Factory Lead Time
24 Weeks
Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include:
* Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side.
* Surface-mount: Component is placed on the surface of the PCB and soldered in place.
* Press-fit: Component is pressed into place on the PCB without soldering.
* Socket: Component is inserted into a socket on the PCB, allowing for easy replacement.
The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
176-LQFP
Number of Pins
Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.
176
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
-40°C~85°C TA
Series
Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.
RX600
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
3 (168 Hours)
Number of Terminations
176
Subcategory
Microcontrollers
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
CMOS
Supply Voltage
Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.
3.3V
Frequency
Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.
120MHz
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
3.6V
Supply Voltage-Min (Vsup)
2.7V
Interface
In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them.
An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.
CAN, EBI/EMI, Ethernet, I2C, LIN, MMC, SCI, SD, SPI, UART, USART, USB
Voltage - Supply (Vcc/Vdd)
2.7V~3.6V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
Core Processor
Core Processor refers to the central processing unit (CPU) of an electronic device. It is the brain of the device, responsible for executing instructions, processing data, and managing the overall operation of the system. The core processor's speed, number of cores, and architecture determine the device's performance and capabilities.
RXv2
Peripherals
DMA, LVD, POR, PWM, WDT
Program Memory Type
FLASH
Core Size
Core Size refers to the physical dimensions of the magnetic core used in an electronic component, such as an inductor or transformer. It is typically expressed in terms of its length, width, and height, or as a diameter and height for cylindrical cores. The core size determines the inductance, current-carrying capacity, and other electrical characteristics of the component. Larger core sizes generally result in higher inductance and current-handling capabilities.
32-Bit
Program Memory Size
2.5MB 2.5M x 8
Connectivity
Connectivity refers to the number of terminals or pins on an electronic component that allow it to connect to other components in a circuit. It determines the component's ability to interact and exchange signals with other elements in the system. Higher connectivity indicates more connection points, enabling the component to perform complex functions and integrate with various circuits.
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Data Converter
A/D 29x12b; D/A 2x12b
External Data Bus Width
32
Length
Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.
24mm
RoHS Status
ROHS3 Compliant
Description
The Renesas RX64M Group is a family of 120-MHz 32-bit RX MCUs with an on-chip FPU, 240 DMIPS, up to 4-MB flash memory, 512-KB SRAM, various communications interfaces, 12-bit A/D converter, RTC, encryption (optional), serial interface for audio, and CMOS camera interface.
Features
32-bit RXv2 CPU core with a maximum operating frequency of 120 MHz
Capable of 240 DMIPS in operation at 120 MHz
Single precision 32-bit IEEE-754 floating point
Two types of multiply-and-accumulation unit (between memories)
32-bit multiplier (fastest instruction execution takes one CPU clock cycle)
Divider (fastest instruction execution takes two CPU clock cycles)
Fast interrupt
CISC Harvard architecture with 5-stage pipeline
Variable-length instructions: Ultra-compact code
Supports the memory protection unit (MPU)
ITAG and FINE (one-line) debugging interfaces
Low-power design and architecture
Single voltage supply: 2.7 to 3.6 V
Low power consumption: A product that supports all peripheral functions draws only 0.3mA/MHz (Typ).
RTC is capable of operation from a dedicated power supply.
Four low-power modes
On-chip code flash memory, no wait states
Up to 4 Mbyte
120-MHz operation. 8.3-ns read cycle (no wait states)
User code is programmable by on-board or off-board programming.
Background programming/erasing (BGO: Background operation)
On-chip data flash memory
64 Kbytes, reprogrammable up to 100,000 times
Background programming/erasing (BGO: Background operation)
On-chip SRAM
512 Kbytes of SRAM (no wait states)
32 Kbytes of RAM with ECC (one wait state, single-error correction and double error detection)
8 Kbytes of standby RAM (backup on deep software standby)
Data transfer
DMAC: 8 channels. DTC
EXDMAC: 2 channels
DMAC for the Ethernet controller: 3 channels for 176- and 177-pin products: 2 channels for 100-, 144, and 145-pin products
Reset and supply management
Power-on reset (POR)
Low voltage detection (LVD) with voltage settings
Clock functions
External crystal resonator or internal PLL for operation at 8 to 24 MHz
Internal 240-kHz LOCO and HOCO selectable from 16, 18, and 20 MHz
120-kHz clock for the IWDTa
Real-time clock
Adjustment functions (30 seconds, leap year, and error)
Real-time clock counting and binary counting modes are selectable
Time capture function (for capturing times in response to event-signal input)
Independent watchdog timer
120 kHz (1/2 LOCO frequency) clock operation
Useful functions for IEC60730 compliance
Oscillation-stoppage detection, frequency measurement, CRC, IWDTa, self-diagnostic function for the A/D converter, etc.
Register write protection function can protect values in important registers against overwriting.
Various communications interfaces
IEEE 1588-compliant Ethernet MAC (for 176- and 177-pin products: 2 modules)
PHY layer for host/function or OTG controller (1) with full-speed USB 2.0 with battery charging transfer (only for 176- and 177-pia products)
PHY layer (1) for host/function or OTG controller (1) with full-speed USB 2.0 transfer
CAN (compliant with ISO11898-1), incorporating 32 mailboxes (up to 3 modules)
SCIg and SCI with multiple functionalities (up to 9)
Choose from among asynchronous mode, clock-synchronous mode. smart-card interface mode, simplified SPI, simplified I²C, and extended serial mode.
SCIFA with 16-byte transmission and reception FIFOs (up to 4 interfaces)
FC bus interface for transfer at up to 1 Mbps (up to 2 interfaces)
Four-wire QSPI (1 interface) in addition to RSPla (1 interface)
Parallel data capture unit (PDC) for the CMOS camera interface (not in 100-pin products)
SD host interface (optional: I interface) with a 1- or 4-bit SD bas for use with SD memory or SDIO
External address space
Buses for full-speed data transfer (max. operating frequency of 60 MHz). 8CS areas
8-, 16-, or 32-bit bus space is selectable per area
Independent SDRAM area (128 Mbytes)
Up to 29 extended-function timers
16-bit TPUa, MTU3a, and GPTA input capture, output compare, PWM waveform output
8-bit TMRa (4 channels), 16-bit CMT (4 channels), 32-bit CMTW (2 channels)
12-bit A/D converter
Two 12-bit units (8 channels for unit 0, 21 channels for unit 1)
Self diagnosis
Detection of analog input disconnection
12-bit D/A converter: 2 channels
On-chip operational amplifier output or direct input selectable
Temperature sensor for measuring temperature within the chip
Encryption (optional)
AES (key lengths: 128, 192, and 256 bits)
DES (key lengths: 56 hits (DES); 3 x 56 bits (T-DES))
SHA (SHA-1 (128), SHA-2 (224 or 256), HMAC (160), 224, or 256))
Up to 127 pins for general I/O ports
3-V tolerance, open drain, input pull-up, switchable driving ability
Operating temp. range
D-version -40°C to 85°C
G-version: -40°C to 105°C
Applications
Industrial automation
Medical devices
Automotive electronics
Consumer electronics
IoT devices
-
Image
Part Number
Manufacturer
Factory Lead Time
Mounting Type
Package / Case
Surface Mount
Number of Pins
Operating Temperature
Packaging
Series
Pbfree Code
Part Status
Moisture Sensitivity Level (MSL)
Number of Terminations
Subcategory
Technology
Terminal Position
Terminal Form
Supply Voltage
Terminal Pitch
Frequency
Pin Count
Qualification Status
Supply Voltage-Max (Vsup)
Power Supplies
Supply Voltage-Min (Vsup)
Interface
Memory Size
Oscillator Type
Number of I/O
RAM Size
Voltage - Supply (Vcc/Vdd)
uPs/uCs/Peripheral ICs Type
Core Processor
Peripherals
Program Memory Type
Core Size
Program Memory Size
Connectivity
Supply Current-Max
Bit Size
Data Converter
Has ADC
DMA Channels
PWM Channels
Address Bus Width
ROM (words)
EEPROM Size
CPU Family
External Data Bus Width
RAM (bytes)
Length
Width
RoHS Status
Published
Additional Feature
Peak Reflow Temperature (Cel)
Time@Peak Reflow Temperature-Max (s)
Base Part Number
Watchdog Timer
DAC Channels
Number of Timers/Counters
On Chip Program ROM Width
Height Seated (Max)
Lead Free
Speed
Clock Frequency
View Compare
-
R5F564MGDDFC#V1
24 Weeks
Surface Mount
176-LQFP
YES
176
-40°C~85°C TA
Tray
RX600
yes
Obsolete
3 (168 Hours)
176
Microcontrollers
CMOS
QUAD
GULL WING
3.3V
0.5mm
120MHz
176
Not Qualified
3.6V
3/3.3V
2.7V
CAN, EBI/EMI, Ethernet, I2C, LIN, MMC, SCI, SD, SPI, UART, USART, USB
2.5MB
Internal
127
552K x 8
2.7V~3.6V
MICROCONTROLLER, RISC
RXv2
DMA, LVD, POR, PWM, WDT
FLASH
32-Bit
2.5MB 2.5M x 8
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
110mA
32
A/D 29x12b; D/A 2x12b
YES
YES
YES
24
2621440
64K x 8
RX
32
524288
24mm
24mm
ROHS3 Compliant
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
24 Weeks
Surface Mount
30-LSSOP (0.240, 6.10mm Width)
YES
30
-40°C~85°C TA
Tray
RL78/G13
yes
Obsolete
3 (168 Hours)
30
-
CMOS
DUAL
GULL WING
3V
0.65mm
32MHz
30
-
5.5V
-
-
I2C, LIN, UART, USART
96kB
Internal
21
8K x 8
1.6V~5.5V
MICROCONTROLLER
RL78
DMA, LVD, POR, PWM, WDT
FLASH
16-Bit
96KB 96K x 8
CSI, I2C, LINbus, UART/USART
-
16
A/D 8x8/10b
YES
YES
YES
-
-
8K x 8
-
-
-
9.85mm
6.1mm
ROHS3 Compliant
2011
IT ALSO OPERATES AT 4MHZ @1.6V MIN SUPPLY @ LOW-VOLTAGE MAIN MODE
NOT SPECIFIED
NOT SPECIFIED
R5F100
Yes
NO
2
8
1.4mm
Lead Free
-
-
-
20 Weeks
Surface Mount
30-LSSOP (0.240, 6.10mm Width)
YES
-
-40°C~105°C TA
Tray
RL78/G13
yes
Active
3 (168 Hours)
30
-
-
DUAL
GULL WING
3V
0.65mm
-
30
-
5.5V
-
2.7V
-
-
Internal
21
8K x 8
2.4V~5.5V
MICROCONTROLLER
RL78
DMA, LVD, POR, PWM, WDT
FLASH
16-Bit
96KB 96K x 8
CSI, I2C, LINbus, UART/USART
-
16
A/D 8x8/10b
YES
YES
YES
-
-
8K x 8
-
-
-
9.85mm
6.1mm
ROHS3 Compliant
-
-
-
-
-
-
-
-
-
-
-
32MHz
20MHz