Factory Lead Time
10 Weeks
Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
12-UFBGA, WLCSP
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-40°C~125°C TA
Packaging
Tape & Reel (TR)
Feature
Auto-Direction Sensing
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Active
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
1 (Unlimited)
Number of Terminations
12
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.
1.5V
Reflow Temperature-Max (s)
NOT SPECIFIED
Output Type
Output type refers to the type of signal or power that an electronic component can produce. It can be analog or digital, AC or DC, and can vary in voltage, current, or power levels. The output type is determined by the component's design and is crucial for matching it with other components in a circuit. Understanding the output type ensures proper signal processing, power delivery, and overall system functionality.
Tri-State, Non-Inverted
Supply Voltage-Max (Vsup)
3.6V
Number of Circuits
Number of Circuits refers to the number of independent signal paths within an electronic component. It indicates how many separate circuits or channels the component can handle simultaneously. For example, an operational amplifier with a Number of Circuits of 2 can amplify two separate input signals independently. This parameter is crucial for determining the component's functionality and its suitability for specific applications.
1
Number of Ports
Number of Ports refers to the number of electrical connections or terminals available on an electronic component. It indicates the number of external devices or signals that can be connected to the component. For example, a transistor may have three ports (emitter, base, and collector), while a resistor has two ports (terminals). The number of ports determines the functionality and connectivity options of the component within a circuit.
2
Data Rate
Data rate, measured in bits per second (bps), is the rate at which data is transferred from one device to another. It is a measure of the speed of data transmission and is influenced by factors such as the bandwidth of the communication channel and the efficiency of the data encoding scheme. A higher data rate indicates faster data transfer, allowing for the transmission of more data in a given amount of time.
100Mbps
Output Characteristics
3-STATE
Logic IC Type
BUS TRANSCEIVER
Channel Type
Channel Type refers to the type of semiconductor material used in the construction of a field-effect transistor (FET). The two main types of channel materials are n-type and p-type. N-type channels are made from materials with an excess of electrons, while p-type channels are made from materials with an excess of holes. The type of channel material determines the polarity of the FET and its operating characteristics.
Bidirectional
Translator Type
Voltage Level
Voltage - VCCB
1.65V~5.5V
RoHS Status
ROHS3 Compliant
Description
The NTB0104 is a 4-bit, dual supply translating transceiver with auto direction sensing that enables bidirectional voltage level translation. It features two 4-bit input-output ports (An and Bn), one output enable input (OE), and two supply pins (VCCA and VCC(B)). VCC(A) can be supplied at any voltage between 1.2 V and 3.6 V, and VCC(B) can be supplied at any voltage between 1.65 V and 5.5 V, making the device suitable for translating between any of the low voltage nodes (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V). Pins An and OE are referenced to VCC(A), and pins Bn are referenced to VCC(B). A LOW level at pin OE causes the outputs to assume a high-impedance OFF-state. This device is fully specified for partial power-down applications using loFF. The loFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
Features
Wide supply voltage range:
VCC(A): 1.2 V to 3.6 V
VCC(B): 1.65 V to 5.5 V
loFF circuitry provides partial Power-down mode operation
Inputs accept voltages up to 5.5 V
ESD protection:
HBM JESD22-A114E Class 2 exceeds 2500 V for A port
HBM JESD22-A114E Class 3B exceeds 15000 V for B port
MM JESD22-A115-A exceeds 200 V
CDM JESD22-C101E exceeds 1500 V (For NTB0104UK 1000 V)
Latch-up performance exceeds 100 mA per JESD 78B Class II
Multiple package options
Specified from -40 °C to 85 °C and -40 °C to 125 °C
Applications
Voltage level translation between different voltage domains
Bidirectional data transfer between devices with different voltage levels
Partial power-down applications