Renesas Electronics America R5F564MGDDFC#V1

Mfr.Part #:

R5F564MGDDFC#V1
Description:
IC MCU 32BIT 2.5MB FLASH 176QFP

RoHS Status:

RoHS

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Payment

Delivery:

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ISO 9001
ISO 9001
ISO 45001
ISO 45001
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ISO 13485
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ISO 14001
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Specifications

Product Details

Product Comparison

Factory Lead Time
24 Weeks
Mounting Type

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Surface Mount
Package / Case

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

176-LQFP
Surface Mount
YES
Number of Pins

Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

176
Operating Temperature

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

-40°C~85°C TA
Packaging
Tray
Series

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

RX600
Pbfree Code
yes
Part Status

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Obsolete
Moisture Sensitivity Level (MSL)

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

3 (168 Hours)
Number of Terminations
176
Subcategory
Microcontrollers
Technology

Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

CMOS
Terminal Position
QUAD
Terminal Form
GULL WING
Supply Voltage

Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

3.3V
Terminal Pitch
0.5mm
Frequency

Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

120MHz
Pin Count
176
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
3/3.3V
Supply Voltage-Min (Vsup)
2.7V
Interface

In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

CAN, EBI/EMI, Ethernet, I2C, LIN, MMC, SCI, SD, SPI, UART, USART, USB
Memory Size
2.5MB
Oscillator Type
Internal
Number of I/O
127
RAM Size
552K x 8
Voltage - Supply (Vcc/Vdd)
2.7V~3.6V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
Core Processor

Core Processor refers to the central processing unit (CPU) of an electronic device. It is the brain of the device, responsible for executing instructions, processing data, and managing the overall operation of the system. The core processor's speed, number of cores, and architecture determine the device's performance and capabilities.

RXv2
Peripherals
DMA, LVD, POR, PWM, WDT
Program Memory Type
FLASH
Core Size

Core Size refers to the physical dimensions of the magnetic core used in an electronic component, such as an inductor or transformer. It is typically expressed in terms of its length, width, and height, or as a diameter and height for cylindrical cores. The core size determines the inductance, current-carrying capacity, and other electrical characteristics of the component. Larger core sizes generally result in higher inductance and current-handling capabilities.

32-Bit
Program Memory Size
2.5MB 2.5M x 8
Connectivity

Connectivity refers to the number of terminals or pins on an electronic component that allow it to connect to other components in a circuit. It determines the component's ability to interact and exchange signals with other elements in the system. Higher connectivity indicates more connection points, enabling the component to perform complex functions and integrate with various circuits.

CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Supply Current-Max
110mA
Bit Size
32
Data Converter
A/D 29x12b; D/A 2x12b
Has ADC
YES
DMA Channels
YES
PWM Channels
YES
Address Bus Width
24
ROM (words)
2621440
EEPROM Size
64K x 8
CPU Family
RX
External Data Bus Width
32
RAM (bytes)
524288
Length

Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

24mm
Width
24mm
RoHS Status
ROHS3 Compliant
Description
The Renesas RX64M Group is a family of 120-MHz 32-bit RX MCUs with an on-chip FPU, 240 DMIPS, up to 4-MB flash memory, 512-KB SRAM, various communications interfaces, 12-bit A/D converter, RTC, encryption (optional), serial interface for audio, and CMOS camera interface.

Features
32-bit RXv2 CPU core with a maximum operating frequency of 120 MHz
Capable of 240 DMIPS in operation at 120 MHz
Single precision 32-bit IEEE-754 floating point
Two types of multiply-and-accumulation unit (between memories)
32-bit multiplier (fastest instruction execution takes one CPU clock cycle)
Divider (fastest instruction execution takes two CPU clock cycles)
Fast interrupt
CISC Harvard architecture with 5-stage pipeline
Variable-length instructions: Ultra-compact code
Supports the memory protection unit (MPU)
ITAG and FINE (one-line) debugging interfaces
Low-power design and architecture
Single voltage supply: 2.7 to 3.6 V
Low power consumption: A product that supports all peripheral functions draws only 0.3mA/MHz (Typ).
RTC is capable of operation from a dedicated power supply.
Four low-power modes
On-chip code flash memory, no wait states
Up to 4 Mbyte
120-MHz operation. 8.3-ns read cycle (no wait states)
User code is programmable by on-board or off-board programming.
Background programming/erasing (BGO: Background operation)
On-chip data flash memory
64 Kbytes, reprogrammable up to 100,000 times
Background programming/erasing (BGO: Background operation)
On-chip SRAM
512 Kbytes of SRAM (no wait states)
32 Kbytes of RAM with ECC (one wait state, single-error correction and double error detection)
8 Kbytes of standby RAM (backup on deep software standby)
Data transfer
DMAC: 8 channels. DTC
EXDMAC: 2 channels
DMAC for the Ethernet controller: 3 channels for 176- and 177-pin products: 2 channels for 100-, 144, and 145-pin products
Reset and supply management
Power-on reset (POR)
Low voltage detection (LVD) with voltage settings
Clock functions
External crystal resonator or internal PLL for operation at 8 to 24 MHz
Internal 240-kHz LOCO and HOCO selectable from 16, 18, and 20 MHz
120-kHz clock for the IWDTa
Real-time clock
Adjustment functions (30 seconds, leap year, and error)
Real-time clock counting and binary counting modes are selectable
Time capture function (for capturing times in response to event-signal input)
Independent watchdog timer
120 kHz (1/2 LOCO frequency) clock operation
Useful functions for IEC60730 compliance
Oscillation-stoppage detection, frequency measurement, CRC, IWDTa, self-diagnostic function for the A/D converter, etc.
Register write protection function can protect values in important registers against overwriting.
Various communications interfaces
IEEE 1588-compliant Ethernet MAC (for 176- and 177-pin products: 2 modules)
PHY layer for host/function or OTG controller (1) with full-speed USB 2.0 with battery charging transfer (only for 176- and 177-pia products)
PHY layer (1) for host/function or OTG controller (1) with full-speed USB 2.0 transfer
CAN (compliant with ISO11898-1), incorporating 32 mailboxes (up to 3 modules)
SCIg and SCI with multiple functionalities (up to 9)
Choose from among asynchronous mode, clock-synchronous mode. smart-card interface mode, simplified SPI, simplified I²C, and extended serial mode.
SCIFA with 16-byte transmission and reception FIFOs (up to 4 interfaces)
FC bus interface for transfer at up to 1 Mbps (up to 2 interfaces)
Four-wire QSPI (1 interface) in addition to RSPla (1 interface)
Parallel data capture unit (PDC) for the CMOS camera interface (not in 100-pin products)
SD host interface (optional: I interface) with a 1- or 4-bit SD bas for use with SD memory or SDIO
External address space
Buses for full-speed data transfer (max. operating frequency of 60 MHz). 8CS areas
8-, 16-, or 32-bit bus space is selectable per area
Independent SDRAM area (128 Mbytes)
Up to 29 extended-function timers
16-bit TPUa, MTU3a, and GPTA input capture, output compare, PWM waveform output
8-bit TMRa (4 channels), 16-bit CMT (4 channels), 32-bit CMTW (2 channels)
12-bit A/D converter
Two 12-bit units (8 channels for unit 0, 21 channels for unit 1)
Self diagnosis
Detection of analog input disconnection
12-bit D/A converter: 2 channels
On-chip operational amplifier output or direct input selectable
Temperature sensor for measuring temperature within the chip
Encryption (optional)
AES (key lengths: 128, 192, and 256 bits)
DES (key lengths: 56 hits (DES); 3 x 56 bits (T-DES))
SHA (SHA-1 (128), SHA-2 (224 or 256), HMAC (160), 224, or 256))
Up to 127 pins for general I/O ports
3-V tolerance, open drain, input pull-up, switchable driving ability
Operating temp. range
D-version -40°C to 85°C
G-version: -40°C to 105°C

Applications
Industrial automation
Medical devices
Automotive electronics
Consumer electronics
IoT devices
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Series
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Supply Voltage
    Terminal Pitch
    Frequency
    Pin Count
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Interface
    Memory Size
    Oscillator Type
    Number of I/O
    RAM Size
    Voltage - Supply (Vcc/Vdd)
    uPs/uCs/Peripheral ICs Type
    Core Processor
    Peripherals
    Program Memory Type
    Core Size
    Program Memory Size
    Connectivity
    Supply Current-Max
    Bit Size
    Data Converter
    Has ADC
    DMA Channels
    PWM Channels
    Address Bus Width
    ROM (words)
    EEPROM Size
    CPU Family
    External Data Bus Width
    RAM (bytes)
    Length
    Width
    RoHS Status
    Published
    Additional Feature
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    Base Part Number
    Watchdog Timer
    DAC Channels
    Number of Timers/Counters
    On Chip Program ROM Width
    Height Seated (Max)
    Lead Free
    Speed
    Clock Frequency
    View Compare
  • R5F564MGDDFC#V1
    R5F564MGDDFC#V1
    24 Weeks
    Surface Mount
    176-LQFP
    YES
    176
    -40°C~85°C TA
    Tray
    RX600
    yes
    Obsolete
    3 (168 Hours)
    176
    Microcontrollers
    CMOS
    QUAD
    GULL WING
    3.3V
    0.5mm
    120MHz
    176
    Not Qualified
    3.6V
    3/3.3V
    2.7V
    CAN, EBI/EMI, Ethernet, I2C, LIN, MMC, SCI, SD, SPI, UART, USART, USB
    2.5MB
    Internal
    127
    552K x 8
    2.7V~3.6V
    MICROCONTROLLER, RISC
    RXv2
    DMA, LVD, POR, PWM, WDT
    FLASH
    32-Bit
    2.5MB 2.5M x 8
    CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
    110mA
    32
    A/D 29x12b; D/A 2x12b
    YES
    YES
    YES
    24
    2621440
    64K x 8
    RX
    32
    524288
    24mm
    24mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • R5F100AFASP#V0
    24 Weeks
    Surface Mount
    30-LSSOP (0.240, 6.10mm Width)
    YES
    30
    -40°C~85°C TA
    Tray
    RL78/G13
    yes
    Obsolete
    3 (168 Hours)
    30
    -
    CMOS
    DUAL
    GULL WING
    3V
    0.65mm
    32MHz
    30
    -
    5.5V
    -
    -
    I2C, LIN, UART, USART
    96kB
    Internal
    21
    8K x 8
    1.6V~5.5V
    MICROCONTROLLER
    RL78
    DMA, LVD, POR, PWM, WDT
    FLASH
    16-Bit
    96KB 96K x 8
    CSI, I2C, LINbus, UART/USART
    -
    16
    A/D 8x8/10b
    YES
    YES
    YES
    -
    -
    8K x 8
    -
    -
    -
    9.85mm
    6.1mm
    ROHS3 Compliant
    2011
    IT ALSO OPERATES AT 4MHZ @1.6V MIN SUPPLY @ LOW-VOLTAGE MAIN MODE
    NOT SPECIFIED
    NOT SPECIFIED
    R5F100
    Yes
    NO
    2
    8
    1.4mm
    Lead Free
    -
    -
  • R5F100AFGSP#30
    20 Weeks
    Surface Mount
    30-LSSOP (0.240, 6.10mm Width)
    YES
    -
    -40°C~105°C TA
    Tray
    RL78/G13
    yes
    Active
    3 (168 Hours)
    30
    -
    -
    DUAL
    GULL WING
    3V
    0.65mm
    -
    30
    -
    5.5V
    -
    2.7V
    -
    -
    Internal
    21
    8K x 8
    2.4V~5.5V
    MICROCONTROLLER
    RL78
    DMA, LVD, POR, PWM, WDT
    FLASH
    16-Bit
    96KB 96K x 8
    CSI, I2C, LINbus, UART/USART
    -
    16
    A/D 8x8/10b
    YES
    YES
    YES
    -
    -
    8K x 8
    -
    -
    -
    9.85mm
    6.1mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    32MHz
    20MHz

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