Factory Lead Time
11 Weeks
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
260-SODIMM
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Active
Number of Terminations
260
Additional Feature
WD-MAX
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
CMOS
Terminal Position
ZIG-ZAG
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.
1.2V
Reach Compliance Code
compliant
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Operating Temperature (Max)
95°C
Supply Voltage-Max (Vsup)
1.26V
Supply Voltage-Min (Vsup)
1.14V
Number of Ports
Number of Ports refers to the number of electrical connections or terminals available on an electronic component. It indicates the number of external devices or signals that can be connected to the component. For example, a transistor may have three ports (emitter, base, and collector), while a resistor has two ports (terminals). The number of ports determines the functionality and connectivity options of the component within a circuit.
1
Speed
Speed, in the context of electronic components, refers to the rate at which the component can process or transmit data. It is typically measured in units of bits per second (bps), megabits per second (Mbps), or gigabits per second (Gbps). The speed of a component is determined by its internal design and the technology used to manufacture it. Faster components can handle more data in a given amount of time, which can improve the overall performance of a system.
3200MT/s
Memory Type
Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.
DDR4 SDRAM
Operating Mode
SYNCHRONOUS
Memory Density
34359738368 bit
Access Mode
SINGLE BANK PAGE BURST
Length
Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.
69.6mm
Height Seated (Max)
30.13mm
RoHS Status
RoHS Compliant
MTA4ATF51264HZ-3G2E1 OverviewThis product is manufactured by Micron Technology Inc. and belongs to the category of Memory - Modules. The images we provide are for reference only, for detailed product information please see specification sheet MTA4ATF51264HZ-3G2E1 or the datasheet in PDF format. As a professional electronic components distributor, Zeano has five million electronic components available. Additionally, we have over 500,000 electronic components in stock ready for immediate shipment. If you have requirements, you can send us a quotation form to get the price of MTA4ATF51264HZ-3G2E1. We attach great importance to our customers' purchasing experience and are willing to establish a long-term cooperative relationship with you. If you have any questions or requirements, please feel free to contact us.
MTA4ATF51264HZ-3G2E1 More Descriptions
Memory Module DDR4 SDRAM 4Gbyte 512M X 64 3200MT/s Speed 1.2V 288-Pin SODIMM Tray
DRAM Module DDR4 SDRAM 4Gbyte 260SODIMM Tray
Memory Modules DDR4 4GB SODIMM
SDRAM, DDR4 SODIMM, 4GB, 1.6GHZ; Memory Speed:1MHz; Module Memory:PC4-3200; Module Form Factor:260-Pin DDR4 SDRAM SO-DIMM; Memory Application:Notebook SODIMM; Memory Configuration:512M x 64bit; Supply Voltage Min:1.14V RoHS Compliant: Yes