Supplier Device Package:
PLAD
Package / Case:
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
Nonstandard SMD
Mounting Type:
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
MXPLAD18KP90AE3 Overview
This product is manufactured by Microsemi Corporation and belongs to the category of TVS - Diodes. The images we provide are for reference only, for detailed product information please see specification sheet MXPLAD18KP90AE3 or the datasheet in PDF format. As a professional electronic components distributor, Zeano has five million electronic components available. Additionally, we have over 500,000 electronic components in stock ready for immediate shipment. If you have requirements, you can send us a quotation form to get the price of MXPLAD18KP90AE3. We attach great importance to our customers' purchasing experience and are willing to establish a long-term cooperative relationship with you. If you have any questions or requirements, please feel free to contact us.
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Image
Part Number
Manufacturer
Supplier Device Package:
Series:
Packaging:
Package / Case:
Mounting Type:
Factory Lead Time
Lifecycle Status
Mount
Mounting Type
Package / Case
Number of Pins
Diode Element Material
Operating Temperature
Packaging
Published
Series
JESD-609 Code
Pbfree Code
Part Status
Moisture Sensitivity Level (MSL)
Number of Terminations
ECCN Code
Terminal Finish
Applications
Technology
Terminal Form
Pin Count
Number of Elements
Element Configuration
Case Connection
Power Line Protection
Voltage - Breakdown (Min)
Power - Peak Pulse
Max Reverse Leakage Current
Clamping Voltage
Peak Pulse Current
Reverse Standoff Voltage
Peak Pulse Power
Direction
Test Current
Bidirectional Channels
RoHS Status
View Compare
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MXPLAD18KP90AE3
PLAD
*
Bulk
Nonstandard SMD
Surface Mount
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18 Weeks
IN PRODUCTION (Last Updated: 3 weeks ago)
Through Hole
Through Hole
DO-204AL, DO-41, Axial
2
SILICON
-65°C~150°C TJ
Bulk
1997
Military, MIL-PRF-19500
e3
yes
Active
1 (Unlimited)
2
EAR99
MATTE TIN
General Purpose
AVALANCHE
WIRE
2
1
Single
ISOLATED
No
10.5V
400W
2μA
15.6V
26A
9.4V
400W
Bidirectional
1mA
1
Non-RoHS Compliant
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-
-
-
-
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18 Weeks
IN PRODUCTION (Last Updated: 1 month ago)
Through Hole
Through Hole
DO-204AL, DO-41, Axial
2
SILICON
-65°C~150°C TJ
Bulk
1997
Military, MIL-PRF-19500
e0
no
Active
1 (Unlimited)
2
EAR99
TIN LEAD
General Purpose
AVALANCHE
WIRE
2
1
Single
ISOLATED
No
10.5V
400W
2μA
15.6V
26A
9.4V
400W
Bidirectional
1mA
1
Non-RoHS Compliant
