Renesas Electronics America R5F56316DDFC#V0

Mfr.Part #:

R5F56316DDFC#V0
Description:
IC MCU 32BIT 256KB FLASH 176QFP

RoHS Status:

RoHS

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Total Price: $24.68

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Specifications

Product Details

Product Comparison

Factory Lead Time
20 Weeks
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

176-LQFP
Surface Mount
YES
Number of Pins

Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

176
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-40°C~85°C TA
Packaging
Tray
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

RX600
Published
2014
Pbfree Code
yes
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Active
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

3 (168 Hours)
Number of Terminations
176
Terminal Position
QUAD
Terminal Form
GULL WING
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

3V
Terminal Pitch
0.5mm
Frequency

Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

100MHz
Pin Count
176
Supply Voltage-Max (Vsup)
3.6V
Supply Voltage-Min (Vsup)
2.7V
Interface

In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

CAN, EBI/EMI, I2C, LIN, SCI, SPI, USB
Memory Size
256kB
Oscillator Type
Internal
Number of I/O
133
RAM Size
128K x 8
Voltage - Supply (Vcc/Vdd)
2.7V~3.6V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Core Processor

Core Processor refers to the central processing unit (CPU) of an electronic device. It is the brain of the device, responsible for executing instructions, processing data, and managing the overall operation of the system. The core processor's speed, number of cores, and architecture determine the device's performance and capabilities.

RX
Peripherals
DMA, LVD, POR, PWM, WDT
Program Memory Type
FLASH
Core Size

Core Size refers to the physical dimensions of the magnetic core used in an electronic component, such as an inductor or transformer. It is typically expressed in terms of its length, width, and height, or as a diameter and height for cylindrical cores. The core size determines the inductance, current-carrying capacity, and other electrical characteristics of the component. Larger core sizes generally result in higher inductance and current-handling capabilities.

32-Bit
Program Memory Size
256KB 256K x 8
Connectivity

Connectivity refers to the number of terminals or pins on an electronic component that allow it to connect to other components in a circuit. It determines the component's ability to interact and exchange signals with other elements in the system. Higher connectivity indicates more connection points, enabling the component to perform complex functions and integrate with various circuits.

CANbus, EBI/EMI, I2C, LINbus, SCI, SPI, USB
Bit Size
32
Data Converter
A/D 8x10b, 21x12b; D/A 2x10b
Has ADC
YES
DMA Channels
YES
PWM Channels
YES
Address Bus Width
24
EEPROM Size
32K x 8
External Data Bus Width
32
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

24mm
Width
24mm
RoHS Status
ROHS3 Compliant
Description
The RENESAS RX63N Group and RX631 Group are 32-bit microcontrollers (MCUs) with a 100-MHz operating frequency and an on-chip floating-point unit (FPU). They offer up to 165 DMIPS performance, up to 2 MB of flash memory, and various communication interfaces, including Ethernet MAC, full-speed USB 2.0 host/function/OTG interface, CAN, 10- and 12-bit A/D converters, and RTC.

Features
32-bit RX CPU core with 100 MHz operating frequency
165 DMIPS performance
Single-precision 32-bit IEEE-754 floating point
Multiply-and-accumulation units
32-bit multiplier and divider
Foot interrupt
CISC Harvard architecture with 5-stage pipeline
Variable-length instructions
Memory protection unit (MPU)
ITAG and FINE debugging interface
Low-power design and architecture
Operation from a single 2.7- to 3.6-V supply
Low power consumption
RTC with dedicated power supply
Four low-power modes
On-chip main flash memory with no wait states
ROM-less versions and versions with up to 2 Mbytes of ROM
On-chip data flash memory
On-chip SRAM with no wait states
DMA and DTC
Reset and supply management
Clock functions
Real-time clock
Independent watchdog timer
Useful functions for IEC60730 compliance
Various communication interfaces
Up to 20 extended-function timers
A/D converter for 1-MHz operation
10-bit D/A converter
Temperature sensor
DEUAES encryption and decryption functions
Up to 134 pins for general I/O ports
Unique ID
Operating temperature range: -40 to 85°C (D version), -40 to 105°C (G version)

Applications
Industrial automation
Medical devices
Consumer electronics
Automotive systems
Power electronics
Telecommunications
Security systems
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Series
    Published
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Position
    Terminal Form
    Supply Voltage
    Terminal Pitch
    Frequency
    Pin Count
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Interface
    Memory Size
    Oscillator Type
    Number of I/O
    RAM Size
    Voltage - Supply (Vcc/Vdd)
    uPs/uCs/Peripheral ICs Type
    Core Processor
    Peripherals
    Program Memory Type
    Core Size
    Program Memory Size
    Connectivity
    Bit Size
    Data Converter
    Has ADC
    DMA Channels
    PWM Channels
    Address Bus Width
    EEPROM Size
    External Data Bus Width
    Length
    Width
    RoHS Status
    Speed
    Clock Frequency
    Reach Compliance Code
    View Compare
  • R5F56316DDFC#V0
    R5F56316DDFC#V0
    20 Weeks
    Surface Mount
    176-LQFP
    YES
    176
    -40°C~85°C TA
    Tray
    RX600
    2014
    yes
    Active
    3 (168 Hours)
    176
    QUAD
    GULL WING
    3V
    0.5mm
    100MHz
    176
    3.6V
    2.7V
    CAN, EBI/EMI, I2C, LIN, SCI, SPI, USB
    256kB
    Internal
    133
    128K x 8
    2.7V~3.6V
    MICROCONTROLLER
    RX
    DMA, LVD, POR, PWM, WDT
    FLASH
    32-Bit
    256KB 256K x 8
    CANbus, EBI/EMI, I2C, LINbus, SCI, SPI, USB
    32
    A/D 8x10b, 21x12b; D/A 2x10b
    YES
    YES
    YES
    24
    32K x 8
    32
    24mm
    24mm
    ROHS3 Compliant
    -
    -
    -
    -
  • R5F100AGASP#30
    20 Weeks
    Surface Mount
    30-LSSOP (0.240, 6.10mm Width)
    YES
    -
    -40°C~85°C TA
    Tray
    RL78/G13
    -
    yes
    Active
    3 (168 Hours)
    30
    DUAL
    GULL WING
    3V
    0.65mm
    -
    30
    5.5V
    2.7V
    -
    -
    Internal
    21
    12K x 8
    1.6V~5.5V
    MICROCONTROLLER
    RL78
    DMA, LVD, POR, PWM, WDT
    FLASH
    16-Bit
    128KB 128K x 8
    CSI, I2C, LINbus, UART/USART
    16
    A/D 8x8/10b
    YES
    YES
    YES
    -
    8K x 8
    -
    9.85mm
    6.1mm
    ROHS3 Compliant
    32MHz
    20MHz
    -
  • R5F100AEGSP#50
    20 Weeks
    Surface Mount
    30-LSSOP (0.240, 6.10mm Width)
    YES
    -
    -40°C~105°C TA
    Tape & Reel (TR)
    RL78/G13
    -
    yes
    Active
    3 (168 Hours)
    30
    DUAL
    GULL WING
    3V
    0.65mm
    -
    30
    5.5V
    2.7V
    -
    -
    Internal
    21
    4K x 8
    2.4V~5.5V
    MICROCONTROLLER
    RL78
    DMA, LVD, POR, PWM, WDT
    FLASH
    16-Bit
    64KB 64K x 8
    CSI, I2C, LINbus, UART/USART
    16
    A/D 8x8/10b
    YES
    YES
    YES
    -
    4K x 8
    -
    9.85mm
    6.1mm
    RoHS Compliant
    32MHz
    20MHz
    compliant

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