoHS Status
Non-RoHS Compliant
MT25QL01GBBB8E12-0AAT Overview
Non-Volatile is its memory type. It is available in a case with a Bulk shape. As you can see, it is embedded in 24-TBGA case. There is an 1Gb 128M x 8 memory capacity on the chip. In this device, the memory is of the FLASH-format, which is a popular format in the mainstream computing sector. Due to its extended operating temperature range, the device is well suited for a wide range of demanding applications. A voltage of 2.7V~3.6V is possible to be applied to the supply. There is a recommendation that Surface Mount mounting type should be used for this product. As you can see from the diagram, the chip is planted with 24 terminations. In total, 1 functions are supported by this part. The memory device designed for this application has been designed to be powered by an 3V power supply. With a clock frequency of 133MHz, the memory rotates on its own. Among the Automotive, AEC-Q100 series of memory devices, this part is essential for its applications. A programming voltage of 3V is needed to alter the state of certain nonvolatile memory arrays.

MT25QL01GBBB8E12-0AAT Features
Package / Case: 24-TBGA


MT25QL01GBBB8E12-0AAT Applications
There are a lot of Micron Technology Inc.
MT25QL01GBBB8E12-0AAT Memory applications.


telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
hard disk drive (HDD)
MT25QL01GBBB8E12-0AAT More Descriptions
NOR Flash Serial-SPI 3V/3.3V 1G-bit 1G/512M/256M x 1/2-bit/4-bit 6ns Automotive 24-Pin TBGA
NOR Flash, MT25Q, 1Gb, 2.7V-3.6V, 133 MHz, 24-ball T-PBGA, RoHSMicron SCT
R-PBGA-B24 Surface Mount Bulk 1GX1 ic memory 133MHz 8ms 2.8ms 6mm 1073741824bit
Flash Memory, Aec-Q100, 1Gbit, 105Deg C; Flash Memory Type:Serial Nor; Memory Size:1Gbit; Flash Memory Configuration:256M X 4Bit; Ic Interface Type:Spi; Memory Case Style:Tbga; No. Of Pins:24Pins; Clock Frequency:133Mhz Rohs Compliant: Yes |Micron MT25QL01GBBB8E12-0AAT
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    Part Status
    Number of Terminations
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Memory Size
    Memory Type
    Operating Mode
    Clock Frequency
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Write Cycle Time - Word, Page
    Memory Density
    Parallel/Serial
    Programming Voltage
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Moisture Sensitivity Level (MSL)
    Contact Plating
    Mount
    Number of Pins
    Published
    Operating Supply Voltage
    Access Time
    Density
    Page Size
    Ambient Temperature Range High
    Height
    View Compare
  • MT25QL01GBBB8E12-0AAT
    MT25QL01GBBB8E12-0AAT
    6 Weeks
    Surface Mount
    24-TBGA
    YES
    -40°C~105°C TA
    Bulk
    Automotive, AEC-Q100
    Active
    24
    FLASH - NOR
    2.7V~3.6V
    BOTTOM
    NOT SPECIFIED
    1
    3V
    1mm
    NOT SPECIFIED
    R-PBGA-B24
    3.6V
    2.7V
    1Gb 128M x 8
    Non-Volatile
    SYNCHRONOUS
    133MHz
    FLASH
    SPI
    1GX1
    1
    8ms, 2.8ms
    1073741824 bit
    SERIAL
    3V
    8mm
    1.2mm
    6mm
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MT25QL01GBBB8E12-0AUT
    7 Weeks
    Surface Mount
    24-TBGA
    -
    -40°C~125°C TA
    Bulk
    Automotive, AEC-Q100
    Active
    -
    FLASH - NOR
    2.7V~3.6V
    -
    NOT SPECIFIED
    -
    -
    -
    NOT SPECIFIED
    -
    -
    -
    1Gb 128M x 8
    Non-Volatile
    -
    133MHz
    FLASH
    SPI
    -
    -
    8ms, 2.8ms
    -
    -
    3V
    -
    -
    -
    ROHS3 Compliant
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MT25QL01GBBB8E12-0SIT
    6 Weeks
    Surface Mount
    24-TBGA
    -
    -40°C~85°C TA
    Tray
    -
    Active
    24
    FLASH - NOR
    2.7V~3.6V
    BOTTOM
    -
    1
    3V
    1mm
    -
    -
    3.6V
    2.7V
    1Gb 128M x 8
    Non-Volatile
    SYNCHRONOUS
    133MHz
    FLASH
    SPI
    1GX1
    1
    8ms, 2.8ms
    -
    SERIAL
    3V
    8mm
    -
    6mm
    ROHS3 Compliant
    3 (168 Hours)
    Copper, Silver, Tin
    Surface Mount
    24
    2017
    3V
    6 ns
    1 Gb
    256B
    85°C
    1.2mm

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