STMicroelectronics PSD813F1A-90MI

Mfr.Part #:

PSD813F1A-90MI

Manufacturer:

Description:
IC FLASH 1MBIT 90NS 52QFP

RoHS Status:

RoHS

Datasheet:

Payment:

Payment

Delivery:

Delivery

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Specifications

Product Details

Product Comparison

Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

52-QFP
Surface Mount
YES
Number of Pins

Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

52
Packaging
Tray
JESD-609 Code
e4
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Obsolete
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

1 (Unlimited)
Number of Terminations
52
ECCN Code
EAR99
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Applications
8-Bit MCU Peripherals
HTS Code
8542.39.00.01
Subcategory
Other Microprocessor ICs
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

CMOS
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

5V
Terminal Pitch
0.65mm
Frequency

Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

90GHz
Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
PSD813F
Pin Count
52
Qualification Status
Not Qualified
Operating Supply Voltage
5.5V
Power Supplies
5V
Temperature Grade
INDUSTRIAL
Interface

In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

Parallel
Memory Size
976.6kB
Number of I/O
27
Number of Ports

Number of Ports refers to the number of electrical connections or terminals available on an electronic component. It indicates the number of external devices or signals that can be connected to the component. For example, a transistor may have three ports (emitter, base, and collector), while a resistor has two ports (terminals). The number of ports determines the functionality and connectivity options of the component within a circuit.

4
Memory Type

Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

FLASH
Access Time

Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.

90 ns
Standby Current-Max
0.0002A
Number of Gates
3000
Number of Macro Cells
24
UV Erasable
N
ROM Size (bits)
1310720Bits
Height Seated (Max)
2.35mm
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

10mm
Width
10mm
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Description
The ST.PSD813F1Flash is an In-System Programmable (ISP) peripheral for 8-bit MCUs, featuring:
Dual bank flash memories:
1 Mbit primary flash memory (8 uniform sectors)
256 Kbit secondary EEPROM (4 uniform sectors)
Concurrent operation: read from one memory while erasing and writing the other
16 Kbit SRAM (battery-backed)
PLD with macrocells:
Over 3,000 gates of PLD: DPLD and CPLD
DPLD: User-defined internal chip-select decoding
CPLD with 16 output macrocells (OMCs) and 24 input macrocells (IMCs)
27 reconfigurable I/Os:
Individually configurable I/O port pins for MCU I/Os, PLD I/Os, latched MCU address output, and special function I/Os
16 I/O ports can be configured as open-drain outputs
Enhanced JTAG serial port:
Built-in JTAG-compliant serial port for full-chip In-System Programmability (ISP)
Efficient manufacturing for easy product testing and programming
Page register:
Internal page register to expand the microcontroller address space by a factor of 256
Programmable power management

Features
High endurance:
100,000 erase/write cycles of flash memory
10,000 erase/write cycles of EEPROM
1,000 erase/write cycles of PLD
Data retention: 15-year minimum at 90°C (for main flash, boot, PLD, and configuration bits)
Single supply voltage: 5V ± 10%
Standby current as low as 50 µA

Applications
Industrial control
Automotive electronics
Consumer electronics
Medical devices
Telecommunications
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Packaging
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Max Operating Temperature
    Min Operating Temperature
    Applications
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    Qualification Status
    Operating Supply Voltage
    Power Supplies
    Temperature Grade
    Interface
    Memory Size
    Number of I/O
    Number of Ports
    Memory Type
    Access Time
    Standby Current-Max
    Number of Gates
    Number of Macro Cells
    UV Erasable
    ROM Size (bits)
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Lead Free
    Mount
    View Compare
  • PSD813F1A-90MI
    PSD813F1A-90MI
    Surface Mount
    52-QFP
    YES
    52
    Tray
    e4
    Obsolete
    1 (Unlimited)
    52
    EAR99
    Nickel/Palladium/Gold (Ni/Pd/Au)
    85°C
    -40°C
    8-Bit MCU Peripherals
    8542.39.00.01
    Other Microprocessor ICs
    CMOS
    QUAD
    GULL WING
    260
    5V
    0.65mm
    90GHz
    NOT SPECIFIED
    PSD813F
    52
    Not Qualified
    5.5V
    5V
    INDUSTRIAL
    Parallel
    976.6kB
    27
    4
    FLASH
    90 ns
    0.0002A
    3000
    24
    N
    1310720Bits
    2.35mm
    10mm
    10mm
    ROHS3 Compliant
    Lead Free
    -
    -
  • PSD4235G2V-12UI
    Surface Mount
    80-LQFP
    YES
    80
    Tray
    e3/e4
    Obsolete
    3 (168 Hours)
    80
    EAR99
    TIN/NICKEL PALLADIUM GOLD
    85°C
    -40°C
    16-Bit MCU Peripherals
    8542.39.00.01
    Other Microprocessor ICs
    CMOS
    QUAD
    GULL WING
    NOT SPECIFIED
    3.3V
    0.5mm
    120GHz
    NOT SPECIFIED
    PSD4235
    80
    Not Qualified
    3.6V
    3.3V
    INDUSTRIAL
    Parallel
    3.8MB
    52
    7
    FLASH
    120 ns
    -
    3000
    24
    -
    -
    1.2mm
    12mm
    12mm
    ROHS3 Compliant
    -
    -
  • PSD813F2VA-15U
    Surface Mount
    64-LQFP
    -
    64
    Tray
    -
    Obsolete
    1 (Unlimited)
    64
    EAR99
    -
    70°C
    0°C
    8-Bit MCU Peripherals
    8542.39.00.01
    Other uPs/uCs/Peripheral ICs
    CMOS
    QUAD
    GULL WING
    -
    3.3V
    0.8mm
    150GHz
    -
    PSD813F
    64
    Not Qualified
    3.6V
    3.3V
    COMMERCIAL
    Parallel
    976.6kB
    27
    4
    FLASH
    150 ns
    0.0001A
    3000
    24
    N
    1310720Bits
    1.54mm
    14mm
    14mm
    ROHS3 Compliant
    -
    Surface Mount

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