Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
TO-236-3, SC-59, SOT-23-3
Diode Element Material
SILICON
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-65°C~150°C
Packaging
Tape & Reel (TR)
Tolerance
Tolerance in electronic components refers to the allowable deviation from the specified value. It indicates the range within which the actual value of the component can vary while still meeting the manufacturer's specifications. Tolerance is typically expressed as a percentage of the nominal value, such as ±5% or ±10%. A lower tolerance indicates a tighter range of acceptable values, resulting in more precise and consistent performance.
±5%
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
1 (Unlimited)
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
ZENER
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Qualification Status
Not Qualified
Polarity
Polarity refers to the direction of current flow through an electronic component. It is typically indicated by a plus (+) or minus (-) sign on the component's body. Components with polarity must be connected correctly in a circuit to function properly. For example, a diode will only allow current to flow in one direction, from the positive terminal to the negative terminal. If a diode is connected backwards, it will not conduct current.
UNIDIRECTIONAL
Power Dissipation-Max
0.3W
Diode Type
Diode Type refers to the specific type of diode used in an electronic circuit. Diodes are semiconductor devices that allow current to flow in only one direction. Different types of diodes have different characteristics and applications.
ZENER DIODE
Current - Reverse Leakage @ Vr
2μA @ 2.5V
Voltage - Forward (Vf) (Max) @ If
1.1V @ 100mA
Voltage - Zener (Nom) (Vz)
5.6V
Voltage Temp Coeff-Max
1.2mV/°C
RoHS Status
ROHS3 Compliant
PZM5.6NB,115 Overview
A reverse leakage current of 2μA @ 2.5V is required to supply this electrical device.Voltage (Tol) is limited to 5.43%.Zener (Nom)'s maximum voltage is reduced to zero during operation.To operate this device, set the working test voltage to 5mA.Once the voltage reaches maximum (Temp Coeff), diode reaches 1.2mV/°C.1.1V @ 100mA is reached when the maximum voltage - Forward (Vf) is supplied for its operation.
PZM5.6NB,115 Features
reverse leakage current of 2μA @ 2.5V
2μA @ 2.5V is the maximum voltage (Tol)
the working test voltage to 5mA
minimal dynamic impedance is 5mA
PZM5.6NB,115 Applications
There are a lot of NXP USA Inc.
PZM5.6NB,115 applications of zener single diodes.
PZM5.6NB,115 More Descriptions
5.6 V 0.3 W SILICON UNIDIRECTIONAL VOLTAGE REGULATOR DIODE TO-236
DIODE ZENER 5.6V 300MW SMT3